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Difference between revisions of "intel/microarchitectures/rocket lake"
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== Release Dates == | == Release Dates == | ||
| − | Rocket Lake is expected to be released in | + | Rocket Lake is expected to be released in Q1 2021. |
== Compatibility== | == Compatibility== | ||
| Line 124: | Line 124: | ||
== Architecture == | == Architecture == | ||
| − | === Key changes from {{\\| | + | === Key changes from {{\\|Comet Lake}}=== |
| − | {{ | + | {{future information}} |
| + | * Core | ||
| + | ** {{\\|Skylake}} '''➡''' {{\\|Willow Cove}} or {{\\|Cypress Cove}} | ||
| + | |||
| + | * GPU | ||
| + | ** {{intel|Gen 9.5|l=arch}} '''➡''' {{intel|Gen12|l=arch}} (Xe) | ||
| + | ** 32 EUs up from 24 EUs | ||
| + | |||
| + | * Display | ||
| + | ** [[DisplayPort]] 1.4a (from DisplayPort 1.2) | ||
| + | ** [[HDMI]] 2.0b (from HDMI 1.4b) | ||
| + | |||
| + | * I/O | ||
| + | ** PCIe 4.0 (from 3.0) | ||
| + | |||
| + | * Memory | ||
| + | ** Faster memory for mainstream desktops (i.e., {{intel|Rocket Lake S|l=core}}) DDR4-3200 (from DDR4-2993) | ||
| + | |||
| + | * Chipset | ||
| + | ** {{intel|Cannon Point|400 Series chipset|l=chipset}} → {{intel|Rocket Point|500 Series chipset|l=chipset}} | ||
| + | *** 2.5G Ethernet (Foxville) support | ||
| + | *** Integrated WiFi 6 AX201 (GiG+) support via {{intel|CNVi}} | ||
| + | |||
| + | * Packaging | ||
| + | ** [[Die thinning]] on top-end SKUs for better heat removal | ||
== See also == | == See also == | ||
| − | |||
Revision as of 09:00, 10 October 2020
| Edit Values | |
| Rocket Lake µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | Intel |
| Manufacturer | Intel |
| Process | 14 nm |
| Core Configs | 4 |
| Pipeline | |
| Type | Superscalar, Superpipeline |
| OoOE | Yes |
| Speculative | Yes |
| Reg Renaming | Yes |
| Stages | 14-19 |
| Decode | 5-way |
| Instructions | |
| ISA | x86-64 |
| Extensions | MOVBE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, POPCNT, AVX, AVX2, AES, PCLMUL, FSGSBASE, RDRND, FMA3, F16C, BMI, BMI2, VT-x, VT-d, TXT, TSX, RDSEED, ADCX, PREFETCHW, CLFLUSHOPT, XSAVE, SGX, MPX |
| Cache | |
| L1I Cache | 48 KiB/core 8-way set associative |
| L1D Cache | 32 KiB/core 8-way set associative |
| L2 Cache | 512 KiB/core 4-way set associative |
| L3 Cache | 2 MiB/core Up to 16-way set associative |
| L4 Cache | 128 MiB/package on Iris Pro GPUs only |
| Succession | |
| Contemporary | |
| Tiger Lake | |
Rocket Lake (RKL) is a planned microarchitecture designed by Intel as a successor to Comet Lake for desktops and high-performance mobile devices.
Contents
Codenames
| Core | Description | Graphics | Target |
|---|---|---|---|
| Rocket Lake S | Mainstream performance | GT2 | Desktop performance to value, AiOs, and minis |
| Rocket Lake U | Ultra-low power | GT2 | Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room |
Brands
Intel is expected to release Rocket Lake under 3 main brand families:
| Logo | Family | General Description | Differentiating Features | |||||
|---|---|---|---|---|---|---|---|---|
| Cores | HT | AVX | AVX2 | TBT | ECC | |||
| |
Core i3 | Low-end Performance | ||||||
| |
Core i5 | Mid-range Performance | ||||||
| |
Core i7 | High-end Performance | ||||||
Release Dates
Rocket Lake is expected to be released in Q1 2021.
Compatibility
| This section is empty; you can help add the missing info by editing this page. |
Compiler support
| Compiler | Arch-Specific | Arch-Favorable |
|---|---|---|
| ICC | -march=skylake |
-mtune=skylake
|
| GCC | -march=skylake |
-mtune=skylake
|
| LLVM | -march=skylake |
-mtune=skylake
|
| Visual Studio | /arch:AVX2 |
/tune:skylake
|
CPUID
| This section is empty; you can help add the missing info by editing this page. |
Architecture
Key changes from Comet Lake
- Core
- Display
- DisplayPort 1.4a (from DisplayPort 1.2)
- HDMI 2.0b (from HDMI 1.4b)
- I/O
- PCIe 4.0 (from 3.0)
- Memory
- Faster memory for mainstream desktops (i.e., Rocket Lake S) DDR4-3200 (from DDR4-2993)
- Chipset
- 400 Series chipset → 500 Series chipset
- 2.5G Ethernet (Foxville) support
- Integrated WiFi 6 AX201 (GiG+) support via CNVi
- 400 Series chipset → 500 Series chipset
- Packaging
- Die thinning on top-end SKUs for better heat removal
See also
Facts about "Rocket Lake - Microarchitectures - Intel"
| codename | Rocket Lake + |
| core count | 4 + |
| designer | Intel + |
| full page name | intel/microarchitectures/rocket lake + |
| instance of | microarchitecture + |
| instruction set architecture | x86-64 + |
| manufacturer | Intel + |
| microarchitecture type | CPU + |
| name | Rocket Lake + |
| pipeline stages (max) | 19 + |
| pipeline stages (min) | 14 + |
| process | 14 nm (0.014 μm, 1.4e-5 mm) + |