From WikiChip
Difference between revisions of "amd/packages/sp1"
< amd

(Created page with "{{amd title|Package SP1}} {{package |name=SP1 |designer=AMD |market=Server |market 2=Embedded |first announced=January 2014 |first launched=January 2016 |microarch=Cortex-A57...")
 
m (Fixed core link.)
Line 17: Line 17:
 
}}
 
}}
  
−
'''SP1''' was a '''BGA-1021''' package for [[AMD]] server microprocessors codenamed {{\\|Seattle}} with 8 ARM {{armh|Cortex-A57|l=arch}} CPU cores.
+
'''SP1''' was a '''BGA-1021''' package for [[AMD]] server microprocessors codenamed {{amd|Seattle|l=core}} with 8 ARM {{armh|Cortex-A57|l=arch}} CPU cores.
  
  

Revision as of 11:57, 9 September 2020

Edit Values
SP1
General Info
DesignerAMD
IntroductionJanuary 2014 (announced)
January 2016 (launched)
MarketServer, Embedded
MicroarchitectureCortex-A57
TDP32 W
32,000 mW
0.0429 hp
0.032 kW
Package
NameBGA-1021
TypeOrganic Micro Ball Grid Array
Contacts1021
Dimension27 mm
2.7 cm
1.063 in
× 27 mm
2.7 cm
1.063 in
Pitch0.65-? mm
"-?mm" is not declared as a valid unit of measurement for this property.

SP1 was a BGA-1021 package for AMD server microprocessors codenamed Seattle with 8 ARM Cortex-A57 CPU cores.


Features

  • 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate
  • 2 × 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s or
  • 2 × 64/72 bit DDR4 SDRAM interface up to 933 MHz, PC4-14900 (DDR4-1866), 29.9 GB/s
    • Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported
    • Up to 128 GB total with RDIMMs
  • PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
    • 8 lanes configurable 1x8, 2x4, 1x4 + 2x2
  • Integrated Controller Hub
    • 14 × SATA 1.0, 2.0, 3.0 (6 Gb/s)
    • 2 × 10 Gigabit Ethernet
    • 1 GbE system management port
    • SPI, UART, I2C, GPIO

Processors using SP1

  • AMD Opteron A1100 Series
 List of all SP1-based Processors
ModelPriceProcessLaunchedµarchFamilyCoreCTFreqTurboTDP
Count: 0

Package Diagram

BGA-1021 31667 diag.svg

Approximate dimensions of the Seattle package, Part No. 31667. All dimensions in millimeters.

Pin Map

No data available.

References

  • "Product Brief: AMD Opteron™ A1100 SOC Series", PID 158465-B, 2016
  • "Hot Chips 26: The AMD Opteron™ A1100 Processor Codenamed "Seattle"", August 11, 2014
  • "Introducing the AMD Opteron™ A1100 for the Datacenter", January 2016
Retrieved from "https://en.wikichip.org/w/index.php?title=amd/packages/sp1&oldid=97870"
Facts about "Package SP1 - AMD"
RDF feed
designerAMD +
first announcedJanuary 2014 +
first launchedJanuary 2016 +
instance ofpackage +
market segmentServer + and Embedded +
microarchitectureCortex-A57 +
nameSP1 +
packageBGA-1021 +
package contacts1,021 +
package length27 mm (2.7 cm, 1.063 in) +
package typeOrganic Micro Ball Grid Array +
package width27 mm (2.7 cm, 1.063 in) +
tdp32 W (32,000 mW, 0.0429 hp, 0.032 kW) +