-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Difference between revisions of "die size"
(Redirected page to die#Die size) |
(die size) |
||
Line 1: | Line 1: | ||
− | + | {{title|Die Size}} | |
+ | '''Die size''' refers to the physical dimensions of a [[bare die]]. | ||
+ | |||
+ | == Overview == | ||
+ | The die size of a specific chip is the physical dimensions of a [[bare die]]. In other words, the length and width of the integrated circuit. Since the die size and shape determines the total number of [[dies]] that may be realized from a single [[wafer]] of a [[wafer size|certain size]] on a specific [[process node]], the die size is a strong indicator of manufacturing cost. |
Revision as of 10:17, 18 May 2020
Die size refers to the physical dimensions of a bare die.
Overview
The die size of a specific chip is the physical dimensions of a bare die. In other words, the length and width of the integrated circuit. Since the die size and shape determines the total number of dies that may be realized from a single wafer of a certain size on a specific process node, the die size is a strong indicator of manufacturing cost.
Retrieved from "https://en.wikichip.org/w/index.php?title=die_size&oldid=97046"