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Revision as of 02:23, 29 February 2020

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TSARLET µarch
General Info
Arch TypeCPU
DesignerCEA-Leti
ManufacturerSTMicroelectronics
Process28 nm, 65 nm
Core Configs96
Pipeline
TypeScalar, Single-issue
OoOENo
SpeculativeNo
Reg RenamingNo
Stages5
Decode1-way
Instructions
ISAMIPS32v1
Cache
L1I Cache16 KiB/core
L1D Cache16 KiB/core
L2 Cache256 KiB/core
L3 Cache1 MiB/core

TSARLET was a research microarchitecture designed by CEA-Leti demonstarting the theoretical capabilities of a large-scale high-performance 3D stacked chiplets-based SoC technology. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.

Architecture

Memory Hierarchy

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Overview

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Die

Compute chiplet

  • STMicroelectronics 28 nm FDSOI
    • 10 metal layers
  • 4 mm x 5.6 mm (22 mm²) silicon area
  • 395,000,000 transistors
  • I/O
    • 2D
      • 249 signal, 237 power
      • C4 bumps, 200 µm pitch
    • 3D
      • 2618 signal
      • up to metal 10 @ 20 µm pitch


tsarlet compute chiplet.png

Base interposer die

codenameTSARLET +
core count96 +
designerCEA-Leti +
full page namecea-leti/microarchitectures/tsarlet +
instance ofmicroarchitecture +
instruction set architectureMIPS32v1 +
manufacturerSTMicroelectronics +
microarchitecture typeCPU +
nameTSARLET +
pipeline stages5 +
process28 nm (0.028 μm, 2.8e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) +