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Difference between revisions of "metallization stack"
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− | '''Metal interconnect layers''' refers to the series of electrically insulated metallic interconnecting wires that are used to connect together the various devices on an [[integrated circuit]]. | + | '''Metal interconnect layers''' refers to the stacked series of electrically insulated metallic interconnecting wires that are used to connect together the various devices on an [[integrated circuit]]. Adjacent layers are linked together through the use of electrical contacts and [[via]]s. Modern high-end integrated circuits can have as much as 10-20 metal layers in order to ease the task of routing an integrated circuit. |
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Revision as of 00:05, 28 November 2017
Metal interconnect layers refers to the stacked series of electrically insulated metallic interconnecting wires that are used to connect together the various devices on an integrated circuit. Adjacent layers are linked together through the use of electrical contacts and vias. Modern high-end integrated circuits can have as much as 10-20 metal layers in order to ease the task of routing an integrated circuit.
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