From WikiChip
Difference between revisions of "Flip Chip Ball Grid Array"

(→‎μFCBGA)
(→‎BGA CPU Packages)
 
Line 121: Line 121:
 
* [[packages/bga-1288|BGA-1288]] ([[Intel]])
 
* [[packages/bga-1288|BGA-1288]] ([[Intel]])
  
−
* FCBGA-1377 • Ice Lake Y
+
* FCBGA-1377 (26.5 x 18.5 mm) • Ice Lake Y
 
* FCBGA-1392 • Cannon Lake Y
 
* FCBGA-1392 • Cannon Lake Y
 
* FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
 
* FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
Line 133: Line 133:
 
* FCBGA-5903 • Cascade Lake AP
 
* FCBGA-5903 • Cascade Lake AP
  
−
===LGA===
+
====[[Intel]] LGA Packages====
−
 
 
 
* FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
 
* FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
−
:• LGA-1151 • Socket H4
+
:• [[intel/packages/lga-1151|LGA-1151]] • Socket H4
−
 
+
* FCLGA-8 • [[Intel Xeon E7]] (Westmere, Ivy Bridge, Haswell, Broadwell)
 +
:• [[intel/packages/lga-1567|LGA-1567]] • Socket LS
 
* FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
 
* FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
 
:• LGA-1700 • Socket V
 
:• LGA-1700 • Socket V
 +
* FCLGA-2066 (52.5 x 45 mm) • Skylake X, Skylake X Refresh
 +
:• LGA-2066 • Socket R4
 +
* FCLGA-3647 (76.2 x 56.6 mm) • Skylake SP, Cascade Lake SP
 +
:• LGA-3647 • Socket P
 +
* FCLGA-4189 • Ice Lake SP
 +
:• LGA-4189 • Socket P+ (W)
  
 
* FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
 
* FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
 
:• PLGA-2601
 
:• PLGA-2601
−
 
  
 
=== [[Intel]] CPU Packages ===
 
=== [[Intel]] CPU Packages ===
Line 150: Line 155:
 
* FCBGA-441 • BGA-441 • [[Bonnell]]
 
* FCBGA-441 • BGA-441 • [[Bonnell]]
 
* FCBGA-518 • BGA-518 • [[Bonnell]]
 
* FCBGA-518 • BGA-518 • [[Bonnell]]
−
* rPGA-988A (BGA-1288) • [[Westmere]]
+
* rPGA-988A • [[packages/socket-g1|Socket G1]] • [[Westmere]]
 
* rPGA-988B (FCBGA-1023/FCBGA-1224) • [[Socket G2]] • [[Sandy Bridge]]
 
* rPGA-988B (FCBGA-1023/FCBGA-1224) • [[Socket G2]] • [[Sandy Bridge]]
 
* FCBGA-1023 • [[Sandy Bridge]]
 
* FCBGA-1023 • [[Sandy Bridge]]
 
* FCBGA-1090 • [[Goldmont Plus]]
 
* FCBGA-1090 • [[Goldmont Plus]]
−
* FCLGA-1151 • LGA-1151 • [[Skylake]] • [[Kaby Lake]]
+
* FCLGA-1151 • [[intel/packages/lga-1151|LGA-1151]] • [[Skylake]] • [[Kaby Lake]]
 
* FCLGA-1151 (FCLGA14C) • [[Socket H4]] • [[Coffee Lake]]
 
* FCLGA-1151 (FCLGA14C) • [[Socket H4]] • [[Coffee Lake]]
 
* FCBGA-1288 • [[packages/bga-1288|BGA-1288]] • [[Westmere]]
 
* FCBGA-1288 • [[packages/bga-1288|BGA-1288]] • [[Westmere]]
Line 162: Line 167:
 
* FCBGA-1510 • [[Cannon Lake]]
 
* FCBGA-1510 • [[Cannon Lake]]
 
* FCBGA-1528 • [[Coffee Lake]] • [[Whiskey Lake]]
 
* FCBGA-1528 • [[Coffee Lake]] • [[Whiskey Lake]]
 +
* [[intel/packages/lga-1567|LGA-1567]] • FCLGA-8 • [[Intel Xeon E7]] (Westmere, Ivy Bridge, Haswell, Broadwell)
 
* FCLGA-2011-v3 • LGA-2011-v3 • [[Westmere]], [[Ivy Bridge]], [[Haswell]], [[Broadwell]]
 
* FCLGA-2011-v3 • LGA-2011-v3 • [[Westmere]], [[Ivy Bridge]], [[Haswell]], [[Broadwell]]
 
* FCLGA-2066 • [[Socket R]] • [[Skylake]] • [[Kaby Lake]]
 
* FCLGA-2066 • [[Socket R]] • [[Skylake]] • [[Kaby Lake]]
Line 179: Line 185:
 
<!-- [[Category:~*]]  
 
<!-- [[Category:~*]]  
 
  [[instance of::package]] -->
 
  [[instance of::package]] -->
−
  [[package::~*FCBGA-4*]]
+
  [[package::~*LGA-8*]]
 
  [[designer::Intel]]
 
  [[designer::Intel]]
 
  |?package
 
  |?package
Line 204: Line 210:
 
*[[AMD]]
 
*[[AMD]]
 
*[[Intel]]
 
*[[Intel]]
−
*[[BGA]]
+
*[[FCBGA]] ([[BGA]])
−
*[[LGA]]
+
*[[FCLGA]] ([[LGA]])
 
<!--
 
<!--
 
<pre>
 
<pre>
 
local data =
 
local data =
−
{
 
 
packages =
 
packages =
−
{
 
−
 
 
amd = {},
 
amd = {},
−
 
 
ibm =  
 
ibm =  
−
{
 
 
-- Power9 Sforza
 
-- Power9 Sforza
 
fclga_2601 =
 
fclga_2601 =
−
{
 
 
p_name = { 'FCLGA-2601' },
 
p_name = { 'FCLGA-2601' },
 
p_type = 'PLGA',
 
p_type = 'PLGA',
Line 225: Line 225:
 
p_pitch = { '1.016 mm'},
 
p_pitch = { '1.016 mm'},
 
p_contacts = 2601
 
p_contacts = 2601
−
}
 
−
},
 
−
 
−
 
 
intel =  
 
intel =  
−
{
 
 
-- Alder Lake S
 
-- Alder Lake S
 
fclga_1700 =
 
fclga_1700 =
−
{
 
 
p_name = { 'FCLGA-1700' },
 
p_name = { 'FCLGA-1700' },
 
p_type = 'LGA',
 
p_type = 'LGA',
Line 239: Line 233:
 
p_contacts = 1700,
 
p_contacts = 1700,
 
p_socket = { 'Socket V' }
 
p_socket = { 'Socket V' }
−
},
+
 
 
-- Ice Lake D
 
-- Ice Lake D
 
fcbga_2579 =
 
fcbga_2579 =
−
{
 
 
p_name = { 'FCBGA-2579' },
 
p_name = { 'FCBGA-2579' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_contacts = 2579
 
p_contacts = 2579
−
},
+
 
 
-- Ice Lake SP
 
-- Ice Lake SP
 
fclga_4189 =
 
fclga_4189 =
−
{
 
 
p_name = { 'FCLGA-4189' },
 
p_name = { 'FCLGA-4189' },
 
p_type = 'LGA',
 
p_type = 'LGA',
 
p_contacts = 4189,
 
p_contacts = 4189,
 
p_socket = { 'Socket W', 'LGA-4189' }
 
p_socket = { 'Socket W', 'LGA-4189' }
−
},
+
 
 
-- Ice Lake Y
 
-- Ice Lake Y
 
fcbga_1377 =
 
fcbga_1377 =
−
{
 
 
p_name = { 'FCBGA-1377' },
 
p_name = { 'FCBGA-1377' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 264: Line 255:
 
p_contacts = 1377,
 
p_contacts = 1377,
 
p_socket = { 'Type 3' }
 
p_socket = { 'Type 3' }
−
},
+
 
 
-- Ice Lake U
 
-- Ice Lake U
 
fcbga_1526 =
 
fcbga_1526 =
−
{
 
 
p_name = { 'FCBGA-1526' },
 
p_name = { 'FCBGA-1526' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 274: Line 264:
 
p_contacts = 1526,
 
p_contacts = 1526,
 
p_socket = { 'Type 4' }
 
p_socket = { 'Type 4' }
−
},
+
 
 
-- Cannon Lake Y
 
-- Cannon Lake Y
 
fcbga_1392 =
 
fcbga_1392 =
−
{
 
 
p_name = { 'FCBGA-1392' },
 
p_name = { 'FCBGA-1392' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_contacts = 1392
 
p_contacts = 1392
−
},
+
 
 
-- Cannon Lake U
 
-- Cannon Lake U
 
fcbga_1510 =
 
fcbga_1510 =
−
{
 
 
p_name = { 'FCBGA-1510' },
 
p_name = { 'FCBGA-1510' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_contacts = 1510
 
p_contacts = 1510
−
},
+
 
 
-- Cascade Lake AP
 
-- Cascade Lake AP
 
fcbga_5903 =
 
fcbga_5903 =
−
{
 
 
p_name = { 'FCBGA-5903' },
 
p_name = { 'FCBGA-5903' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_pitch = { '0.99 mm'},
 
p_pitch = { '0.99 mm'},
 
p_contacts = 5903
 
p_contacts = 5903
−
},
+
 
 
-- Skylake SP, Cascade Lake SP
 
-- Skylake SP, Cascade Lake SP
 
fclga_3647 =
 
fclga_3647 =
−
{
 
 
p_name = { 'FCLGA-3647' },
 
p_name = { 'FCLGA-3647' },
 
p_type    = 'FCLGA',
 
p_type    = 'FCLGA',
Line 306: Line 292:
 
p_contacts = 3647,
 
p_contacts = 3647,
 
p_socket = { 'Socket P', 'LGA-3647' }
 
p_socket = { 'Socket P', 'LGA-3647' }
−
},
+
 
 
-- Skylake X, Skylake X Refresh
 
-- Skylake X, Skylake X Refresh
 
fclga_2066 =
 
fclga_2066 =
−
{
 
 
p_name = { 'FCLGA-2066' },
 
p_name = { 'FCLGA-2066' },
 
p_type = 'LGA',
 
p_type = 'LGA',
Line 316: Line 301:
 
p_contacts = 2066,
 
p_contacts = 2066,
 
p_socket = { 'Socket R4' }
 
p_socket = { 'Socket R4' }
−
},
+
 
 
-- Whiskey Lake U
 
-- Whiskey Lake U
 
fcbga_1528 =
 
fcbga_1528 =
−
{
 
 
p_name = { 'FCBGA-1528' },
 
p_name = { 'FCBGA-1528' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_contacts = 1528
 
p_contacts = 1528
−
},
+
 
 
-- Coffee Lake S, E
 
-- Coffee Lake S, E
 
fclga_1151 =
 
fclga_1151 =
−
{
 
 
p_name = { 'FCLGA-1151', 'FCLGA14C' },
 
p_name = { 'FCLGA-1151', 'FCLGA14C' },
 
p_type = 'LGA',
 
p_type = 'LGA',
Line 333: Line 316:
 
p_contacts = 1151,
 
p_contacts = 1151,
 
p_socket = { 'Socket H4', 'LGA-1151' }
 
p_socket = { 'Socket H4', 'LGA-1151' }
−
},
+
 
 
-- Coffee Lake H, HR
 
-- Coffee Lake H, HR
 
fcbga_1440 =
 
fcbga_1440 =
−
{
 
 
p_name = { 'FCBGA-1440' },
 
p_name = { 'FCBGA-1440' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_size = { '42 mm', '28 mm', '1.46 mm' },
 
p_size = { '42 mm', '28 mm', '1.46 mm' },
 
p_contacts = 1440
 
p_contacts = 1440
−
},
+
 
 
-- Amber Lake Y
 
-- Amber Lake Y
 
fcbga_1515 =
 
fcbga_1515 =
−
{
 
 
p_name = { 'FCBGA-1515' },
 
p_name = { 'FCBGA-1515' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 350: Line 331:
 
p_pitch = { '0.4 mm' },
 
p_pitch = { '0.4 mm' },
 
p_contacts = 1515,
 
p_contacts = 1515,
−
},
+
 
 
-- Broadwell DE, Hewitt Lake
 
-- Broadwell DE, Hewitt Lake
 
fcbga_1667 =
 
fcbga_1667 =
−
{
 
 
p_name = { 'FCBGA-1667' },
 
p_name = { 'FCBGA-1667' },
 
p_type    = 'FCBGA',
 
p_type    = 'FCBGA',
Line 359: Line 339:
 
p_pitch = { '0.7 mm'},
 
p_pitch = { '0.7 mm'},
 
p_contacts = 1667
 
p_contacts = 1667
−
},
+
 
−
 
−
 
−
 
−
 
 
-- Intel Nervana
 
-- Intel Nervana
 
fcbga_3325 =
 
fcbga_3325 =
−
{
 
 
p_name = { 'FCBGA-3325' },
 
p_name = { 'FCBGA-3325' },
 
p_type    = 'FCBGA',
 
p_type    = 'FCBGA',
 
p_size = { '60 mm', '60 mm' },
 
p_size = { '60 mm', '60 mm' },
 
p_contacts = 3325
 
p_contacts = 3325
−
},
 
−
},
 
 
 
 
cavium =  
 
cavium =  
−
{
 
 
-- Vulcan
 
-- Vulcan
 
fclga_4077 =
 
fclga_4077 =
−
{
 
 
p_name = { 'FCLGA-4077' },
 
p_name = { 'FCLGA-4077' },
 
p_type = 'LGA',
 
p_type = 'LGA',
 
p_contacts = 4077
 
p_contacts = 4077
−
}
 
−
},
 
 
 
 
phytium =  
 
phytium =  
−
{
 
 
-- Earth
 
-- Earth
 
fcbga_1150 =
 
fcbga_1150 =
−
{
 
 
p_name = { 'FCBGA-1150' },
 
p_name = { 'FCBGA-1150' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 395: Line 362:
 
p_pitch = { '0.914 mm'},
 
p_pitch = { '0.914 mm'},
 
p_contacts = 1150
 
p_contacts = 1150
−
},
+
 
 
fcbga_1944 =
 
fcbga_1944 =
−
{
 
 
p_name = { 'FCBGA-1944' },
 
p_name = { 'FCBGA-1944' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 403: Line 369:
 
p_pitch = { '1.0 mm'},
 
p_pitch = { '1.0 mm'},
 
p_contacts = 1944
 
p_contacts = 1944
−
},
 
 
 
 
-- Mars II
 
-- Mars II
 
fcbga_3576 =
 
fcbga_3576 =
−
{
 
 
p_name = { 'FCBGA-3576' },
 
p_name = { 'FCBGA-3576' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_size = { '61 mm', '61 mm' },
 
p_size = { '61 mm', '61 mm' },
 
p_contacts = 3576
 
p_contacts = 3576
−
}
 
−
},
 
−
 
 
 
 
tesla_car =  
 
tesla_car =  
−
{
 
 
-- FSD chip
 
-- FSD chip
 
fcbga_2116 =
 
fcbga_2116 =
−
{
 
 
p_name = { 'FCBGA-2116' },
 
p_name = { 'FCBGA-2116' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_size = { '37.5 mm', '37.5 mm' },
 
p_size = { '37.5 mm', '37.5 mm' },
 
p_contacts = 2116
 
p_contacts = 2116
−
}
+
 
−
},
 
−
 
−
 
 
mobileye =  
 
mobileye =  
−
{
 
 
-- EyeQ1
 
-- EyeQ1
 
hsbga_292 =
 
hsbga_292 =
−
{
 
 
p_name = { 'HSBGA-292' },
 
p_name = { 'HSBGA-292' },
 
p_type = 'BGA',
 
p_type = 'BGA',
Line 439: Line 393:
 
p_pitch = { '1.27 mm'},
 
p_pitch = { '1.27 mm'},
 
p_contacts = 292
 
p_contacts = 292
−
}
+
 
−
},
 
−
 
−
 
 
eta_compute =  
 
eta_compute =  
−
{
 
 
-- ECM3532
 
-- ECM3532
 
bga81 =
 
bga81 =
−
{
 
 
p_name = { 'BGA-81' },
 
p_name = { 'BGA-81' },
 
p_type = 'BGA',
 
p_type = 'BGA',
 
p_size = { '5 mm', '5 mm' },
 
p_size = { '5 mm', '5 mm' },
 
p_contacts = 81
 
p_contacts = 81
−
}
 
−
},
 
−
 
−
}
 
−
}
 
 
</pre>
 
</pre>
 
-->
 
-->

Latest revision as of 14:28, 6 October 2025

TI's 288GTS package footprint - a 288-ball FCBGA package

Flip Chip Ball Grid Array (FCBGA or simply Flip-chip BGA) is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

Typical Flip Chip BGA Package (Cross-Sectional View)

Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively ASIC, DSP, and various other high performance applications.

FCBGA packages is used in all main semiconductor manufacturers such as in the latest Intel's Core i7, Texas Instruments custom ASICs, and Freescale processors.


μFCBGA[edit]

μFCBGA or micro-FCBGA is a line of fcBGA packages that ships with Intel's line of processors.

BGA/FCBGA[edit]

PackageFCBGA-437 (FCBGA)
Dimension22 mm x 22 mm x 1.6 mm
Pin Count437
SocketBGA-437 (BGA)
PackageFCBGA-441 (FCBGA)
Dimension13 mm x 14 mm
Pin Count441
SocketBGA-441 (BGA)
PackageFCBGA-518 (FCBGA)
Dimension13.8 mm x 13.8 mm x 1.1 mm
Pin Count518
SocketBGA-518 (BGA)
PackageFCBGA-1023 (BGA)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1023
PackageFCBGA-1090 (BGA)
Dimension25 mm x 24 mm
Contacts1090
PackageFCBGA-1224 (BGa)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1224
PackageBGA-1288 (BGA)BGA-1288.svg
Dimension34 mm x 28 mm x 2.1 mm
Pitch0.7 mm
Pin Count1288
PackageFCBGA-1310 (BGA)
Dimension34 mm x 28 mm
Ball Count1310
Ball CompSAC405
InterconnectBGA-1310
PackageFCBGA-1356 (BGA)
Dimension42 mm x 24 mm x 1.3 mm
Pitch0.65 mm
Ball Count1356
Ball CompSAC405
InterconnectBGA-1356
PackageFCBGA-1364 (BGA)
Dimension37.4 mm x 32 mm
Pitch0.7 mm
Ball Count1364
Ball CompSAC405
InterconnectBGA-1364
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440
PackageFCBGA-1528 (BGA)
Dimension46 mm x 24 mm x 1.3 mm
Ball Count1528
Ball CompSAC405
InterconnectBGA-1528
PackageFCBGA-2518 (BGA)
Dimension45 mm x 52.5 mm
Contacts2518


LGA/FCLGA[edit]

PackageFCLGA-1151 (LGA)
FC-LGA14C		FCLGA-1151.svg
Dimension37.5 mm x 37.5 mm x 4.4 mm
Pitch0.914 mm
Contacts1151
SocketLGA-1151
PackageFCLGA-1155 (LGA)125px
Dimension37.5 mm x 37.5 mm
Contacts1155
SocketLGA-1155
PackageFCLGA-8 (LGA)FCLGA-8.svg
Dimension49.1 mm x 56.4 mm x 4.2 mm
Pitch1 mm
Pin Count1567
SocketLGA-1567


PGA/FCPGA[edit]

• Socket G1 (rPGA 988A) • Mobile Core i (Gen 1), Pentium, Celeron • Socket G2 (rPGA 988B) • Mobile Core i (Gen 2/3), Pentium, Celeron • Socket G3 (rPGA 946) • Mobile Core i (Gen 4), Pentium, Celeron

PackagerPGA-988A (rPGA)rPGA988A.svg
Dimension36 mm x 35 mm x 2.12 mm
Pitch1 mm
Pin Count988
SocketSocket-G1 (PGA)
PackagerPGA988B (PGA)
Dimension37.5 mm x 37.5 mm
Pitch1 mm
Contacts988
SocketSocket G2
  • FCPGA-946 (PGA) • rPGA-946B/947 (FCPGA-1364)
PackageFCPGA-946 (PGA)
Dimension37.5 mm x 37.5 mm
Pitch1.0 mm
Pins946
InterconnectrPGA-946B/947


BGA CPU Packages[edit]

AMD BGA Packages[edit]

List of AMD CPU sockets
BGA CPU Packages
GeneralDetails
NamePackageContactsTDPSocketµarchMarketRelease
Package ASB1ASB1, BGA-81281218 W
18,000 mW
0.0241 hp
0.018 kW
K8Mobile8 January 2009
Package ASB2ASB2, BGA-81281215 W
15,000 mW
0.0201 hp
0.015 kW
K10Mobile12 May 2010
Package CBGA-360CBGA-36036011 W
11,000 mW
0.0148 hp
0.011 kW
K6Mobile5 March 1998
Package FP2BGA-827, FP282725 W
25,000 mW
0.0335 hp
0.025 kW
PiledriverMobile, Embedded15 May 2012
Package FP3BGA-854, FP385435 W
35,000 mW
0.0469 hp
0.035 kW
SteamrollerMobile, EmbeddedJune 2014
Package FP4BGA-968, FP496845 W
45,000 mW
0.0603 hp
0.045 kW
ExcavatorMobile, EmbeddedJune 2015
Package FP5BGA-11401,14045 W
45,000 mW
0.0603 hp
0.045 kW
Zen, Zen+Mobile, Embedded8 January 2018
Package FP6BGA-11401,14055 W
55,000 mW
0.0738 hp
0.055 kW
Zen 2, Zen 3Mobile, Embedded16 March 2020
Package FT1BGA-413, UOB-41341318 W
18,000 mW
0.0241 hp
0.018 kW
BobcatMobile, Embedded4 January 2011
Package FT3BGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
JaguarMobile, EmbeddedMay 2013
Package FT3bBGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
PumaMobile, Embedded4 June 2014
Package FT4BGA-76976915 W
15,000 mW
0.0201 hp
0.015 kW
ExcavatorMobileJune 2016
Package OBGA-349OBGA-34934918 W
18,000 mW
0.0241 hp
0.018 kW
K6Embedded25 September 2000
Package SP1BGA-10211,02132 W
32,000 mW
0.0429 hp
0.032 kW
Cortex-A57Embedded, ServerJanuary 2016
Package SP4BGA-20282,028100 W
100,000 mW
0.134 hp
0.1 kW
ZenEmbedded21 February 2018
Package SP4r2BGA-20282,02855 W
55,000 mW
0.0738 hp
0.055 kW
ZenEmbedded21 February 2018

Intel BGA Packages[edit]

  • FCBGA-1377 (26.5 x 18.5 mm) • Ice Lake Y
  • FCBGA-1392 • Cannon Lake Y
  • FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
  • FCBGA-1510 • Cannon Lake U
  • FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
  • FCBGA-1526 (50 x 25 mm) • Ice Lake U
  • FCBGA-1528 • Whiskey Lake U
  • FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
  • FCBGA-2579 • Ice Lake D
  • FCBGA-3325 (60 x 60 mm) • Intel Nervana
  • FCBGA-5903 • Cascade Lake AP

Intel LGA Packages[edit]

  • FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
• LGA-1151 • Socket H4
  • FCLGA-8 • Intel Xeon E7 (Westmere, Ivy Bridge, Haswell, Broadwell)
• LGA-1567 • Socket LS
  • FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
• LGA-1700 • Socket V
  • FCLGA-2066 (52.5 x 45 mm) • Skylake X, Skylake X Refresh
• LGA-2066 • Socket R4
  • FCLGA-3647 (76.2 x 56.6 mm) • Skylake SP, Cascade Lake SP
• LGA-3647 • Socket P
  • FCLGA-4189 • Ice Lake SP
• LGA-4189 • Socket P+ (W)
  • FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
• PLGA-2601

Intel CPU Packages[edit]

Intel CPU Packages
GeneralDetails
PackageNameContactsTDPSocketµarchMarketRelease
FCLGA-8Intel Xeon E7LGA-1567Westmere, Ivy Bridge, Haswell, Broadwell5 April 2011
FCLGA-8Xeon E7-2803105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-2820105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-2830105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-2850130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-2860130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-2870130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-480795 W
95,000 mW
0.127 hp
0.095 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-4820105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-4830105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-4850130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-4860130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-4870130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8830105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8837130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8850130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8860130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8867L105 W
105,000 mW
0.141 hp
0.105 kW
WestmereServer5 April 2011
FCLGA-8Xeon E7-8870130 W
130,000 mW
0.174 hp
0.13 kW
WestmereServer5 April 2011

See also[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=Flip_Chip_Ball_Grid_Array&oldid=103779"
Facts about "Flip Chip Ball Grid Array"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Flip Chip Ball Grid Array#package +
packageFCBGA-437 +, FCBGA-441 +, FCBGA-518 +, FCBGA-1023 +, FCBGA-1090 +, FCBGA-1224 +, BGA-1288 +, FCBGA-1310 +, FCBGA-1356 +, FCBGA-1364 +, FCBGA-1440 +, FCBGA-1528 +, FCBGA-2518 +, FCLGA-1151 +, FCLGA-1155 +, FCLGA-8 +, rPGA-988A +, rPGA988B + and FCPGA-1364 +
socketBGA-437 +, BGA-441 +, BGA-518 +, LGA-1151 +, LGA-1155 + and Socket G2 +