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'''Ryzen 9 5900HS''' is a {{arch|64}} [[octa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2021]]. Fabricated on a [[TSMC]] [[7-nanometer process]] and based on AMD's {{amd|Zen 3|Zen 3 microarchitecture|l=arch}}, the 5900HS operates at a base frequency of 3.0 GHz with a [[TDP]] of 35 W and a {{amd|Precision Boost|boost}} frequency of up to 4.6 GHz. This APU supports DDR4-3200 or LPDDR4-4266 memory and integrates a {{amd|Radeon Vega 8}} GPU operating at up to 2.1 GHz.  
 
'''Ryzen 9 5900HS''' is a {{arch|64}} [[octa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2021]]. Fabricated on a [[TSMC]] [[7-nanometer process]] and based on AMD's {{amd|Zen 3|Zen 3 microarchitecture|l=arch}}, the 5900HS operates at a base frequency of 3.0 GHz with a [[TDP]] of 35 W and a {{amd|Precision Boost|boost}} frequency of up to 4.6 GHz. This APU supports DDR4-3200 or LPDDR4-4266 memory and integrates a {{amd|Radeon Vega 8}} GPU operating at up to 2.1 GHz.  

Latest revision as of 23:51, 25 March 2023

Edit Values
Ryzen 9 5900HS
General Info
DesignerAMD
ManufacturerTSMC
Model Number5900HS
Part Number100-000000300
MarketMobile
IntroductionJanuary 12, 2021 (announced)
January 12, 2021 (launched)
ShopAmazon
General Specs
FamilyRyzen 9
Series5000
Frequency3,000 MHz
Turbo Frequency4,600 MHz
Clock multiplier30
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen 3
Core NameCezanne
Core Family25
Core Model80
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads16
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP35 W
Tcase0 °C – 105 °C
Packaging
PackageFP6 (FC-OBGA)
Dimension35 mm × 25 mm × 1.38 mm
Pitch0.65 mm
Contacts1140

Ryzen 9 5900HS is a 64-bit octa-core high-end performance x86 mobile microprocessor introduced by AMD in early 2021. Fabricated on a TSMC 7-nanometer process and based on AMD's Zen 3 microarchitecture, the 5900HS operates at a base frequency of 3.0 GHz with a TDP of 35 W and a boost frequency of up to 4.6 GHz. This APU supports DDR4-3200 or LPDDR4-4266 memory and integrates a Radeon Vega 8 GPU operating at up to 2.1 GHz.

Cache[edit]

Main article: Zen 3 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB8-way set associativewrite-back
L2$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  8x512 KiB8-way set associativewrite-back
L3$16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
  1x16 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-3200, LPDDR4-4266

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0


Graphics[edit]

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPURadeon Vega 8
DesignerAMD
Execution Units8
Burst Frequency2,100 MHz
2.1 GHz
2,100,000 KHz

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
SMTSimultaneous Multithreading
AMD-ViAMD-Vi (I/O MMU virtualization)
AMD-VAMD Virtualization
SenseMISenseMI Technology

References[edit]

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Facts about "Ryzen 9 5900HS - AMD"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Ryzen 9 5900HS - AMD#pcie +
base frequency3,000 MHz (3 GHz, 3,000,000 kHz) +
clock multiplier30 +
core count8 +
core family25 +
core model80 +
core nameCezanne +
designerAMD +
familyRyzen 9 +
first announcedJanuary 12, 2021 +
first launchedJanuary 12, 2021 +
full page nameamd/ryzen 9/5900hs +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd amd-vi technologytrue +
has amd sensemi technologytrue +
has ecc memory supportfalse +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 8 +
integrated gpu designerAMD +
integrated gpu execution units8 +
integrated gpu max frequency2,100 MHz (2.1 GHz, 2,100,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description8-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description8-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description16-way set associative +
l3$ size16 MiB (16,384 KiB, 16,777,216 B, 0.0156 GiB) +
ldateJanuary 12, 2021 +
manufacturerTSMC +
market segmentMobile +
max case temperature378.15 K (105 °C, 221 °F, 680.67 °R) +
max cpu count1 +
microarchitectureZen 3 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number5900HS +
nameRyzen 9 5900HS +
packageFP6 +
part number100-000000300 +
process7 nm (0.007 μm, 7.0e-6 mm) +
series5000 +
smp max ways1 +
supported memory typeDDR4-3200 + and LPDDR4-4266 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count16 +
turbo frequency4,600 MHz (4.6 GHz, 4,600,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +