Difference between revisions of "amd/ryzen 3/3200u"

	Edit Values
	Ryzen 3 3200U
	General Info
Designer	AMD
Manufacturer	GlobalFoundries
Model Number	3200U
Part Number	YM3200C4T2OFG
Market	Mobile
Introduction	January 6, 2019 (announced); January 6, 2019 (launched)
Shop	Amazon
	General Specs
Family	Ryzen 3
Series	3000
Locked	Yes
Frequency	2,600 MHz
Turbo Frequency	3,500 MHz
Bus type	PCIe 3.0
Clock multiplier	26
	Microarchitecture
ISA	x86-64 (x86)
Microarchitecture	Zen+
Core Name	Picasso
Process	12 nm
Transistors	4,940,000,000
Technology	CMOS
Die	209.78 mm²
Word Size	64 bit
Cores	2
Threads	4
Max Memory	64 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
TDP	15 W
TDP (Typical)	15
cTDP down	12 W
cTDP up	35 W
OP Temperature	0° C – 105 °C
	Packaging
	Unknown package "amd,socket_fp5"

Revision as of 16:44, 9 July 2022

Ryzen 3 3200U is a 64-bit dual-core entry-level performance x86 mobile microprocessor introduced by AMD in early 2019. This processor is based on AMD's Zen+ microarchitecture and is fabricated on a 12 nm process. The 3200U operates at a base frequency of 2.6 GHz with a TDP of 15 W and a Boost frequency of 3.5 GHz. This APU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 3 Graphics operating at up to 1.2 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 35 W.

Cache

Main article: Zen+ § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

192 KiB

196,608 B
0.188 MiB

L1I$	128 KiB 131,072 B 0.125 MiB	2x64 KiB	4-way set associative
L1D$	64 KiB 65,536 B 0.0625 MiB	2x32 KiB	8-way set associative	write-back

L2$

1 MiB

1,024 KiB
1,048,576 B
9.765625e-4 GiB

		2x512 KiB	8-way set associative	write-back

L3$

4 MiB

4,096 KiB
4,194,304 B
0.00391 GiB

		1x4 MiB

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR4-3200
Supports ECC	Yes
Max Mem	12 GiB
Controllers	2
Channels	2
Max Bandwidth	35.76 GiB/s 36,618.24 MiB/s 38.397 GB/s 38,397.008 MB/s 0.0349 TiB/s 0.0384 TB/s
Bandwidth	Single 17.88 GiB/s Double 35.76 GiB/s

Expansions

This processor has 12 PCIe lanes, 1x8 typically designated for a GPU and 4 additional lanes for storage (e.g., NVMe).

[Edit/Modify Expansions Info]

Expansion Options

PCIe	Revision: 3.0
	Max Lanes: 12
	Configuration: 1x8+1x4, 2x4+1x4, 1x8+2x2

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Radeon Vega 3

Designer

AMD

Execution Units

3

Max Displays

3

Unified Shaders

192

Burst Frequency

1,200 MHz

1.2 GHz
1,200,000 KHz

Output

DP, HDMI

Standards

DirectX	12
OpenGL	4.6
OpenCL	2.2

[Edit] Zen with Radeon Vega Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Max FPS	@1080p	@1440p	@2160p	@1080p 4:2:0	@2160p 4:2:0
MPEG-2 (H.262)				60 FPS	N/A
VC-1				60 FPS	N/A
VP9 8bpc				240 FPS	60 FPS
VP9 10bpc
MPEG-4 AVC (H.264) 8bpc	120 FPS	60 FPS	30 FPS
MPEG-4 AVC (H.264) 10bpc
HEVC (H.265) 8bpc	120 FPS	60 FPS	30 FPS
HEVC (H.265) 10bpc
JPEG/MJPEG 8bpc

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
SSE4a	Streaming SIMD Extensions 4a
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
SHA	SHA Extensions
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
SMT	Simultaneous Multithreading
AMD-Vi	AMD-Vi (I/O MMU virtualization)
AMD-V	AMD Virtualization
SenseMI	SenseMI Technology

Die

Further information: Zen+ § Die

14 nm process
4,940,000,000 transistors
209.78 mm² die size

@@ Line 63: / Line 63: @@
 == Memory controller ==
 {{memory controller
-|type=DDR4-2400
+|type=DDR4-3200
 |ecc=Yes
 |max mem=12 GiB

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Ryzen 3 3200U - AMD#pcie +
base frequency	2,600 MHz (2.6 GHz, 2,600,000 kHz) +
bus type	PCIe 3.0 +
clock multiplier	26 +
core count	2 +
core name	Picasso +
designer	AMD +
die area	209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
family	Ryzen 3 +
first announced	January 6, 2019 +
first launched	January 6, 2019 +
full page name	amd/ryzen 3/3200u +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has amd amd-v technology	true +
has amd amd-vi technology	true +
has amd sensemi technology	true +
has ecc memory support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has locked clock multiplier	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	Radeon Vega 3 +
integrated gpu designer	AMD +
integrated gpu execution units	3 +
integrated gpu max frequency	1,200 MHz (1.2 GHz, 1,200,000 KHz) +
isa	x86-64 +
isa family	x86 +
l1$ size	192 KiB (196,608 B, 0.188 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	4-way set associative +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) +
l2$ description	8-way set associative +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldate	January 6, 2019 +
manufacturer	GlobalFoundries +
market segment	Mobile +
max cpu count	1 +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels	2 +
max operating temperature	105 °C +
microarchitecture	Zen+ +
min operating temperature	0° C +
model number	3200U +
name	Ryzen 3 3200U +
part number	YM3200C4T2OFG +
process	12 nm (0.012 μm, 1.2e-5 mm) +
series	3000 +
smp max ways	1 +
supported memory type	DDR4-3200 +
tdp	15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp (typical)	15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down	12 W (12,000 mW, 0.0161 hp, 0.012 kW) +
tdp up	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technology	CMOS +
thread count	4 +
transistor count	4,940,000,000 +
turbo frequency	3,500 MHz (3.5 GHz, 3,500,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +

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