Semiconductor & Computer Engineering
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Difference between revisions of "die size"
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== Overview == | == Overview == | ||
The die size of a specific chip is the physical dimensions of a [[bare die]]. In other words, the length and width of the integrated circuit. Since the die size and shape determines the total number of [[dies]] that may be realized from a single [[wafer]] of a [[wafer size|certain size]] on a specific [[process node]], the die size is a strong indicator of manufacturing cost. | The die size of a specific chip is the physical dimensions of a [[bare die]]. In other words, the length and width of the integrated circuit. Since the die size and shape determines the total number of [[dies]] that may be realized from a single [[wafer]] of a [[wafer size|certain size]] on a specific [[process node]], the die size is a strong indicator of manufacturing cost. | ||
| + | |||
| + | === Limitations === | ||
| + | {{main|reticle limit}} | ||
| + | The largest monolithic die that can be produced is limited to the largest pattern that can be drawn on the reticle of modern steppers. This is known as the [[reticle limit]]. | ||
| + | |||
| + | == List of die sizes == | ||
| + | {{empty section}} | ||
| + | |||
| + | == See also == | ||
| + | * [[die]] | ||
Latest revision as of 10:28, 18 May 2020
Die size refers to the physical dimensions of a bare die.
Overview[edit]
The die size of a specific chip is the physical dimensions of a bare die. In other words, the length and width of the integrated circuit. Since the die size and shape determines the total number of dies that may be realized from a single wafer of a certain size on a specific process node, the die size is a strong indicator of manufacturing cost.
Limitations[edit]
- Main article: reticle limit
The largest monolithic die that can be produced is limited to the largest pattern that can be drawn on the reticle of modern steppers. This is known as the reticle limit.
List of die sizes[edit]
 |
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