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Difference between revisions of "cea-leti/microarchitectures/tsarlet"
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{{cealeti title|TSARLET|arch}} | {{cealeti title|TSARLET|arch}} | ||
− | {{microarchitecture}} | + | {{microarchitecture |
+ | |atype=CPU | ||
+ | |name=TSARLET | ||
+ | |designer=CEA-Leti | ||
+ | |manufacturer=STMicroelectronics | ||
+ | |process=28 nm | ||
+ | |process 2=65 nm | ||
+ | |cores=96 | ||
+ | |type=Scalar | ||
+ | |type 2=Single-issue | ||
+ | |oooe=No | ||
+ | |speculative=No | ||
+ | |renaming=No | ||
+ | |stages=5 | ||
+ | |decode=1-way | ||
+ | |isa=MIPS32v1 | ||
+ | |l1i=16 KiB | ||
+ | |l1i per=core | ||
+ | |l1d=16 KiB | ||
+ | |l1d per=core | ||
+ | |l2=256 KiB | ||
+ | |l2 per=core | ||
+ | |l3=1 MiB | ||
+ | |l3 per=core | ||
+ | }} | ||
'''TSARLET''' is a large-scale high-performance 3D stacked [[chiplets]]-based SoC technology demonstration by [[CEA-Leti]]. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to demonstarte in-package silicon [[scale-out]] capabilities with superior inter-chip capabilities while reducing the overall power and production cost. | '''TSARLET''' is a large-scale high-performance 3D stacked [[chiplets]]-based SoC technology demonstration by [[CEA-Leti]]. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to demonstarte in-package silicon [[scale-out]] capabilities with superior inter-chip capabilities while reducing the overall power and production cost. |
Revision as of 01:13, 29 February 2020
Edit Values | |
TSARLET µarch | |
General Info | |
Arch Type | CPU |
Designer | CEA-Leti |
Manufacturer | STMicroelectronics |
Process | 28 nm, 65 nm |
Core Configs | 96 |
Pipeline | |
Type | Scalar, Single-issue |
OoOE | No |
Speculative | No |
Reg Renaming | No |
Stages | 5 |
Decode | 1-way |
Instructions | |
ISA | MIPS32v1 |
Cache | |
L1I Cache | 16 KiB/core |
L1D Cache | 16 KiB/core |
L2 Cache | 256 KiB/core |
L3 Cache | 1 MiB/core |
TSARLET is a large-scale high-performance 3D stacked chiplets-based SoC technology demonstration by CEA-Leti. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.
Facts about "TSARLET - Microarchitectures - CEA Leti"
codename | TSARLET + |
core count | 96 + |
designer | CEA-Leti + |
full page name | cea-leti/microarchitectures/tsarlet + |
instance of | microarchitecture + |
instruction set architecture | MIPS32v1 + |
manufacturer | STMicroelectronics + |
microarchitecture type | CPU + |
name | TSARLET + |
pipeline stages | 5 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) + |