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Difference between revisions of "renesas/r-car/h3"
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* 12.94 mm × 8.61 mm | * 12.94 mm × 8.61 mm |
Revision as of 15:11, 29 December 2018
Edit Values | |||||||||||
R-Car H3 | |||||||||||
General Info | |||||||||||
Designer | Renesas, ARM Holdings | ||||||||||
Manufacturer | TSMC | ||||||||||
Model Number | H3 | ||||||||||
Part Number | R8A77950 | ||||||||||
Market | Embedded | ||||||||||
Introduction | December 2, 2015 (announced) March, 2018 (launched) | ||||||||||
General Specs | |||||||||||
Family | R-Car | ||||||||||
Series | 3rd Gen | ||||||||||
Microarchitecture | |||||||||||
ISA | ARMv8 (ARM) | ||||||||||
Microarchitecture | Cortex-A53, Cortex-A57, Cortex-R7 | ||||||||||
Core Name | Cortex-A53, Cortex-A57, Cortex-R7 | ||||||||||
Process | 16 nm | ||||||||||
Technology | CMOS | ||||||||||
Die | 111.36 mm² 12.94 mm × 8.61 mm | ||||||||||
Word Size | 64 bit | ||||||||||
Cores | 9 | ||||||||||
Threads | 9 | ||||||||||
Multiprocessing | |||||||||||
Max SMP | 1-Way (Uniprocessor) | ||||||||||
Electrical | |||||||||||
Vcore | 0.8 V | ||||||||||
VI/O | 3.3 V | ||||||||||
Packaging | |||||||||||
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R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a dual-core lock-step Cortex-R7 for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6650 GPU.
Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.
Contents
Cache
- Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
Integrated Memory Controller
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Expansions
- PCI Express2.0 (1 lane) x 2 ch
- USB 3.0 Host interface (DRD) × 1 ports (wPHY)
- USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
- SD Host interface × 4 ch (SDR104)
- Multimedia card interface × 2 ch
- Serial ATA interface × 1 ch
- Media local bus (MLB) Interface × 1 ch (3 pin interface)
- Controller Area Network (CAN-FD support) Interface × 2ch
- Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
- SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
- Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
- 32bit timer x 26 ch
- PWM timer × 7 ch
- I2C bus interface × 7 ch
- Serial communication interface (SCIF) × 11 ch
- Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
- Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
- Ethernet controller (IEEE802.3u, RMII, without PHY)
- Digital radio interface (DRIF) × 4 ch
Graphics
Integrated Graphics Information
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Features
[Edit/Modify Supported Features]
Supported ARM Extensions & Processor Features
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Block Diagram
Die
- 16 nm process, CMOS FinFET
- 12.94 mm × 8.61 mm
- 111.36 mm² die size
- Quad-core Cortex-A53
- ~3.27 mm² cluster
- ~0.60 mm² core
- ~0.7`mm² L2 cache
- Quad-core Cortex-A57
- ~10.21 mm² cluster
- ~1.66 mm² core
- ~3.28 mm² L2 cache
- Cortex-R7 (dual-core lock-step)
- ~1.04 mm² cluster
- GX6650 GPU
- 28.12 mm²
Bibliography
- Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
- Shibahara, Shinichi, et al. "A 16 nm FinFET Heterogeneous Nona-Core SoC Supporting ISO26262 ASIL B Standard." IEEE Journal of Solid-State Circuits 52.1 (2017): 77-88.
Categories:
- all microprocessor models
- microprocessor models by renesas
- microprocessor models by renesas based on cortex-a53
- microprocessor models by renesas based on cortex-a57
- microprocessor models by renesas based on cortex-r7
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a57
- microprocessor models by arm holdings based on cortex-r7
- microprocessor models by tsmc
Facts about "R-Car H3 - Renesas"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | R-Car H3 - Renesas#package + |
core count | 9 + |
core name | Cortex-A53 +, Cortex-A57 + and Cortex-R7 + |
core voltage | 0.8 V (8 dV, 80 cV, 800 mV) + |
designer | Renesas + and ARM Holdings + |
die area | 111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) + |
die length | 12.94 mm (1.294 cm, 0.509 in, 12,940 µm) + |
die width | 8.61 mm (0.861 cm, 0.339 in, 8,610 µm) + |
family | R-Car + |
first announced | December 2, 2015 + |
first launched | March 2018 + |
full page name | renesas/r-car/h3 + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | PowerVR GX6650 + |
integrated gpu designer | Imagination Technologies + |
io voltage | 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 640 KiB (655,360 B, 0.625 MiB) + |
l1d$ size | 288 KiB (294,912 B, 0.281 MiB) + |
l1i$ size | 352 KiB (360,448 B, 0.344 MiB) + |
l2$ size | 2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) + |
ldate | March 2018 + |
main image | + |
manufacturer | TSMC + |
market segment | Embedded + |
max cpu count | 1 + |
max memory bandwidth | 47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) + |
max memory channels | 4 + |
microarchitecture | Cortex-A53 +, Cortex-A57 + and Cortex-R7 + |
model number | H3 + |
name | R-Car H3 + |
package | FCBGA-1384 + |
part number | R8A77950 + |
process | 16 nm (0.016 μm, 1.6e-5 mm) + |
series | 3rd Gen + |
smp max ways | 1 + |
supported memory type | LPDDR4-3200 + |
technology | CMOS + |
thread count | 9 + |
word size | 64 bit (8 octets, 16 nibbles) + |