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Difference between revisions of "mediatek/helio/mt6795"
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{{mediatek title|Helio X10 (MT6795)}}
 
{{mediatek title|Helio X10 (MT6795)}}
 
{{mpu
 
{{mpu
−
| name               = MediaTek Helio X10
+
|name=MediaTek Helio X10
−
| no image            = yes
+
|designer=MediaTek
−
| image              =
+
|designer 2=ARM Holdings
−
| image size          =
+
|manufacturer=TSMC
−
| caption            =
+
|model number=Helio X10
−
| designer           = MediaTek
+
|part number=MT6795
−
| designer 2         = ARM Holdings
+
|part number 2=MTK6795
−
| manufacturer       = TSMC
+
|market=Mobile
−
| model number       = Helio X10
+
|market 2=Embedded
−
| part number         = MT6795
+
|first announced=July 15, 2014
−
| part number 2       = MTK6795
+
|first launched=March 27, 2015
−
| market             = Mobile
+
|family=Helio
−
| market 2           = Embedded
+
|series=Helio X
−
| first announced     = July 15, 2014
+
|frequency=2,000 MHz
−
| first launched     = March 27, 2015
+
|bus type=AMBA 4 AXI
−
| last order          =
+
|isa=ARMv8
−
| last shipment      =
+
|isa family=ARM
−
| release price      =
+
|microarch=Cortex-A53
−
 
+
|core name=Cortex-A53
−
| family             = Helio
+
|process=28 nm
−
| series             = Helio X
+
|technology=CMOS
−
| locked              =
+
|word size=64 bit
−
| frequency           = 2,000 MHz
+
|core count=8
−
| bus type           = AMBA 4 AXI
+
|thread count=8
−
| bus speed          =
+
|max cpus=1
−
| bus rate            =
+
|max memory=4 GiB
−
| bus links          =  
+
|v core=1 V
−
| clock multiplier    =
+
|v io=1.8 V
−
 
+
|v io 2=2.8 V
−
| isa family         = ARM
+
|v io 3=3.3 V
−
| isa                = ARMv8
+
|temp min=-20 °C
−
| microarch           = Cortex-A53
+
|temp max=80 °C
−
| platform            =
+
|tjunc max=125 °C
−
| chipset            =
+
|tstorage min=0 °C
−
| core name           = Cortex-A53
+
|tstorage max=125 °C
−
| core family        =
+
|packaging=Yes
−
| core model          =
+
|package 0=MWPOP-1108
−
| core stepping      =
+
|package 0 type=MWPOP
−
| process             = 28 nm
+
|package 0 pins=1108
−
| transistors        =
+
|package 0 pitch=0.4 mm
−
| technology         = CMOS
+
|package 0 width=14 mm
−
| die area            = <!-- XX mm² -->
+
|package 0 length=14 mm
−
| die width          =
+
|package 0 height=0.78 mm
−
| die length          =
 
−
| word size           = 64 bit
 
−
| core count         = 8
 
−
| thread count       = 8
 
−
| max cpus           = 1
 
−
| max memory         = 4 GiB
 
−
 
 
−
 
 
−
| power              =
 
−
| v core             = 1 V
 
−
| v core tolerance    =
 
−
| v io               = 1.8 V
 
−
| v io 2             = 2.8 V
 
−
| v io 3             = 3.3 V
 
−
| sdp                =
 
−
| tdp                =
 
−
| tdp typical        =
 
−
| ctdp down          =
 
−
| ctdp down frequency =
 
−
| ctdp up            =
 
−
| ctdp up frequency  =
 
−
| temp min           = -20 °C
 
−
| temp max           = 80 °C
 
−
| tjunc min          =
 
−
| tjunc max           = 125 °C  
 
−
| tcase min          =
 
−
| tcase max          =
 
−
| tstorage min       = 0 °C
 
−
| tstorage max       = 125 °C
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
 
−
| packaging           = Yes
 
−
| package 0           = MWPOP-1108
 
−
| package 0 type     = MWPOP
 
−
| package 0 pins     = 1108
 
−
| package 0 pitch     = 0.4 mm
 
−
| package 0 width     = 14 mm
 
−
| package 0 length   = 14 mm
 
−
| package 0 height   = 0.78 mm
 
 
}}
 
}}
 
'''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2015]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.
 
'''Helio X10''' ('''MT6795''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2015]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 700  MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.

Revision as of 16:07, 12 July 2017

Template:mpu Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-1866 memory. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.

This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.

Cache

Main article: Cortex-A53 § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
8x32 KiB2-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
8x32 KiB4-way set associative 
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  2x1 MiB16-way set associative 

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866
Supports ECCNo
Max Mem4 GiB
Controllers1
Channels2
Width32 bit
Max Bandwidth13.91 GiB/s
14,243.84 MiB/s
14.936 GB/s
14,935.749 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR G6200
DesignerImagination Technologies
Max Displays2
Frequency700 MHz
0.7 GHz
700,000 KHz
OutputDSI
Max Resolution
DSI2560x1600
Standards
Direct3D10.0
OpenGL3.2
OpenCL1.2
OpenGL ES3.1
Vulkan1.0
  • OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
  • OpenVG 1.1 vector graphics accelerator

Wireless

Antu network-wireless-connected-100.svgWireless Communications
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
4G
LTE Advanced
E-UTRANYes
UE Cat4

Image

  • Integrated image signal processor supports 20 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video

  • HEVC decoder 4k2k @ 30fps
  • H.264 decoder (30fps/40Mbps)
  • Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
  • MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
  • DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
  • VP8 / VC-1 decoders
  • MPEG-4 / H.263 / H.264 / HEVC encoders

Audio

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices

  • Meizu Blue Charm Metal
  • Meizu MX5E
  • HTC Desire 830
  • HTC One S9
  • HTC One ME
  • Sony Xperia M5
  • Gionee Elife E8
  • Elephone Vowney
  • LeEco Le1 X600
  • LeEco Le 1s
  • PPTV King 7
  • Xiaomi Redmi Note 2
  • Xiaomi Redmi Note 3

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6795&oldid=54639"
Facts about "Helio X10 (MT6795) - MediaTek"
RDF feed
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
integrated gpuPowerVR G6200 +
integrated gpu base frequency700 MHz (0.7 GHz, 700,000 KHz) +
integrated gpu designerImagination Technologies +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description16-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
max memory bandwidth13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
supported memory typeLPDDR3-1866 +
used byMeizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 + and Xiaomi Redmi Note 3 +
user equipment category4 +