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Revision as of 15:31, 13 December 2017
| Edit Values | |
| MediaTek Helio X10 T | |
| General Info | |
| Designer | MediaTek, ARM Holdings  | 
| Manufacturer | TSMC | 
| Model Number | Helio X10 T | 
| Part Number | MT6795T, MTK6795T  | 
| Market | Mobile, Embedded | 
| Introduction | July 15, 2014 (announced) March 27, 2015 (launched)  | 
| General Specs | |
| Family | Helio | 
| Series | Helio X | 
| Frequency | 2,200 MHz | 
| Bus type | AMBA 4 AXI | 
| Microarchitecture | |
| ISA | ARMv8 (ARM) | 
| Microarchitecture | Cortex-A53 | 
| Core Name | Cortex-A53 | 
| Process | 28 nm | 
| Technology | CMOS | 
| Word Size | 64 bit | 
| Cores | 8 | 
| Threads | 8 | 
| Max Memory | 4 GiB | 
| Multiprocessing | |
| Max SMP | 1-Way (Uniprocessor) | 
| Electrical | |
| Vcore | 1 V | 
| VI/O | 1.8 V, 2.8 V, 3.3 V | 
| OP Temperature | -20 °C – 80 °C | 
| Tjunction | – 125 °C | 
| Tstorage | 0 °C – 125 °C | 
Helio X10 T (MT6795T; T for turbo) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2015. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2.2 GHz and supports dual-channel LPDDR3-1866. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4. This "turbo" variant of the X10 operates at 10% higher frequency.
This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.
Contents
Cache
- Main article: Cortex-A53 § Cache
 
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 Cache Organization  
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.  | 
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Memory controller
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 Integrated Memory Controller 
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Expansions
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 Expansion Options 
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Graphics
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 Integrated Graphics Information 
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- OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
 - OpenVG 1.1 vector graphics accelerator
 
Wireless
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| 3G | 
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| 4G | 
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Image
- Integrated image signal processor supports 20 MP
 - Supports image stabilization
 - Supports video stabilization
 - Supports noise reduction
 - Supports lens shading correction
 - Supports AE/AWB/AF
 - Supports edge enhancement
 - Supports face detection and visual tracking
 - Hardware JPEG encoder
 
Video
- HEVC decoder 4k2k @ 30fps
 - H.264 decoder (30fps/40Mbps)
 - Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
 - MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
 - DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
 - VP8 / VC-1 decoders
 - MPEG-4 / H.263 / H.264 / HEVC encoders
 
Audio
- Audio content sampling rates 8kHz to 192kHz
 - Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
 - I2S, PCM
 - Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
 - Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
 - 7.1 channel MHL output
 
Utilizing devices
- Meizu MX5
 - LeEco Le 1s
 - Xiaomi Redmi Note 2
 - HTC One X9
 - HTC One M9+
 
This list is incomplete; you can help by expanding it.
Facts about "Helio X10 T (MT6795T) - MediaTek"