Difference between revisions of "intel/core m/m3-7y32"

Revision as of 17:37, 30 June 2017

Template:mpu Core M3-7Y32 is a 64-bit dual-core low-end performance ultra-low power x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The M3-7Y32 operates at 1.1 GHz with a TDP of 4.5 W supporting a Turbo Boost frequency of 3 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's HD Graphics 615 IGP operating at 300 MHz with a burst frequency of 900 MHz.

This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz.

The Core M3-7Y32 superceeds the M3-7Y30 which was released in August 2016, offering 100 MHz higher base clock and 400 MHz higher turbo frequency for the exact same price.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

128 KiB

131,072 B
0.125 MiB

L1I$	64 KiB 65,536 B 0.0625 MiB	2x32 KiB	8-way set associative
L1D$	64 KiB 65,536 B 0.0625 MiB	2x32 KiB	8-way set associative	write-back

L2$

512 KiB

0.5 MiB
524,288 B
4.882812e-4 GiB

		2x256 KiB	4-way set associative	write-back

L3$

4 MiB

4,096 KiB
4,194,304 B
0.00391 GiB

		2x2 MiB	12-way set associative	write-back

Memory controller

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	DDR3L-1600, LPDDR3-1866
Supports ECC	No
Max Mem	16 GiB
Controllers	1
Channels	2
Max Bandwidth	27.81 GiB/s 28,477.44 MiB/s 29.861 GB/s 29,860.76 MB/s 0.0272 TiB/s 0.0299 TB/s
Bandwidth	Single 13.9 GiB/s Double 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

Expansion Options

PCIe

Revision	3.0
Max Lanes	10
Configs	1x4, 2x2, 1x2+2x1, 4x1

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

HD Graphics 615

Designer

Intel

Device ID

0x591E

Execution Units

24

Max Displays

3

Max Memory

16 GiB

16,384 MiB
16,777,216 KiB
17,179,869,184 B

Frequency

300 MHz

0.3 GHz
300,000 KHz

Burst Frequency

900 MHz

0.9 GHz
900,000 KHz

Output

DP, eDP, HDMI, DVI

Max Resolution

HDMI	4096x2304 @24 Hz
DP	4096x2304 @60 Hz
eDP	4096x2304 @60 Hz

Standards

DirectX	12
OpenGL	4.4
OpenCL	2.0
DP	1.2
eDP	1.4
HDMI	1.4a

Additional Features

Intel Quick Sync Video

Intel InTru 3D

Intel Clear Video

Intel Clear Video HD

[Edit] Kaby Lake (Gen9.5) Hardware Accelerated Video Capabilities
Codec	Encode			Decode
Codec	Profiles	Levels	Max Resolution	Profiles	Levels	Max Resolution
MPEG-2 (H.262)	Main	High	1080p (FHD)	Main	Main, High	1080p (FHD)
MPEG-4 AVC (H.264)	High, Main	5.1	2160p (4K)	Main, High, MVC, Stereo	5.1	2160p (4K)
JPEG/MJPEG	Baseline	-	16k x 16k	Baseline	Unified	16k x 16k
HEVC (H.265)	Main, Main 10	5.1	2160p (4K)	Main, Main 10	5.1	2160p (4K)
VC-1	✘			Advanced, Main, Simple	3, High, Simple	3840x3840
VP8	Unified	Unified	N/A	0	Unified	1080p
VP9	0		2160p (4K)	0, 2	Unified	2160p (4K)

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX	MMX Extension
EMMX	Extended MMX Extension
SSE	Streaming SIMD Extensions
SSE2	Streaming SIMD Extensions 2
SSE3	Streaming SIMD Extensions 3
SSSE3	Supplemental SSE3
SSE4.1	Streaming SIMD Extensions 4.1
SSE4.2	Streaming SIMD Extensions 4.2
SSE4a	Streaming SIMD Extensions 4a
AVX	Advanced Vector Extensions
AVX2	Advanced Vector Extensions 2
ABM	Advanced Bit Manipulation
BMI1	Bit Manipulation Instruction Set 1
BMI2	Bit Manipulation Instruction Set 2
FMA3	3-Operand Fused-Multiply-Add
AES	AES Encryption Instructions
RdRand	Hardware RNG
ADX	Multi-Precision Add-Carry
CLMUL	Carry-less Multiplication Extension
F16C	16-bit Floating Point Conversion

x86-16	16-bit x86
x86-32	32-bit x86
x86-64	64-bit x86
Real	Real Mode
Protected	Protected Mode
SMM	System Management Mode
FPU	Integrated x87 FPU
NX	No-eXecute
HT	Hyper-Threading
TBT 2.0	Turbo Boost Technology 2.0
EIST	Enhanced SpeedStep Technology
SST	Speed Shift Technology
VT-x	VT-x (Virtualization)
VT-d	VT-d (I/O MMU virtualization)
EPT	Extended Page Tables (SLAT)
MPX	Memory Protection Extensions
SGX	Software Guard Extensions
Secure Key	Secure Key Technology
SMEP	OS Guard Technology
Flex Memory	Flex Memory Access
ISRT	Smart Response Technology
MWT	My WiFi Technology

@@ Line 10: / Line 10: @@
 | model number        = M3-7Y32
 | part number         = HE8067702739830
-| part number 1       =
+| part number 2       =
-| part number 2       =
+| part number 3       =
 | s-spec              = SR346
 | s-spec 2            =

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core M3-7Y32 - Intel#io +
base frequency	1,100 MHz (1.1 GHz, 1,100,000 kHz) +
bus rate	4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus type	OPI +
clock multiplier	11 +
core count	2 +
core family	6 +
core model	142 +
core name	Kaby Lake Y +
core stepping	H0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x591E +
family	Core M3 +
first launched	April 10, 2017 +
full page name	intel/core m/m3-7y32 +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology +, OS Guard +, Extended Page Tables +, Memory Protection Extensions + and Software Guard Extensions +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel turbo boost technology 2 0	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	HD Graphics 615 +
integrated gpu base frequency	300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	8-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description	12-way set associative +
l3$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldate	April 10, 2017 +
main image	+
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth	27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels	2 +
max pcie lanes	10 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	M3-7Y32 +
name	Core M3-7Y32 +
package	FCBGA-1515 +
part number	HE8067702739830 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-spec	SR346 +
series	m3-7Y +
smp max ways	1 +
supported memory type	DDR3L-1600 + and LPDDR3-1866 +
tdp	4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down	3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency	600 MHz (0.6 GHz, 600,000 kHz) +
tdp up	7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency	1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technology	CMOS +
thread count	4 +
turbo frequency (1 core)	3,000 MHz (3 GHz, 3,000,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Revision as of 17:37, 30 June 2017

Contents

Cache

Memory controller

Expansions

Graphics

Features