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Difference between revisions of "dec/microarchitectures/alpha 21264"
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+ | '''Alpha 21264''' was an [[Alpha]] microarchitecture designed by [[DEC]] and introduced in 1998 by [[Compaq]] as a successor to the {{\\|Alpha 21164}} architecture. | ||
+ | |||
+ | == Process Technology == | ||
+ | {{see also|0.35 µm process}} | ||
+ | Alpha 21264 was manufactured on a [[0.35 µm process]] at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers and allowed for a supply voltage limited to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V. | ||
+ | |||
+ | == Architecture == | ||
+ | {{empty section}} | ||
+ | * Integrated PLL (designed by [[Swiss Center for Electronics and Microtechnology|CSEM]]) | ||
+ | == Die == | ||
+ | * 15,200,000 transistors | ||
+ | ** 9,200,000 cache | ||
+ | ** 6,000,000 logic | ||
+ | * [[0.35 µm]] | ||
+ | * 16.7 mm x 18.8 mm | ||
+ | * 313.96 mm² die size | ||
+ | * PGA-587 package | ||
+ | ** 389 signal pins | ||
+ | |||
+ | |||
+ | : [[File:alpha 21264 die shot.png|650px]] | ||
+ | |||
+ | == All Alpha 21264 chips == | ||
+ | {{empty section}} | ||
+ | |||
+ | == References == | ||
+ | * Dobberpuhl, Daniel W. "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]." Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on. IEEE, 1997. |
Revision as of 23:24, 8 June 2017
Edit Values | |
Alpha 21264 µarch | |
General Info | |
Arch Type | CPU |
Designer | DEC |
Manufacturer | DEC, Intel |
Introduction | February, 1998 |
Process | 0.35 µm |
Core Configs | 1 |
Pipeline | |
Type | Superscalar |
OoOE | Yes |
Speculative | Yes |
Reg Renaming | Yes |
Stages | 6 |
Decode | 4-way |
Instructions | |
ISA | Alpha |
Cache | |
L1I Cache | 64 KiB/core 2-way set associative |
L1D Cache | 64 KiB/core 2-way set associative |
Succession | |
Alpha 21264 was an Alpha microarchitecture designed by DEC and introduced in 1998 by Compaq as a successor to the Alpha 21164 architecture.
Process Technology
- See also: 0.35 µm process
Alpha 21264 was manufactured on a 0.35 µm process at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers and allowed for a supply voltage limited to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V.
Architecture
This section is empty; you can help add the missing info by editing this page. |
- Integrated PLL (designed by CSEM)
Die
- 15,200,000 transistors
- 9,200,000 cache
- 6,000,000 logic
- 0.35 µm
- 16.7 mm x 18.8 mm
- 313.96 mm² die size
- PGA-587 package
- 389 signal pins
All Alpha 21264 chips
This section is empty; you can help add the missing info by editing this page. |
References
- Dobberpuhl, Daniel W. "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]." Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on. IEEE, 1997.
Facts about "Alpha 21264 - Microarchitectures - DEC"
codename | Alpha 21264 + |
core count | 1 + |
designer | DEC + |
first launched | February 1998 + |
full page name | dec/microarchitectures/alpha 21264 + |
instance of | microarchitecture + |
instruction set architecture | Alpha + |
manufacturer | DEC +, Intel + and Samsung + |
microarchitecture type | CPU + |
name | Alpha 21264 + |
pipeline stages | 6 + |
process | 350 nm (0.35 μm, 3.5e-4 mm) + |