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Difference between revisions of "intel/mobile pentium ii/300pe"
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| package 2 = PBGA-B615 | | package 2 = PBGA-B615 | ||
| package type 2 = PBGA | | package type 2 = PBGA | ||
+ | | package 3 = MMC-1 | ||
+ | | package type 3 = | ||
+ | | package 4 = MMC-2 | ||
+ | | package type 4 = | ||
| socket = 240-pin connector | | socket = 240-pin connector | ||
| socket type = | | socket type = | ||
| socket 2 = BGA615 | | socket 2 = BGA615 | ||
| socket type 2 = BGA | | socket type 2 = BGA | ||
+ | | socket 3 = 280-pin connector | ||
+ | | socket 4 = 280-pin connector | ||
}} | }} | ||
− | The '''Mobile Pentium II 300PE''' was part of the second batch ("Performance Enhanced") of the {{intel|Mobile Pentium II}} family | + | The '''Mobile Pentium II 300PE''' was a {{arch|32}} [[x86]] microprocessor, part of the second batch ("Performance Enhanced") of the {{intel|Mobile Pentium II}} family. This MPU operated at 300 MHz and had a TDP of 11.6 Watts. This chip was manufactured in [[250 nm process]] and includes a smaller 256 KB of [[L2$]] on-die. |
This is an improvement from the original {{intel|Mobile Pentium II}} ({{\\|300}}) chips which had a larger (512 KB) L2$ but operated at half core speed while being manufactured on a separate die and packaged together. | This is an improvement from the original {{intel|Mobile Pentium II}} ({{\\|300}}) chips which had a larger (512 KB) L2$ but operated at half core speed while being manufactured on a separate die and packaged together. |
Revision as of 16:14, 30 April 2016
Template:mpu The Mobile Pentium II 300PE was a 32-bit x86 microprocessor, part of the second batch ("Performance Enhanced") of the Mobile Pentium II family. This MPU operated at 300 MHz and had a TDP of 11.6 Watts. This chip was manufactured in 250 nm process and includes a smaller 256 KB of L2$ on-die.
This is an improvement from the original Mobile Pentium II (300) chips which had a larger (512 KB) L2$ but operated at half core speed while being manufactured on a separate die and packaged together.
Contents
Cache
- Main article: P6's Cache
Cache Info [Edit Values] | ||
L1I$ | 16 KB "KB" is not declared as a valid unit of measurement for this property. |
1x16 KB 4-way set associative |
L1D$ | 16 KB "KB" is not declared as a valid unit of measurement for this property. |
1x16 KB 4-way set associative |
L2$ | 256 KB "KB" is not declared as a valid unit of measurement for this property. |
1x256 KB 4-way set associative (on-die) |
Graphics
This processor has no integrated graphics processing unit.
Memory controller
This processor has no integrated memory controller.
Features
Facts about "Mobile Pentium II 300PE - Intel"
base frequency | 300 MHz (0.3 GHz, 300,000 kHz) + |
bus speed | 66 MHz (0.066 GHz, 66,000 kHz) + |
bus type | FSB + |
clock multiplier | 4.5 + |
core count | 1 + |
core family | 6 + |
core model | 6 + |
core name | Dixon + |
core stepping | mdpA0 +, mdbA0 + and mdxA0 + |
core voltage | 1.6 V (16 dV, 160 cV, 1,600 mV) + |
core voltage tolerance | 0.12 V + |
cpuid | 066Ah + |
designer | Intel + |
die area | 180 mm² (0.279 in², 1.8 cm², 180,000,000 µm²) + |
family | Mobile Pentium II + |
first announced | 1998 + |
first launched | January 25, 1999 + |
full page name | intel/mobile pentium ii/300pe + |
has locked clock multiplier | true + |
instance of | microprocessor + |
l1d$ description | 4-way set associative + |
l1d$ size | 16 KiB (16,384 B, 0.0156 MiB) + |
l1i$ description | 4-way set associative + |
l1i$ size | 16 KiB (16,384 B, 0.0156 MiB) + |
l2$ description | 4-way set associative + |
l2$ size | 0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) + |
ldate | January 25, 1999 + |
manufacturer | Intel + |
market segment | Mobile + |
max cpu count | 1 + |
max memory | 65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) + |
max operating temperature | 85 °C + |
microarchitecture | P6 + |
min operating temperature | -40 °C + |
model number | 300PE + |
name | Mobile Pentium II 300PE + |
part number | PMG30002002AA +, KC80524KX300256 + and KP80524KX300256 + |
process | 250 nm (0.25 μm, 2.5e-4 mm) + |
s-spec | SL3HJ +, SL32R + and SL32N + |
smp max ways | 1 + |
tdp | 11.6 W (11,600 mW, 0.0156 hp, 0.0116 kW) + |
technology | CMOS + |
thread count | 1 + |
transistor count | 27,400,000 + |
word size | 32 bit (4 octets, 8 nibbles) + |