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{{nervana title|NNP-T 1400}} | {{nervana title|NNP-T 1400}} | ||
− | {{chip}} | + | {{chip |
− | '''NNP-T 1400''' is a [[neural processor]] designed by [[Intel Nervana]] and introduced in late 2019. Fabricated on TSMC [[16 nm process]] based on the {{nervana|Spring Crest|l=arch}} microarchitecture, the NNP-T 1400 has the full 24 {{nervana|Spring Crest#Tensor Processing Cluster (TPC)|TPCs|l=arch}} enabled along with 60 MiB of scratchpad memory and operates at up to 1.1 GHz. This chip comes in an [[OPC OAM|OAM]] [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}} for scale-out capabilities. | + | |name=NNP-T 1400 |
+ | |image=spring crest package (front).png | ||
+ | |back image=spring crest package (back).png | ||
+ | |caption=NPU with 4 HBM2 stacks | ||
+ | |designer=Intel | ||
+ | |manufacturer=TSMC | ||
+ | |model number=NNP-T 1400 | ||
+ | |market=Server | ||
+ | |first announced=November 12, 2019 | ||
+ | |first launched=November 12, 2019 | ||
+ | |family=NNP | ||
+ | |series=NNP-T | ||
+ | |frequency=1,100 MHz | ||
+ | |microarch=Spring Crest | ||
+ | |process=16 nm | ||
+ | |transistors=27,000,000,000 | ||
+ | |technology=CMOS | ||
+ | |die area=680 mm² | ||
+ | |core count=24 | ||
+ | |max memory=32 GiB | ||
+ | |smp interconnect=InterChip Link | ||
+ | |smp interconnect links=16 | ||
+ | |smp interconnect rate=28 GT/s | ||
+ | |power=175 W | ||
+ | |tdp=375 W | ||
+ | |package name 1=intel,fcbga_3325 | ||
+ | }} | ||
+ | '''NNP-T 1400''' is a [[training]] [[neural processor]] designed by [[Intel Nervana]] and introduced in late 2019. Fabricated on TSMC [[16 nm process]] based on the {{nervana|Spring Crest|l=arch}} microarchitecture, the NNP-T 1400 has the full 24 {{nervana|Spring Crest#Tensor Processing Cluster (TPC)|TPCs|l=arch}} enabled along with 60 MiB of scratchpad memory and operates at up to 1.1 GHz. This chip comes in an [[OPC OAM|OAM]] [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}} for scale-out capabilities. | ||
+ | [[File:spring crest mezzanine card (front).png|thumb|right|NNP-T 1400 [[OCP OAM|Mezzanine Card]].]] | ||
+ | |||
+ | == Peak Performance == | ||
+ | The NNP-T 1400 has a peak performance of [[peak flops (half-precision)::108 TFLOPS]] ([[bfloat16]]). | ||
+ | |||
+ | == Cache == | ||
+ | {{main|nervana/microarchitectures/spring_crest#Memory_Hierarchy|l1=Spring Crest § Cache}} | ||
+ | * 60 MiB of tightly-coupled scratchpad memory | ||
+ | ** 24 x 2.5 MiB/core | ||
+ | |||
+ | == Memory controller == | ||
+ | {{memory controller | ||
+ | |type=HBM2-2400 | ||
+ | |ecc=Yes | ||
+ | |max mem=32 GiB | ||
+ | |controllers=4 | ||
+ | |channels=32 | ||
+ | |max bandwidth=1.2288 TB/s | ||
+ | }} | ||
+ | |||
+ | == Interconnect Topology == | ||
+ | The NNP-T 1400 comes in an [[OCP OAM]] mezzanine card which enables support for various topologies including [[ring topology|ring]], [[hybrid cube mesh]], and [[fully connected]]. | ||
+ | |||
+ | == Die == | ||
+ | {{main|nervana/microarchitectures/spring_crest#Die|l1=Spring Crest § Die}} | ||
+ | * 27,000,000,000 transistors | ||
+ | * 680 mm² die size | ||
+ | |||
+ | |||
+ | :[[File:spring crest floorplan.png|400px|link=nervana/microarchitectures/spring_crest#Die]] | ||
+ | |||
+ | == Product Brief == | ||
+ | * [[:File:16433-1 NNP-announce NNP-T brief v4.3.pdf|Intel NNP-T Product Brief]] |
Latest revision as of 09:51, 1 February 2020
Edit Values | |
NNP-T 1400 | |
NPU with 4 HBM2 stacks | |
General Info | |
Designer | Intel |
Manufacturer | TSMC |
Model Number | NNP-T 1400 |
Market | Server |
Introduction | November 12, 2019 (announced) November 12, 2019 (launched) |
Shop | Amazon |
General Specs | |
Family | NNP |
Series | NNP-T |
Frequency | 1,100 MHz |
Microarchitecture | |
Microarchitecture | Spring Crest |
Process | 16 nm |
Transistors | 27,000,000,000 |
Technology | CMOS |
Die | 680 mm² |
Cores | 24 |
Max Memory | 32 GiB |
Multiprocessing | |
Interconnect | InterChip Link |
Interconnect Links | 16 |
Interconnect Rate | 28 GT/s |
Electrical | |
Power dissipation | 175 W |
TDP | 375 W |
Packaging | |
Package | FCBGA-3325 (FCBGA) |
Dimension | 60 mm × 60 mm |
Contacts | 3325 |
NNP-T 1400 is a training neural processor designed by Intel Nervana and introduced in late 2019. Fabricated on TSMC 16 nm process based on the Spring Crest microarchitecture, the NNP-T 1400 has the full 24 TPCs enabled along with 60 MiB of scratchpad memory and operates at up to 1.1 GHz. This chip comes in an OAM accelerator card form factor and incorporates 32 GiB of HBM2 memory. This NPU exposes 16 inter-chip links for scale-out capabilities.
Contents
Peak Performance[edit]
The NNP-T 1400 has a peak performance of 108 TFLOPS108,000,000,000,000 FLOPS
108,000,000,000 KFLOPS
108,000,000 MFLOPS
108,000 GFLOPS
0.108 PFLOPS
(bfloat16).
108,000,000,000 KFLOPS
108,000,000 MFLOPS
108,000 GFLOPS
0.108 PFLOPS
Cache[edit]
- Main article: Spring Crest § Cache
- 60 MiB of tightly-coupled scratchpad memory
- 24 x 2.5 MiB/core
Memory controller[edit]
Integrated Memory Controller
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Interconnect Topology[edit]
The NNP-T 1400 comes in an OCP OAM mezzanine card which enables support for various topologies including ring, hybrid cube mesh, and fully connected.
Die[edit]
- Main article: Spring Crest § Die
- 27,000,000,000 transistors
- 680 mm² die size
Product Brief[edit]
Facts about "NNP-T 1400 - Intel Nervana"
full page name | nervana/nnp/nnp-t 1400 + |
instance of | microprocessor + |
ldate | 1900 + |