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Difference between revisions of "qualcomm/snapdragon 800/845"
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|thread count=8
 
|thread count=8
 
|max cpus=1
 
|max cpus=1
−
|max memory=8 GiB
+
|max memory=10 GiB
 
|predecessor=Snapdragon 835
 
|predecessor=Snapdragon 835
 
|predecessor link=qualcomm/snapdragon_800/835
 
|predecessor link=qualcomm/snapdragon_800/835
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}}
 
}}
 
[[File:sdm845 block diagram.jpg|thumb|right|Block diagram]]
 
[[File:sdm845 block diagram.jpg|thumb|right|Block diagram]]
−
'''Snapdragon 845''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2017]]. Fabricated on Samsung's [[10nm process|10nm 10LPP]], the 845 features four [[Kryo 385 Silver]] high-efficiency cores operating at 1.7 GHz along with four high-performance [[Kryo 385 Gold]] cores operating at 2.8 GHz. The Snapdragon 845 integrates the {{qualcomm|Adreno 630}} [[GPU]] operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.
+
'''Snapdragon 845''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2017]]. Fabricated on Samsung's [[10nm process|10nm 10LPP]], the 845 features four [[Kryo 385 Silver]] high-efficiency cores operating at 1.7 GHz along with four high-performance [[Kryo 385 Gold]] cores operating at 2.8 GHz. The Snapdragon 845 integrates the {{qualcomm|Adreno 630}} [[GPU]] operation at 710 MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.
  
 
== Cache ==
 
== Cache ==
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| gpu                = Adreno 630 GPU
 
| gpu                = Adreno 630 GPU
 
| designer            = Qualcomm
 
| designer            = Qualcomm
−
| execution units    =  
+
| execution units    = 2 (256x2 ALU)
 
| max displays        = 2
 
| max displays        = 2
 
| max memory          =  
 
| max memory          =  
−
| frequency          =  
+
| frequency          = 710 MHz
 
| max frequency      =  
 
| max frequency      =  
  
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== Utilizing devices ==
 
== Utilizing devices ==
−
* [[used by::Oppo Find X]]
+
 
 
* [[used by::Asus Zenfone 5Z]]
 
* [[used by::Asus Zenfone 5Z]]
 +
* [[used by::comma three]]
 
* [[used by::Google Pixel 3]]
 
* [[used by::Google Pixel 3]]
 
* [[used by::Google Pixel 3 XL]]
 
* [[used by::Google Pixel 3 XL]]
Line 189: Line 190:
 
* [[used by::LG V35 ThinQ]]
 
* [[used by::LG V35 ThinQ]]
 
* [[used by::LG V40 ThinQ]]
 
* [[used by::LG V40 ThinQ]]
 +
* [[used by::Nokia 9 PureView]]
 
* [[used by::OnePlus 6]]
 
* [[used by::OnePlus 6]]
 
* [[used by::OnePlus 6T]]
 
* [[used by::OnePlus 6T]]
 +
* [[used by::Oppo Find X]]
 +
* [[used by::Razer Phone 2]]
 
* [[used by::Samsung Galaxy Note9]]
 
* [[used by::Samsung Galaxy Note9]]
 
* [[used by::Samsung Galaxy S9]]
 
* [[used by::Samsung Galaxy S9]]
 
* [[used by::Samsung Galaxy S9+]]
 
* [[used by::Samsung Galaxy S9+]]
 +
* [[used by::Shift 6mq]]
 
* [[used by::Sony Xperia XZ2]]
 
* [[used by::Sony Xperia XZ2]]
 
* [[used by::Sony Xperia XZ2 compact]]
 
* [[used by::Sony Xperia XZ2 compact]]
 +
* [[used by::Sony Xperia XZ2 Premium]]
 
* [[used by::Sony Xperia XZ3]]
 
* [[used by::Sony Xperia XZ3]]
−
* [[used by::PocoPhone f1]]
 
 
* [[used by::Xiaomi Mi Mix 3]]
 
* [[used by::Xiaomi Mi Mix 3]]
 +
* [[used by::Xiaomi Mi Mix 2s]]
 
* [[used by::Xiaomi Mi 8]]
 
* [[used by::Xiaomi Mi 8]]
−
* [[used by:: ZTE Axon 9 Pro]]
+
* [[used by::Xiaomi Pocophone F1]]
 +
* [[used by::ZTE Axon 9 Pro]]
 
{{expand list}}
 
{{expand list}}
 +
 +
== Die ==
 +
* Samsung [[10LPP|10nm 10LPP]]
 +
* 95 mm²
 +
 +
 +
:''Die photo by [https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown TechInsights]''
 +
:[[File:845 die shot.png|500px]]
  
 
== Documents ==
 
== Documents ==

Latest revision as of 14:22, 17 June 2023

Edit Values
Snapdragon 845
sdm845 (front).png
Chip package, front
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerSamsung
Model NumberSDM845
Part NumberSDM845
IntroductionDecember 6, 2017 (announced)
February, 2018 (launched)
General Specs
FamilySnapdragon 800
Series800
Frequency2,800 MHz, 1,700 MHz
Microarchitecture
ISAARMv8.2 (ARM)
MicroarchitectureCortex-A75, Cortex-A55
Core NameKryo 385 Gold, Kryo 385 Silver
Process10 nm
Transistors5,300,000,000
TechnologyCMOS
Die95 mm²
Word Size64 bit
Cores8
Threads8
Max Memory10 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sdm845 (back).png
Succession
Block diagram

Snapdragon 845 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2017. Fabricated on Samsung's 10nm 10LPP, the 845 features four Kryo 385 Silver high-efficiency cores operating at 1.7 GHz along with four high-performance Kryo 385 Gold cores operating at 2.8 GHz. The Snapdragon 845 integrates the Adreno 630 GPU operation at 710 MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

Cache[edit]

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache


Quad-core cluster Cortex-A75:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB8-way set associative 

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
524,288 B
0.5 MiB
L1I$256 KiB
262,144 B
0.25 MiB
4x64 KiB2-way set associative 
L1D$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  4x128 KiB8-way set associative 
  • 2 MiB L3

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3833
Supports ECCNo
Max Mem8 GiB
Frequency1866 MHz
Controllers1
Channels4
Width16 bit
Max Bandwidth29.87 GiB/s
30,586.88 MiB/s
32.073 GB/s
32,072.668 MB/s
0.0292 TiB/s
0.0321 TB/s
Bandwidth
Single 7.47 GiB/s
Double 14.93 GiB/s
Quad 29.87 GiB/s

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 630 GPU
DesignerQualcomm
Execution Units2 (256x2 ALU)
"(256x2ALU)" can not be assigned to a declared number type with value 2.
Max Displays2
Frequency710 MHz
0.71 GHz
710,000 KHz
Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.0
  • UHD video playback/encoding @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
  • Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
  • H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C support

Audio[edit]

  • Qualcomm Aqstic audio codec and speaker amplifier
  • Qualcomm aptX audio playback with support for aptX Classic and HD
  • Native DSD support, PCM up to 384kHz/32bit

Camera[edit]

  • Image Signal Processor
    • Qualcomm Spectra 280
    • New architecture for 14-bit image signal processing, with support for up to:
      • Single HFR 16 MPix camera at 60fps ZSL
      • Dual 16 MPix cameras at 30fps ZSL
      • Single 32 MPix camera at 30fps ZSL
    • Can connect up to 7 different cameras (many configurations possible)
      • Multi-frame Noise Reduction (MFNR) with accelerated image stabilization
      • Hybrid Autofocus with support for dual phase detection (2PD) sensors
      • Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
      • Higher quality video capture with Motion Compensated Temporal Filtering (MCTF)
      • 3D structured light active depth sensing, with accelerated face detection/recognition

Connectivity[edit]

  • X20 LTE Modem
    • Downlink:
      • LTE Cat 18 up to 1.2 Gbps, 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
    • Uplink:
      • LTE Cat 13 up to 150 Mbps, Upload+ (2x20 MHz carrier aggregation, up to 64-QAM)
    • License Assisted Access (LAA)
    • Citizens Broadband Radio Service (CBRS) shared radio spectrum
    • Dual SIM Dual VoLTE (DSDV)
    • All Mode with support for all major cellular modes plus LAA.
      • VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G
      • Voice over Wi-Fi (VoWiFi) with LTE call continuity
  • Wi-Fi
    • 802.11ad Multi-gigabit with 60 GHz diversity module
    • 802.11ac 2x2 with MU-MIMO
    • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
    • 11k/r/v: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi
  • Bluetooth
    • Bluetooth 5.0
      • Proprietary enhancements
        • Ultra-low power wireless earbuds
        • Direct audio broadcast to multiple devices

Location[edit]

  • Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Low Power Geofencing and Tracking, Sensor-assisted Navigation

Utilizing devices[edit]

  • Asus Zenfone 5Z
  • comma three
  • Google Pixel 3
  • Google Pixel 3 XL
  • HTC U12+
  • LG G7 ThinQ
  • LG V35 ThinQ
  • LG V40 ThinQ
  • Nokia 9 PureView
  • OnePlus 6
  • OnePlus 6T
  • Oppo Find X
  • Razer Phone 2
  • Samsung Galaxy Note9
  • Samsung Galaxy S9
  • Samsung Galaxy S9+
  • Shift 6mq
  • Sony Xperia XZ2
  • Sony Xperia XZ2 compact
  • Sony Xperia XZ2 Premium
  • Sony Xperia XZ3
  • Xiaomi Mi Mix 3
  • Xiaomi Mi Mix 2s
  • Xiaomi Mi 8
  • Xiaomi Pocophone F1
  • ZTE Axon 9 Pro

This list is incomplete; you can help by expanding it.

Die[edit]


Die photo by TechInsights
845 die shot.png

Documents[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/snapdragon_800/845&oldid=101836"
Facts about "Snapdragon 845 - Qualcomm"
RDF feed
back imageFile:sdm845 (back).png +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) + and 1,700 MHz (1.7 GHz, 1,700,000 kHz) +
core count8 +
core nameKryo 385 Gold + and Kryo 385 Silver +
designerQualcomm + and ARM Holdings +
die area95 mm² (0.147 in², 0.95 cm², 95,000,000 µm²) +
dspHexagon 685 DSP +
familySnapdragon 800 +
first announcedDecember 6, 2017 +
first launchedFebruary 2018 +
full page namequalcomm/snapdragon 800/845 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 630 GPU +
integrated gpu designerQualcomm +
isaARMv8.2 +
isa familyARM +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description4-way set associative + and 2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateFebruary 2018 +
main imageFile:sdm845 (front).png +
main image captionChip package, front +
manufacturerSamsung +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth29.87 GiB/s (30,586.88 MiB/s, 32.073 GB/s, 32,072.668 MB/s, 0.0292 TiB/s, 0.0321 TB/s) +
max memory channels4 +
microarchitectureCortex-A75 + and Cortex-A55 +
model numberSDM845 +
nameSnapdragon 845 +
part numberSDM845 +
process10 nm (0.01 μm, 1.0e-5 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-3833 +
technologyCMOS +
thread count8 +
transistor count5,300,000,000 +
used byOppo Find X +, Asus Zenfone 5Z +, Google Pixel 3 +, Google Pixel 3 XL +, HTC U12+ +, LG G7 ThinQ +, LG V35 ThinQ +, LG V40 ThinQ +, OnePlus 6 +, OnePlus 6T +, Samsung Galaxy Note9 +, Samsung Galaxy S9 +, Samsung Galaxy S9+ +, Sony Xperia XZ2 +, Sony Xperia XZ2 compact +, Sony Xperia XZ3 +, PocoPhone f1 +, Xiaomi Mi Mix 3 +, Xiaomi Mi 8 +, Xiaomi Mi 9 SE + and ZTE Axon 9 Pro +
word size64 bit (8 octets, 16 nibbles) +