Difference between revisions of "renesas/r-car/h3"

	Edit Values
	R-Car H3
	General Info
Designer	Renesas,; ARM Holdings
Manufacturer	TSMC
Model Number	H3
Part Number	R8A77950
Market	Embedded
Introduction	December 2, 2015 (announced); March, 2018 (launched)
	General Specs
Family	R-Car
Series	3rd Gen
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53, Cortex-A57, Cortex-R7
Core Name	Cortex-A53, Cortex-A57, Cortex-R7
Process	16 nm
Technology	CMOS
Die	111.36 mm²; 12.94 mm × 8.61 mm
Word Size	64 bit
Cores	9
Threads	9
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
Vcore	0.8 V
VI/O	3.3 V
	Packaging
Package	FCBGA-1384 (BGA)
Dimension	21 mm x 21 mm
Pitch	0.50 mm
Ball Count	1384
Interconnect	BGA-1384

Latest revision as of 14:43, 29 December 2018

R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a dual-core lock-step Cortex-R7 for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6650 GPU.

Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache

Cortex-A57 Cluster:

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

256 KiB

262,144 B
0.25 MiB

L1I$	128 KiB 131,072 B 0.125 MiB	4x48 KiB
L1D$	128 KiB 131,072 B 0.125 MiB	4x32 KiB

L2$

2 MiB

2,048 KiB
2,097,152 B
0.00195 GiB

		1x2 MiB

Cortex-A53 Cluster:

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

256 KiB

262,144 B
0.25 MiB

L1I$	128 KiB 131,072 B 0.125 MiB	4x32 KiB
L1D$	128 KiB 131,072 B 0.125 MiB	4x32 KiB

L2$

512 KiB

0.5 MiB
524,288 B
4.882812e-4 GiB

		1x512 KiB

Memory controller[edit]

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR4-3200
Supports ECC	No
Controllers	1
Channels	4
Width	32 bit
Max Bandwidth	47.68 GiB/s 48,824.32 MiB/s 51.196 GB/s 51,196.01 MB/s 0.0466 TiB/s 0.0512 TB/s
Bandwidth	Single 11.92 GiB/s Double 23.84 GiB/s Quad 47.68 GiB/s

Expansions[edit]

PCI Express2.0 (1 lane) x 2 ch
USB 3.0 Host interface (DRD) × 1 ports (wPHY)
USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
SD Host interface × 4 ch (SDR104)
Multimedia card interface × 2 ch
Serial ATA interface × 1 ch
Media local bus (MLB) Interface × 1 ch (3 pin interface)
Controller Area Network (CAN-FD support) Interface × 2ch
Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
32bit timer x 26 ch
PWM timer × 7 ch
I2C bus interface × 7 ch
Serial communication interface (SCIF) × 11 ch
Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
Ethernet controller (IEEE802.3u, RMII, without PHY)
Digital radio interface (DRIF) × 4 ch

Graphics[edit]

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU	PowerVR GX6650
Designer	Imagination Technologies

Features[edit]

[Edit/Modify Supported Features]

Supported ARM Extensions & Processor Features

VFPv4	Vector Floating Point (VFP) v4 Extension
NEON	Advanced SIMD extension
TrustZone	TrustZone Security Extensions

Block Diagram[edit]

Die[edit]

16 nm process, CMOS FinFET
12.94 mm × 8.61 mm
111.36 mm² die size
Quad-core Cortex-A53
- ~3.27 mm² cluster
- ~0.60 mm² core
- ~0.7`mm² L2 cache
Quad-core Cortex-A57
- ~10.21 mm² cluster
- ~1.66 mm² core
- ~3.28 mm² L2 cache
Cortex-R7 (dual-core lock-step)
- ~1.04 mm² cluster
GX6650 GPU
- ~28.12 mm²

Bibliography[edit]

Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
Shibahara, Shinichi, et al. "A 16 nm FinFET Heterogeneous Nona-Core SoC Supporting ISO26262 ASIL B Standard." IEEE Journal of Solid-State Circuits 52.1 (2017): 77-88.

@@ Line 41: / Line 41: @@
 == Cache ==
 {{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
+Cortex-A57 Cluster:
+{{cache size
+|l1 cache=256 KiB
+|l1i cache=128 KiB
+|l1i break=4x48 KiB
+|l1d cache=128 KiB
+|l1d break=4x32 KiB
+|l2 cache=2 MiB
+|l2 break=1x2 MiB
+}}
+Cortex-A53 Cluster:
 {{cache size
-|l1 cache=640 KiB
+|l1 cache=256 KiB
-|l1i cache=352 KiB
+|l1i cache=128 KiB
-|l1i break=4x48+5x32 KiB
+|l1i break=4x32 KiB
-|l1d cache=288 KiB
+|l1d cache=128 KiB
-|l1d break=9x32 KiB
+|l1d break=4x32 KiB
-|l2 cache=2.5 MiB
+|l2 cache=512 KiB
+|l2 break=1x512 KiB
 }}
@@ Line 128: / Line 144: @@
 ** ~1.04 mm² cluster
 * GX6650 GPU
-** 28.12 mm²
+** ~28.12 mm²

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	R-Car H3 - Renesas#package +
core count	9 +
core name	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage	0.8 V (8 dV, 80 cV, 800 mV) +
designer	Renesas + and ARM Holdings +
die area	111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) +
die length	12.94 mm (1.294 cm, 0.509 in, 12,940 µm) +
die width	8.61 mm (0.861 cm, 0.339 in, 8,610 µm) +
family	R-Car +
first announced	December 2, 2015 +
first launched	March 2018 +
full page name	renesas/r-car/h3 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	PowerVR GX6650 +
integrated gpu designer	Imagination Technologies +
io voltage	3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	640 KiB (655,360 B, 0.625 MiB) +
l1d$ size	288 KiB (294,912 B, 0.281 MiB) +
l1i$ size	352 KiB (360,448 B, 0.344 MiB) +
l2$ size	2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) +
ldate	March 2018 +
main image	+
manufacturer	TSMC +
market segment	Embedded +
max cpu count	1 +
max memory bandwidth	47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
model number	H3 +
name	R-Car H3 +
package	FCBGA-1384 +
part number	R8A77950 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	3rd Gen +
smp max ways	1 +
supported memory type	LPDDR4-3200 +
technology	CMOS +
thread count	9 +
word size	64 bit (8 octets, 16 nibbles) +

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