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** '''Mem:''' Dual-channel 64-bit DDR4-2666/2133 w/ ECC, up to 512 GiB | ** '''Mem:''' Dual-channel 64-bit DDR4-2666/2133 w/ ECC, up to 512 GiB | ||
** '''I/O:''' x32 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 8 SATA ports and up to 4 x 10GbE ports | ** '''I/O:''' x32 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 8 SATA ports and up to 4 x 10GbE ports | ||
− | ** '''TDP:''' | + | ** '''TDP:''' 30-50 W |
The ISA and Technology applies to all models. | The ISA and Technology applies to all models. |
Latest revision as of 15:06, 25 May 2019
AMD EPYC Embedded | |
![]() | |
EPYC Embedded logo | |
Developer | AMD |
Manufacturer | GlobalFoundries |
Type | System on chips |
Introduction | February 22, 2018 (announced) February 22, 2018 (launch) |
Architecture | Embedded x86 SoCs |
ISA | x86-64 |
µarch | Zen |
Word size | 64 bit 8 octets
16 nibbles |
Process | 14 nm 0.014 μm
1.4e-5 mm |
Technology | CMOS |
Clock | 1,500 MHz-2,700 MHz |
Socket | Socket SP4, Socket SP4r2 |
Succession | |
← | |
Opteron |
EPYC Embedded is a family of 64-bit multi-core x86 embedded microprocessors designed and introduced by AMD. Those processors are primarily aimed at networking, storage, and edge computing devices. EPYC Embedded effectively succeeded the Opteron A1100 series of embedded microprocessors (although those were actually based on ARM, not x86).
Overview[edit]
The EPYC Embedded family is a low-power variant of the EPYC line that primarily marketed towards embedded devices such as networking, storage, and edge computing devices. Those parts have lower TDPs and come in a much smaller package allowing for denser integration.
Members[edit]
3000 Series (Zen)[edit]
Introduced in early 2018, the 3000 embedded series is based on the Zen microarchitecture using the same dies as the server EPYC processors. 3000-series come in anywhere from 4 to 16 cores as well as with and without SMT support. Models with 8 or less cores come in a single-die configuration and uses a single-chip module Package SP4r4 while models with more than eight cores come in a dual-die configuration and use a multi-chip module Package SP4. Both packages are ball grid arrays (BGAs) and are pin-compatible with each other. Geared toward embedded applications means those parts have lower TDP than their server counterparts. Depending on the die configuration, the features of the dual-die config are mostly double that of the single-die config.
- Dual-die Models
- Mem: Quad-channel 64-bit DDR4-2666 w/ ECC, up to 1 TiB
- I/O: x64 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 16 SATA ports and up to 10 x 10GbE ports
- TDP: 65-100 W
- Single-die Models
- Mem: Dual-channel 64-bit DDR4-2666/2133 w/ ECC, up to 512 GiB
- I/O: x32 PCIe lanes MUX'ed with SATA/GbE and can be mixed configured PCIe and up to 8 SATA ports and up to 4 x 10GbE ports
- TDP: 30-50 W
The ISA and Technology applies to all models.
- ISA: Everything up to AVX2 (i.e., SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2), and SHA
- Tech: Precision Boost, 2-way SMT, AMD-Vi, AMD-V, Secure Memory Encryption (SME), and Secure Encrypted Virtualization (SEV)
List EPYC Embedded 3000-Series Processors | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Model | Price | Launched | Cores | Thread | L2$ | L3$ | TDP | Base | Turbo (Max) | Memory | PCIe Lanes |
Single-Chip Package (1 die) | |||||||||||
3101 | 21 February 2018 | 4 | 4 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 35 W 35,000 mW 0.0469 hp 0.035 kW | 2.1 GHz 2,100 MHz 2,100,000 kHz | 2.9 GHz 2,900 MHz 2,900,000 kHz | DDR4-2666 | ||
3151 | 21 February 2018 | 4 | 8 | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 45 W 45,000 mW 0.0603 hp 0.045 kW | 2.7 GHz 2,700 MHz 2,700,000 kHz | 2.9 GHz 2,900 MHz 2,900,000 kHz | DDR4-2666 | ||
3201 | 21 February 2018 | 8 | 8 | 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 30 W 30,000 mW 0.0402 hp 0.03 kW | 1.5 GHz 1,500 MHz 1,500,000 kHz | 3.1 GHz 3,100 MHz 3,100,000 kHz | DDR4-2133 | ||
3251 | $ 315.00 € 283.50 £ 255.15 ¥ 32,548.95 | 21 February 2018 | 8 | 16 | 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 55 W 55,000 mW 0.0738 hp 0.055 kW | 2.5 GHz 2,500 MHz 2,500,000 kHz | 3.1 GHz 3,100 MHz 3,100,000 kHz | DDR4-2666 | |
3255 | 8 | 16 | 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 55 W 55,000 mW 0.0738 hp 0.055 kW | 2.5 GHz 2,500 MHz 2,500,000 kHz | 3.1 GHz 3,100 MHz 3,100,000 kHz | DDR4-2666 | |||
Multi-Chip Package (2 dies) | |||||||||||
3301 | $ 450.00 € 405.00 £ 364.50 ¥ 46,498.50 | 21 February 2018 | 12 | 12 | 6 MiB 6,144 KiB 6,291,456 B 0.00586 GiB | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 65 W 65,000 mW 0.0872 hp 0.065 kW | 2 GHz 2,000 MHz 2,000,000 kHz | 3 GHz 3,000 MHz 3,000,000 kHz | DDR4-2666 | |
3351 | 21 February 2018 | 12 | 24 | 6 MiB 6,144 KiB 6,291,456 B 0.00586 GiB | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 80 W 80,000 mW 0.107 hp 0.08 kW | 1.9 GHz 1,900 MHz 1,900,000 kHz | 3 GHz 3,000 MHz 3,000,000 kHz | DDR4-2666 | ||
3401 | 21 February 2018 | 16 | 16 | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 85 W 85,000 mW 0.114 hp 0.085 kW | 1.85 GHz 1,850 MHz 1,850,000 kHz | 3 GHz 3,000 MHz 3,000,000 kHz | DDR4-2666 | ||
3451 | $ 880.00 € 792.00 £ 712.80 ¥ 90,930.40 | 21 February 2018 | 16 | 32 | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 100 W 100,000 mW 0.134 hp 0.1 kW | 2.15 GHz 2,150 MHz 2,150,000 kHz | 3 GHz 3,000 MHz 3,000,000 kHz | DDR4-2666 | |
Count: 9 |
Documents[edit]
See also[edit]
- AMD Ryzen Embedded
- Intel Xeon D
- Cavium ThunderX2
designer | AMD + |
first announced | February 22, 2018 + |
first launched | February 22, 2018 + |
full page name | amd/epyc embedded + |
instance of | system on a chip family + |
instruction set architecture | x86-64 + |
main designer | AMD + |
manufacturer | GlobalFoundries + |
microarchitecture | Zen + |
name | AMD EPYC Embedded + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
socket | Socket SP4 + and Socket SP4r2 + |
technology | CMOS + |
word size | 64 bit (8 octets, 16 nibbles) + |