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{{intel title|Celeron 827E}}
 
{{intel title|Celeron 827E}}
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{{mpu
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{{chip
 
|name=Celeron 827E
 
|name=Celeron 827E
 
|no image=Yes
 
|no image=Yes
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|package module 1={{packages/intel/fcbga-1023}}
 
|package module 1={{packages/intel/fcbga-1023}}
 
}}
 
}}
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'''Celeron 827E''' is a [[dual-core]] budget mobile embedded [[x86]] microprocessor introduced by [[Intel]] in mid-[[2011]]. The Celeron 827E operates at 1.4 GHz with a [[TDP]] of 17 W. This chip incorporates Intel's {{intel|HD Graphics (Sandy Bridge)|HD Graphics}} [[integrated graphics]] operating at 350 MHz with a bust frequency of 800 MHz.
+
'''Celeron 827E''' is a [[single-core]] budget mobile embedded [[x86]] microprocessor introduced by [[Intel]] in mid-[[2011]]. The Celeron 827E, which is based on the {{intel|Sandy Bridge|l=arch}} microarchitecture and is manufactured on a [[32 nm process]], operates at 1.4 GHz with a [[TDP]] of 17 W. This chip incorporates Intel's {{intel|HD Graphics (Sandy Bridge)|HD Graphics}} [[integrated graphics]] operating at 350 MHz with a burst frequency of 800 MHz. This processor supports 16 GiB of dual-channel DDR3-1333 ECC memory.
  
 
== Cache ==
 
== Cache ==
Line 130: Line 130:
  
 
== Features ==
 
== Features ==
−
{{x86 features}}
+
{{x86 features
 +
|real=Yes
 +
|protected=Yes
 +
|smm=Yes
 +
|fpu=Yes
 +
|x8616=Yes
 +
|x8632=Yes
 +
|x8664=Yes
 +
|nx=Yes
 +
|mmx=Yes
 +
|emmx=Yes
 +
|sse=Yes
 +
|sse2=Yes
 +
|sse3=Yes
 +
|ssse3=Yes
 +
|sse41=Yes
 +
|sse42=Yes
 +
|sse4a=No
 +
|avx=No
 +
|avx2=No
 +
|avx512f=No
 +
|avx512cd=No
 +
|avx512er=No
 +
|avx512pf=No
 +
|avx512bw=No
 +
|avx512dq=No
 +
|avx512vl=No
 +
|avx512ifma=No
 +
|avx512vbmi=No
 +
|avx5124fmaps=No
 +
|avx5124vnniw=No
 +
|avx512vpopcntdq=No
 +
|abm=No
 +
|tbm=No
 +
|bmi1=No
 +
|bmi2=No
 +
|fma3=No
 +
|fma4=No
 +
|aes=No
 +
|rdrand=No
 +
|sha=No
 +
|xop=No
 +
|adx=No
 +
|clmul=Yes
 +
|f16c=No
 +
|tbt1=No
 +
|tbt2=No
 +
|tbmt3=No
 +
|bpt=No
 +
|eist=Yes
 +
|sst=No
 +
|flex=Yes
 +
|fastmem=Yes
 +
|ivmd=No
 +
|intelnodecontroller=No
 +
|intelnode=No
 +
|kpt=No
 +
|ptt=No
 +
|intelrunsure=No
 +
|mbe=No
 +
|isrt=No
 +
|sba=No
 +
|mwt=No
 +
|sipp=No
 +
|att=No
 +
|ipt=No
 +
|tsx=No
 +
|txt=No
 +
|ht=No
 +
|vpro=No
 +
|vtx=Yes
 +
|vtd=No
 +
|ept=No
 +
|mpx=No
 +
|sgx=No
 +
|securekey=No
 +
|osguard=No
 +
|intqat=No
 +
|3dnow=No
 +
|e3dnow=No
 +
|smartmp=No
 +
|powernow=No
 +
|amdvi=No
 +
|amdv=No
 +
|amdsme=No
 +
|amdtsme=No
 +
|amdsev=No
 +
|rvi=No
 +
|smt=No
 +
|sensemi=No
 +
|xfr=No
 +
}}
 +
 
 +
== Documents ==
 +
=== Datasheet ===
 +
* [[:File:2nd-gen-core-family-mobile-vol-1-datasheet.pdf|Datasheet, Volume 1]]
 +
* [[:File:2nd-gen-core-family-mobile-vol-2-datasheet.pdf|Datasheet, Volume 2]]
 +
* [[:File:2nd-gen-core-mobile-ecc-datasheet-addendum.pdf|Datasheet Addendum for ECC models]]
 +
=== Other ===
 +
* [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
 +
* [[:File:2nd-gen-core-family-mobile-specification-update.pdf|2nd Gen Core Mobile Specification Update]]

Latest revision as of 18:19, 17 March 2018

Edit Values
Celeron 827E
General Info
DesignerIntel
ManufacturerIntel
Model Number827E
Part NumberAV8062701082300
S-SpecSR0C6
MarketEmbedded
IntroductionJuly, 2011 (announced)
July, 2011 (launched)
Release Price$89.00
ShopAmazon
General Specs
FamilyCeleron
Series800
LockedYes
Frequency1,400 MHz
Bus typeDMI 2.0
Bus rate4 × 5 GT/s
Clock multiplier14
CPUID0x206A7
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureSandy Bridge
PlatformSandy Bridge M
ChipsetCougar Point
Core NameSandy Bridge M
Core Family6
Core Model42
Core SteppingQ0
Process32 nm
Transistors504,000,000
TechnologyCMOS
Die131 mm²
Word Size64 bit
Cores1
Threads1
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Power (idle)2.3 W
Vcore0.3 V-1.52 V
TDP17 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1023 (BGA)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1023

Celeron 827E is a single-core budget mobile embedded x86 microprocessor introduced by Intel in mid-2011. The Celeron 827E, which is based on the Sandy Bridge microarchitecture and is manufactured on a 32 nm process, operates at 1.4 GHz with a TDP of 17 W. This chip incorporates Intel's HD Graphics integrated graphics operating at 350 MHz with a burst frequency of 800 MHz. This processor supports 16 GiB of dual-channel DDR3-1333 ECC memory.

Cache[edit]

Main article: Sandy Bridge § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$64 KiB
65,536 B
0.0625 MiB
L1I$32 KiB
32,768 B
0.0313 MiB
1x32 KiB8-way set associative 
L1D$32 KiB
32,768 B
0.0313 MiB
1x32 KiB8-way set associativewrite-back
L2$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
  1x256 KiB8-way set associativewrite-back
L3$1.5 MiB
1,536 KiB
1,572,864 B
0.00146 GiB
  1x1.5 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3-1333, DDR3-1066
Supports ECCYes
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth19.87 GiB/s
20,346.88 MiB/s
21.335 GB/s
21,335.25 MB/s
0.0194 TiB/s
0.0213 TB/s
Bandwidth
Single 9.93 GiB/s
Double 19.87 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 2.0
Max Lanes: 16
Configuration: 1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics (Sandy Bridge)
DesignerIntelDevice ID0x0106
Execution Units6Max Displays2
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency800 MHz
0.8 GHz
800,000 KHz
OutputDP, eDP, HDMI, SDVO, CRT
Standards
DirectX10.1
OpenGL3.1
DP1.1
eDP1.1
HDMI1.4
Additional Features
Intel Flexible Display Interface (FDI)

Features[edit]

Documents[edit]

Datasheet[edit]

Other[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/celeron/827e&oldid=75287"
Facts about "Celeron 827E - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Celeron 827E - Intel#package + and Celeron 827E - Intel#pcie +
base frequency1,400 MHz (1.4 GHz, 1,400,000 kHz) +
bus links4 +
bus rate5,000 MT/s (5 GT/s, 5,000,000 kT/s) +
bus typeDMI 2.0 +
chipsetCougar Point +
clock multiplier14 +
core count1 +
core family6 +
core model42 +
core nameSandy Bridge M +
core steppingQ0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.3 V (3 dV, 30 cV, 300 mV) +
cpuid0x206A7 +
designerIntel +
device id0x0106 +
die area131 mm² (0.203 in², 1.31 cm², 131,000,000 µm²) +
familyCeleron +
first announcedJuly 2011 +
first launchedJuly 2011 +
full page nameintel/celeron/827e +
has ecc memory supporttrue +
has featureEnhanced SpeedStep Technology +, Intel VT-x + and Flex Memory Access +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
instance ofmicroprocessor +
integrated gpuHD Graphics (Sandy Bridge) +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units6 +
integrated gpu max frequency800 MHz (0.8 GHz, 800,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size64 KiB (65,536 B, 0.0625 MiB) +
l1d$ description8-way set associative +
l1d$ size32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description8-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
l2$ description8-way set associative +
l2$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l3$ description12-way set associative +
l3$ size1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) +
ldateJuly 2011 +
manufacturerIntel +
market segmentEmbedded +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth19.87 GiB/s (20,346.88 MiB/s, 21.335 GB/s, 21,335.25 MB/s, 0.0194 TiB/s, 0.0213 TB/s) +
max memory channels2 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSandy Bridge +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number827E +
nameCeleron 827E +
packageFCBGA-1023 +
part numberAV8062701082300 +
platformSandy Bridge M +
power dissipation (idle)2.3 W (2,300 mW, 0.00308 hp, 0.0023 kW) +
process32 nm (0.032 μm, 3.2e-5 mm) +
release price$ 89.00 (€ 80.10, £ 72.09, ¥ 9,196.37) +
s-specSR0C6 +
series800 +
smp max ways1 +
supported memory typeDDR3-1333 + and DDR3-1066 +
tdp17 W (17,000 mW, 0.0228 hp, 0.017 kW) +
technologyCMOS +
thread count1 +
transistor count504,000,000 +
word size64 bit (8 octets, 16 nibbles) +