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Difference between revisions of "intel/core i3/i3-7100e"
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{{intel title|Core i3-7100E}}
 
{{intel title|Core i3-7100E}}
−
{{mpu
+
{{chip
−
| name               = Core i3-7100E
+
|name=Core i3-7100E
−
| no image           = Yes
+
|image=kaby lake h (front).png
−
| image              =
+
|caption=package, front
−
| image size          =  
+
|designer=Intel
−
| caption             =  
+
|manufacturer=Intel
−
| designer           = Intel
+
|model number=i3-7100E
−
| manufacturer       = Intel
+
|part number=CL8067702999007
−
| model number       = i3-7100E
+
|s-spec=SR34V
−
| part number         = CL8067702999007
+
|market=Embedded
−
| part number 1      =
+
|first announced=January 3, 2017
−
| part number 2      =
+
|first launched=January 3, 2017
−
| s-spec             = SR34V
+
|release price=$225.00
−
| s-spec 2            =
+
|family=Core i3
−
| market             = Embedded
+
|series=i3-7100
−
| first announced     = January 3, 2017
+
|locked=Yes
−
| first launched     = January 3, 2017
+
|frequency=2,900 MHz
−
| last order          =
+
|bus type=DMI 3.0
−
| last shipment      =
+
|bus rate=8 GT/s
−
| release price       = $225.00
+
|clock multiplier=29
−
 
+
|isa=x86-64
−
| family             = Core i3
+
|isa family=x86
−
| series             = i3-7100
+
|microarch=Kaby Lake
−
| locked             = Yes
+
|platform=Kaby Lake
−
| frequency           = 2,900 MHz
+
|chipset=Sunrise Point
−
| bus type           = DMI 3.0
+
|core name=Kaby Lake H
−
| bus speed          =
+
|core family=6
−
| bus rate           = 8 GT/s
+
|core model=158
−
| clock multiplier   = 29
+
|core stepping=B0
−
| cpuid              =
+
|process=14 nm
−
 
+
|technology=CMOS
−
| isa family          = x86
+
|word size=64 bit
−
| isa                 = x86-64
+
|core count=2
−
| microarch           = Kaby Lake
+
|thread count=4
−
| platform           = Kaby Lake
+
|max cpus=1
−
| chipset             = Sunrise Point
+
|max memory=64 GiB
−
| core name           = Kaby Lake H
+
|v core min=0.55 V
−
| core family         = 6
+
|v core max=1.52 V
−
| core model         = 158
+
|tdp=35 W
−
| core stepping       = B0
+
|tjunc min=0 °C
−
| core stepping 2    =
+
|tjunc max=100 °C
−
| process             = 14 nm
+
|tstorage min=-25 °C
−
| transistors        =
+
|tstorage max=125 °C
−
| technology         = CMOS
+
|package module 1={{packages/intel/fcbga-1440}}
−
| die area            =
 
−
| die width          =
 
−
| die length          =
 
−
| word size           = 64 bit
 
−
| core count         = 2
 
−
| thread count       = 4
 
−
| max cpus           = 1
 
−
| max memory         = 64 GiB
 
−
 
 
−
| electrical          = Yes
 
−
| v core min         = 0.55 V
 
−
| v core max         = 1.52 V
 
−
| sdp                =
 
−
| tdp                 = 35 W
 
−
| tjunc min           = 0 °C
 
−
| tjunc max           = 100 °C
 
−
| tcase min          =
 
−
| tcase max          =
 
−
| tstorage min       = -25 °C
 
−
| tstorage max       = 125 °C
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
 
−
| packaging          = Yes
 
−
| package           = FCBGA-1440
 
−
| package type      = FCBGA
 
−
| package pitch      =
 
−
| package size      =
 
−
| socket            = BGA-1440
 
−
| socket type        = BGA
 
 
}}
 
}}
 
'''Core i3-7100E''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.9 GHz with a TDP of 35 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7100E incorporates Intel's {{intel|HD Graphics 630}} [[IGP]] operating at 350 MHz with burst frequency of 950 MHz.
 
'''Core i3-7100E''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.9 GHz with a TDP of 35 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7100E incorporates Intel's {{intel|HD Graphics 630}} [[IGP]] operating at 350 MHz with burst frequency of 950 MHz.
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|l1i break=2x32 KiB
 
|l1i break=2x32 KiB
 
|l1i desc=8-way set associative
 
|l1i desc=8-way set associative
−
|l1i policy=write-back
 
 
|l1d cache=64 KiB
 
|l1d cache=64 KiB
 
|l1d break=2x32 KiB
 
|l1d break=2x32 KiB
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| intel clear video hd = Yes
 
| intel clear video hd = Yes
 
}}
 
}}
 +
{{kaby lake hardware accelerated video table|col=1}}
  
 
== Features ==
 
== Features ==
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|sse4a=No
 
|sse4a=No
 
|avx=Yes
 
|avx=Yes
−
|avx2=No
+
|avx2=Yes
−
|avx512=No
+
 
 
|abm=No
 
|abm=No
 
|tbm=No
 
|tbm=No
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|rvi=No
 
|rvi=No
 
}}
 
}}
 +
 +
Note: Intel's ARK incorrectly shows no support for AVX2.

Latest revision as of 12:42, 8 April 2018

Edit Values
Core i3-7100E
kaby lake h (front).png
package, front
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-7100E
Part NumberCL8067702999007
S-SpecSR34V
MarketEmbedded
IntroductionJanuary 3, 2017 (announced)
January 3, 2017 (launched)
Release Price$225.00
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-7100
LockedYes
Frequency2,900 MHz
Bus typeDMI 3.0
Bus rate8 GT/s
Clock multiplier29
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
ChipsetSunrise Point
Core NameKaby Lake H
Core Family6
Core Model158
Core SteppingB0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP35 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440

Core i3-7100E is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 2.9 GHz with a TDP of 35 Watts, supports up to 64 GiB of dual-channel DDR4-2133. The i3-7100E incorporates Intel's HD Graphics 630 IGP operating at 350 MHz with burst frequency of 950 MHz.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, DDR4-2133
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 630
DesignerIntelDevice ID0x591B
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency950 MHz
0.95 GHz
950,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
SMEPOS Guard Technology
IPTIdentity Protection Technology

Note: Intel's ARK incorrectly shows no support for AVX2.

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-7100e&oldid=77087"
Facts about "Core i3-7100E - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-7100E - Intel#package + and Core i3-7100E - Intel#io +
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point +
clock multiplier29 +
core count2 +
core family6 +
core model158 +
core nameKaby Lake H +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591B +
familyCore i3 +
first announcedJanuary 3, 2017 +
first launchedJanuary 3, 2017 +
full page nameintel/core i3/i3-7100e +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, OS Guard + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel identity protection technology supporttrue +
has intel supervisor mode execution protectiontrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency950 MHz (0.95 GHz, 950,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description16-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateJanuary 3, 2017 +
main imageFile:kaby lake h (front).png +
main image captionpackage, front +
manufacturerIntel +
market segmentEmbedded +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-7100E +
nameCore i3-7100E +
packageFCBGA-1440 +
part numberCL8067702999007 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 225.00 (€ 202.50, £ 182.25, ¥ 23,249.25) +
s-specSR34V +
seriesi3-7100 +
smp max ways1 +
supported memory typeDDR3L-1600 + and DDR4-2133 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +