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Difference between revisions of "intel/core i3/i3-350m"
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{{intel title|Core i3-350M}}
 
{{intel title|Core i3-350M}}
 +
{{chip
 +
| name                = Intel Core i3-350M
 +
| no image            = yes
 +
| image              =
 +
| image size          =
 +
| caption            =
 +
| designer            = Intel
 +
| manufacturer        = Intel
 +
| model number        = i3-350M
 +
| part number        = CP80617004161AC
 +
| part number 2      = CN80617004161AC
 +
| market              = Mobile
 +
| first announced    = January 7, 2010
 +
| first launched      = January 7, 2010
 +
| last order          =
 +
| last shipment      =
 +
| release price      =
 +
 +
| family              = Core i3
 +
| series              = i3-300
 +
| locked              = Yes
 +
| frequency          = 2,266.66 MHz
 +
| bus type            = DMI 1.0
 +
| bus speed          =
 +
| bus rate            = 2.5 GT/s
 +
| bus links          = 1
 +
| clock multiplier    = 17
 +
| s-spec              = SLBPK
 +
| s-spec 2            = SLBPL
 +
| s-spec 3            = SLBU5
 +
| s-spec 4            = SLBU6
 +
| s-spec qs          =
 +
| cpuid              = 0x20655
 +
 +
| isa family          = x86
 +
| isa                = x86-64
 +
| microarch          = Westmere
 +
| platform            = Calpella
 +
| chipset            = Ibex Peak
 +
| core name          = Arrandale
 +
| core family        = 6
 +
| core model          = 37
 +
| core stepping      = C2
 +
| core stepping 2    = K0
 +
| process            = 32 nm
 +
| transistors        = 382,000,000
 +
| technology          = CMOS
 +
| die area            = 81 mm²
 +
| die width          =
 +
| die length          =
 +
| word size          = 64 bit
 +
| core count          = 2
 +
| thread count        = 4
 +
| max cpus            = 1
 +
| max memory          = 8 GiB
 +
 +
 +
| v core              =
 +
| v core tolerance    =
 +
| v io                =
 +
| v io tolerance      =
 +
| sdp                =
 +
| tdp                = 35 W
 +
| tjunc min          = 0 °C
 +
| tjunc max          = 105 °C
 +
| tcase min          =
 +
| tcase max          =
 +
| tstorage min        = -25 °C
 +
| tstorage max        = 125 °C
 +
| tambient min        =
 +
| tambient max        =
 +
 +
| package module 1    = {{packages/intel/rpga-988a}}
 +
| package module 2    = {{packages/intel/bga-1288}}
 +
}}
 
'''Core i3-350M''' is a {{arch|64}} [[dual-core]] [[x86]] mobile microprocessor introduced by [[Intel]] in [[2010]]. This processor operates at a frequency of 2.26 GHz and a TDP of 35 W. This MPU is manufactured on a [[32 nm process]] based on the {{intel|Westmere|l=arch}} microarchitecture ({{intel|Arrandale|l=core}} core). This processor incorporated the {{intel|HD Graphics (Ironlake)}} [[IGP]] on the same package operating at a base frequency of 500.00 MHz and a burst frequency of 667.00 MHz.
 
'''Core i3-350M''' is a {{arch|64}} [[dual-core]] [[x86]] mobile microprocessor introduced by [[Intel]] in [[2010]]. This processor operates at a frequency of 2.26 GHz and a TDP of 35 W. This MPU is manufactured on a [[32 nm process]] based on the {{intel|Westmere|l=arch}} microarchitecture ({{intel|Arrandale|l=core}} core). This processor incorporated the {{intel|HD Graphics (Ironlake)}} [[IGP]] on the same package operating at a base frequency of 500.00 MHz and a burst frequency of 667.00 MHz.
 +
 +
== Cache ==
 +
{{main|intel/microarchitectures/westmere#Memory_Hierarchy|l1=Westmere § Cache}}
 +
{{cache size
 +
|l1 cache=128 KiB
 +
|l1i cache=64 KiB
 +
|l1i break=2x32 KiB
 +
|l1i desc=4-way set associative
 +
|l1i policy=write-back
 +
|l1d cache=64 KiB
 +
|l1d break=2x32 KiB
 +
|l1d desc=8-way set associative
 +
|l1d policy=write-back
 +
|l2 cache=512 KiB
 +
|l2 break=2x256 KiB
 +
|l2 desc=8-way set associative
 +
|l2 policy=write-back
 +
|l3 cache=3 MiB
 +
|l3 break=2x1.5 MiB
 +
|l3 desc=12-way set associative
 +
|l3 policy=write-back
 +
}}
 +
 +
== Memory controller ==
 +
{{memory controller
 +
|type=DDR3-1066
 +
|ecc=No
 +
|max mem=8 GiB
 +
|controllers=1
 +
|channels=2
 +
|max bandwidth=15.88 GiB/s
 +
|bandwidth schan=7.942 GiB/s
 +
|bandwidth dchan=15.88 GiB/s
 +
|pae=36 bit
 +
}}
 +
 +
== Expansions ==
 +
{{expansions
 +
| pcie revision      = 2.0
 +
| pcie lanes        = 16
 +
| pcie config        = 1x16
 +
}}
 +
 +
== Graphics ==
 +
{{integrated graphics
 +
| gpu                = HD Graphics (Ironlake)
 +
| device id          = 0x0046
 +
| designer            = Intel
 +
| execution units    = 12
 +
| max displays        = 2
 +
| max memory          =
 +
| frequency          = 500 MHz
 +
| max frequency      = 667 MHz
 +
 +
| directx ver        = 10.1
 +
| opengl ver          = 2.1
 +
 +
| features            = Yes
 +
| intel quick sync    =
 +
| intel intru 3d      =
 +
| intel insider        =
 +
| intel widi          =
 +
| intel fdi            = Yes
 +
| intel clear video    = Yes
 +
| intel clear video hd = Yes
 +
}}
 +
 +
== Features ==
 +
{{x86 features
 +
|real=Yes
 +
|protected=Yes
 +
|smm=Yes
 +
|fpu=Yes
 +
|x8616=Yes
 +
|x8632=Yes
 +
|x8664=Yes
 +
|nx=Yes
 +
|3dnow=No
 +
|e3dnow=No
 +
|mmx=Yes
 +
|emmx=Yes
 +
|sse=Yes
 +
|sse2=Yes
 +
|sse3=Yes
 +
|ssse3=Yes
 +
|sse41=Yes
 +
|sse42=Yes
 +
|sse4a=No
 +
|avx=No
 +
|avx2=No
 +
 +
|abm=No
 +
|tbm=No
 +
|bmi1=No
 +
|bmi2=No
 +
|fma3=No
 +
|fma4=No
 +
|aes=No
 +
|rdrand=No
 +
|sha=No
 +
|xop=No
 +
|adx=No
 +
|clmul=No
 +
|f16c=No
 +
|tbt1=No
 +
|tbt2=No
 +
|tbmt3=No
 +
|bpt=No
 +
|eist=Yes
 +
|flex=Yes
 +
|fastmem=Yes
 +
|isrt=No
 +
|mwt=No
 +
|sipp=No
 +
|att=No
 +
|ipt=No
 +
|tsx=No
 +
|txt=No
 +
|ht=Yes
 +
|vpro=No
 +
|vtx=Yes
 +
|vtd=No
 +
|ept=Yes
 +
|mpx=No
 +
|sgx=No
 +
|securekey=No
 +
|osguard=No
 +
|smartmp=No
 +
|powernow=No
 +
|amdv=No
 +
|rvi=No
 +
}}

Latest revision as of 15:17, 13 December 2017

Edit Values
Intel Core i3-350M
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-350M
Part NumberCP80617004161AC,
CN80617004161AC
S-SpecSLBPK, SLBPL, SLBU5, SLBU6
MarketMobile
IntroductionJanuary 7, 2010 (announced)
January 7, 2010 (launched)
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-300
LockedYes
Frequency2,266.66 MHz
Bus typeDMI 1.0
Bus rate1 × 2.5 GT/s
Clock multiplier17
CPUID0x20655
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureWestmere
PlatformCalpella
ChipsetIbex Peak
Core NameArrandale
Core Family6
Core Model37
Core SteppingC2, K0
Process32 nm
Transistors382,000,000
TechnologyCMOS
Die81 mm²
Word Size64 bit
Cores2
Threads4
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP35 W
Tjunction0 °C – 105 °C
Tstorage-25 °C – 125 °C
Packaging
PackagerPGA-988A (rPGA)rPGA988A.svg
Dimension36 mm x 35 mm x 2.12 mm
Pitch1 mm
Pin Count988
SocketSocket-G1 (PGA)
PackageBGA-1288 (BGA)BGA-1288.svg
Dimension34 mm x 28 mm x 2.1 mm
Pitch0.7 mm
Pin Count1288

Core i3-350M is a 64-bit dual-core x86 mobile microprocessor introduced by Intel in 2010. This processor operates at a frequency of 2.26 GHz and a TDP of 35 W. This MPU is manufactured on a 32 nm process based on the Westmere microarchitecture (Arrandale core). This processor incorporated the HD Graphics (Ironlake) IGP on the same package operating at a base frequency of 500.00 MHz and a burst frequency of 667.00 MHz.

Cache[edit]

Main article: Westmere § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB4-way set associativewrite-back
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB8-way set associativewrite-back
L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3-1066
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels2
Max Bandwidth15.88 GiB/s
16,261.12 MiB/s
17.051 GB/s
17,051.02 MB/s
0.0155 TiB/s
0.0171 TB/s
Bandwidth
Single 7.942 GiB/s
Double 15.88 GiB/s
Physical Address (PAE)36 bit

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision2.0
Max Lanes16
Configs1x16


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics (Ironlake)
DesignerIntelDevice ID0x0046
Execution Units12Max Displays2
Frequency500 MHz
0.5 GHz
500,000 KHz
Burst Frequency667 MHz
0.667 GHz
667,000 KHz
Standards
DirectX10.1
OpenGL2.1
Additional Features
Intel Flexible Display Interface (FDI)
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
EPTExtended Page Tables (SLAT)
Flex MemoryFlex Memory Access
FMAFast Memory Access (w\ GMCH)
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-350m&oldid=70531"
Facts about "Core i3-350M - Intel"
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Core i3-350M - Intel#package + and Core i3-350M - Intel#io +
base frequency2,266.66 MHz (2.267 GHz, 2,266,660 kHz) +
bus links1 +
bus rate2,500 MT/s (2.5 GT/s, 2,500,000 kT/s) +
bus typeDMI 1.0 +
chipsetIbex Peak +
clock multiplier17 +
core count2 +
core family6 +
core model37 +
core nameArrandale +
core steppingC2 + and K0 +
cpuid0x20655 +
designerIntel +
device id0x0046 +
die area81 mm² (0.126 in², 0.81 cm², 81,000,000 µm²) +
familyCore i3 +
first announcedJanuary 7, 2010 +
first launchedJanuary 7, 2010 +
full page nameintel/core i3/i3-350m +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureHyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Extended Page Tables + and Flex Memory Access +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuHD Graphics (Ironlake) +
integrated gpu base frequency500 MHz (0.5 GHz, 500,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency667 MHz (0.667 GHz, 667,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description4-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateJanuary 7, 2010 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature378.15 K (105 °C, 221 °F, 680.67 °R) +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth15.88 GiB/s (16,261.12 MiB/s, 17.051 GB/s, 17,051.02 MB/s, 0.0155 TiB/s, 0.0171 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureWestmere +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-350M +
nameIntel Core i3-350M +
packagerPGA-988A + and BGA-1288 +
part numberCP80617004161AC + and CN80617004161AC +
platformCalpella +
process32 nm (0.032 μm, 3.2e-5 mm) +
s-specSLBPK +, SLBPL +, SLBU5 + and SLBU6 +
seriesi3-300 +
smp max ways1 +
supported memory typeDDR3-1066 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
transistor count382,000,000 +
word size64 bit (8 octets, 16 nibbles) +