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Difference between revisions of "qualcomm/msm6xxx/msm6200"
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{{qualcomm title|MSM6200}}
 
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'''MSM6200''' is a {{arch|32}} [[ARM]] [[baseband processor|baseband]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Value Platform]] offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.
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'''MSM6200''' is a {{arch|32}} [[ARM]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Value Platform]] offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.
  
 
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== Utilizing devices ==
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<!-- * [[used by::XXXXXXXXXXXXXXXX]] -->
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{{expand list}}
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== Digital Signal Processing ==
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* '''DSP:''' [[dsp::QDSP4000]] [[dsp base frequency::40 MHz]]
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== Expansions ==
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* Digital audio support for MP3
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* Removable User Identity Module (R-UIM)
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* MMC multimedia card interface support
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* MIDI music synthesizer for ringtone applications
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== Diagram ==
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[[File:diagram msm6200.jpg|1000px]]
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== Documents ==
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=== Datasheets ===
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* [[:File:diagram msm6200 cs.pdf|MSM6200 Diagram]]
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* [[:File:msm6200 chipset.pdf|MSM6200 Chipset]]
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=== Other ===
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* [[:File:msm6xxx platform value.pdf|Value Platform Overview]]

Latest revision as of 15:31, 13 December 2017

Edit Values
Qualcomm MSM6200
msm6200 hires.jpg
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC, IBM
Model NumberMSM6200
MarketMobile, Embedded
IntroductionMarch 20, 2001 (announced)
August, 2002 (launched)
General Specs
FamilyMSM6xxx
SeriesMSM
LockedYes
Frequency40 MHz
Bus typeAMBA 2
Microarchitecture
MicroarchitectureARM7
ChipsetMSM6xxx
Core NameARM7TDMI
Process180 nm
TechnologyCMOS
Cores1
Threads1
Max Memory4 GiB
Max Address Mem0xFFFFFFFF
Multiprocessing
Max SMP1-Way (Uniprocessor)

MSM6200 is a 32-bit ARM system-on-chip with 3G wireless capabilities developed by Qualcomm and introduced in 2002 for the mobile market. This SoC was part of the MSM6xxx Value Platform offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.

Cache[edit]

Main article: ARM7 § Cache
Cache Info [Edit Values]
L1I$ 0 KiB
0 B
0 MiB
1x0 KiB No L1$

Wireless[edit]

Antu network-wireless-connected-100.svgWireless Communications
Cellular
2G
GSM Yes
GPRS Yes
3G
UMTS
WCDMAYes

Utilizing devices[edit]

This list is incomplete; you can help by expanding it.

Digital Signal Processing[edit]

  • DSP: QDSP4000 40 MHz
    0.04 GHz
    40,000 kHz

Expansions[edit]

  • Digital audio support for MP3
  • Removable User Identity Module (R-UIM)
  • MMC multimedia card interface support
  • MIDI music synthesizer for ringtone applications

Diagram[edit]

diagram msm6200.jpg

Documents[edit]

Datasheets[edit]

Other[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/msm6xxx/msm6200&oldid=71173"
Facts about "MSM6200 - Qualcomm"
RDF feed
base frequency40 MHz (0.04 GHz, 40,000 kHz) +
bus typeAMBA 2 +
chipsetMSM6xxx +
core count1 +
core nameARM7TDMI +
designerQualcomm + and ARM Holdings +
dspQDSP4000 +
dsp base frequency40 MHz (0.04 GHz, 40,000 kHz) +
familyMSM6xxx +
first announcedMarch 20, 2001 +
first launchedAugust 2002 +
full page namequalcomm/msm6xxx/msm6200 +
has 2g supporttrue +
has 3g supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has locked clock multipliertrue +
has umts supporttrue +
has wcdma supporttrue +
instance ofmicroprocessor +
l1i$ descriptionNo L1$ +
l1i$ size0 KiB (0 B, 0 MiB) +
ldateAugust 2002 +
main imageFile:msm6200 hires.jpg +
manufacturerTSMC + and IBM +
market segmentMobile + and Embedded +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory address0xFFFFFFFF +
microarchitectureARM7 +
model numberMSM6200 +
nameQualcomm MSM6200 +
part ofValue Platform +
process180 nm (0.18 μm, 1.8e-4 mm) +
seriesMSM +
smp max ways1 +
technologyCMOS +
thread count1 +