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Difference between revisions of "qualcomm/msm6xxx/msm6200"
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{{qualcomm title|MSM6200}} | {{qualcomm title|MSM6200}} | ||
− | {{ | + | {{chip |
| name = Qualcomm MSM6200 | | name = Qualcomm MSM6200 | ||
− | | no image = | + | | no image = |
− | | image = | + | | image = msm6200 hires.jpg |
| image size = | | image size = | ||
| caption = | | caption = | ||
| designer = Qualcomm | | designer = Qualcomm | ||
+ | | designer 2 = ARM Holdings | ||
| manufacturer = TSMC | | manufacturer = TSMC | ||
| manufacturer 2 = IBM | | manufacturer 2 = IBM | ||
Line 18: | Line 19: | ||
| last shipment = | | last shipment = | ||
| release price = | | release price = | ||
+ | |||
+ | | family = MSM6xxx | ||
+ | | series = MSM | ||
+ | | locked = Yes | ||
+ | | frequency = 40 MHz | ||
+ | | bus type = AMBA 2 | ||
+ | | bus speed = | ||
+ | | bus rate = | ||
+ | | bus links = | ||
+ | | clock multiplier = | ||
+ | |||
+ | | microarch = ARM7 | ||
+ | | platform = | ||
+ | | chipset = MSM6xxx | ||
+ | | core name = ARM7TDMI | ||
+ | | core family = | ||
+ | | core model = | ||
+ | | core stepping = | ||
+ | | process = 180 nm | ||
+ | | transistors = | ||
+ | | technology = CMOS | ||
+ | | die area = <!-- XX mm² --> | ||
+ | | die width = | ||
+ | | die length = | ||
+ | | word size = | ||
+ | | core count = 1 | ||
+ | | thread count = 1 | ||
+ | | max cpus = 1 | ||
+ | | max memory = 4 GiB | ||
+ | | max memory addr = 0xFFFFFFFF | ||
+ | |||
+ | | electrical = <!-- put Yes if electrical info is added --> | ||
+ | | power = <!-- power consumption --> | ||
+ | | v core = | ||
+ | | v core tolerance = | ||
+ | | v io = | ||
+ | | v io tolerance = | ||
+ | | sdp = | ||
+ | | tdp = | ||
+ | | tdp typical = | ||
+ | | ctdp down = | ||
+ | | ctdp down frequency = | ||
+ | | ctdp up = | ||
+ | | ctdp up frequency = | ||
+ | | temp min = <!-- use TJ/TC whenever possible instead --> | ||
+ | | temp max = | ||
+ | | tjunc min = <!-- .. °C --> | ||
+ | | tjunc max = | ||
+ | | tcase min = | ||
+ | | tcase max = | ||
+ | | tstorage min = | ||
+ | | tstorage max = | ||
+ | | tambient min = | ||
+ | | tambient max = | ||
+ | |||
+ | | packaging = Yes | ||
+ | | package 0 = FBGA-208 | ||
+ | | package 0 type = FBGA | ||
+ | | package 0 pins = 208 | ||
+ | | package 0 pitch = 0.8 mm | ||
+ | | package 0 width = 15 mm | ||
+ | | package 0 length = 15 mm | ||
+ | | package 0 height = 0.7 mm | ||
}} | }} | ||
− | '''MSM6200''' is a {{arch|32}} [[ARM]] [[system-on-chip]] developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. | + | '''MSM6200''' is a {{arch|32}} [[ARM]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2002]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Value Platform]] offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features. |
+ | |||
+ | == Cache == | ||
+ | {{main|arm holdings/microarchitectures/ARM7#Memory_Hierarchy|l1=ARM7 § Cache}} | ||
+ | {{cache info | ||
+ | |l1i cache=0 KiB | ||
+ | |l1i break=1x0 KiB | ||
+ | |l1i desc=No L1$ | ||
+ | |l1i extra= | ||
+ | }} | ||
+ | |||
+ | == Wireless == | ||
+ | {{wireless links | ||
+ | | 2g = true | ||
+ | | gsm = true | ||
+ | | gprs = true | ||
+ | | edge = | ||
+ | | cdmaone = | ||
+ | | is-95a = | ||
+ | | is-95b = | ||
+ | | 3g = true | ||
+ | | cdma2000 = | ||
+ | | cdma2000 1x = | ||
+ | | cdma2000 1xev-do = | ||
+ | | cdma2000 1x adv = | ||
+ | | umts = true | ||
+ | | wcdma = true | ||
+ | | hsdpa = | ||
+ | | hsupa = | ||
+ | }} | ||
+ | |||
+ | == Utilizing devices == | ||
+ | <!-- * [[used by::XXXXXXXXXXXXXXXX]] --> | ||
+ | |||
+ | {{expand list}} | ||
+ | |||
+ | == Digital Signal Processing == | ||
+ | * '''DSP:''' [[dsp::QDSP4000]] [[dsp base frequency::40 MHz]] | ||
+ | |||
+ | == Expansions == | ||
+ | * Digital audio support for MP3 | ||
+ | * Removable User Identity Module (R-UIM) | ||
+ | * MMC multimedia card interface support | ||
+ | * MIDI music synthesizer for ringtone applications | ||
+ | |||
+ | == Diagram == | ||
+ | [[File:diagram msm6200.jpg|1000px]] | ||
+ | |||
+ | == Documents == | ||
+ | === Datasheets === | ||
+ | * [[:File:diagram msm6200 cs.pdf|MSM6200 Diagram]] | ||
+ | * [[:File:msm6200 chipset.pdf|MSM6200 Chipset]] | ||
+ | === Other === | ||
+ | * [[:File:msm6xxx platform value.pdf|Value Platform Overview]] |
Latest revision as of 15:31, 13 December 2017
Edit Values | |
Qualcomm MSM6200 | |
General Info | |
Designer | Qualcomm, ARM Holdings |
Manufacturer | TSMC, IBM |
Model Number | MSM6200 |
Market | Mobile, Embedded |
Introduction | March 20, 2001 (announced) August, 2002 (launched) |
General Specs | |
Family | MSM6xxx |
Series | MSM |
Locked | Yes |
Frequency | 40 MHz |
Bus type | AMBA 2 |
Microarchitecture | |
Microarchitecture | ARM7 |
Chipset | MSM6xxx |
Core Name | ARM7TDMI |
Process | 180 nm |
Technology | CMOS |
Cores | 1 |
Threads | 1 |
Max Memory | 4 GiB |
Max Address Mem | 0xFFFFFFFF |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
MSM6200 is a 32-bit ARM system-on-chip with 3G wireless capabilities developed by Qualcomm and introduced in 2002 for the mobile market. This SoC was part of the MSM6xxx Value Platform offering support for features such as basic color screens, position-location services, music, ringtones and voice recognition features.
Contents
Cache[edit]
- Main article: ARM7 § Cache
Cache Info [Edit Values] | ||
L1I$ | 0 KiB 0 B 0 MiB |
1x0 KiB No L1$ |
Wireless[edit]
Wireless Communications | |||||||
Cellular | |||||||
2G |
| ||||||
---|---|---|---|---|---|---|---|
3G |
|
Utilizing devices[edit]
This list is incomplete; you can help by expanding it.
Digital Signal Processing[edit]
- DSP: QDSP4000 40 MHz0.04 GHz
40,000 kHz
Expansions[edit]
- Digital audio support for MP3
- Removable User Identity Module (R-UIM)
- MMC multimedia card interface support
- MIDI music synthesizer for ringtone applications
Diagram[edit]
Documents[edit]
Datasheets[edit]
Other[edit]
Facts about "MSM6200 - Qualcomm"
base frequency | 40 MHz (0.04 GHz, 40,000 kHz) + |
bus type | AMBA 2 + |
chipset | MSM6xxx + |
core count | 1 + |
core name | ARM7TDMI + |
designer | Qualcomm + and ARM Holdings + |
dsp | QDSP4000 + |
dsp base frequency | 40 MHz (0.04 GHz, 40,000 kHz) + |
family | MSM6xxx + |
first announced | March 20, 2001 + |
first launched | August 2002 + |
full page name | qualcomm/msm6xxx/msm6200 + |
has 2g support | true + |
has 3g support | true + |
has gprs support | true + |
has gsm support | true + |
has locked clock multiplier | true + |
has umts support | true + |
has wcdma support | true + |
instance of | microprocessor + |
l1i$ description | No L1$ + |
l1i$ size | 0 KiB (0 B, 0 MiB) + |
ldate | August 2002 + |
main image | + |
manufacturer | TSMC + and IBM + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory address | 0xFFFFFFFF + |
microarchitecture | ARM7 + |
model number | MSM6200 + |
name | Qualcomm MSM6200 + |
part of | Value Platform + |
process | 180 nm (0.18 μm, 1.8e-4 mm) + |
series | MSM + |
smp max ways | 1 + |
technology | CMOS + |
thread count | 1 + |