Difference between revisions of "Flip Chip Ball Grid Array"

Latest revision as of 14:28, 6 October 2025

TI's 288GTS package footprint - a 288-ball FCBGA package

Flip Chip Ball Grid Array (FCBGA or simply Flip-chip BGA) is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

Typical Flip Chip BGA Package (Cross-Sectional View)

Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively ASIC, DSP, and various other high performance applications.

FCBGA packages is used in all main semiconductor manufacturers such as in the latest Intel's Core i7, Texas Instruments custom ASICs, and Freescale processors.

BGA CPU Packages[edit]

AMD BGA Packages[edit]

List of AMD CPU sockets

BGA CPU Packages
General				Details
Name	Package	Contacts	TDP	Socket	µarch	Market	Release
Package ASB1	ASB1, BGA-812	812	18 W 18,000 mW 0.0241 hp 0.018 kW		K8	Mobile	8 January 2009
Package ASB2	ASB2, BGA-812	812	15 W 15,000 mW 0.0201 hp 0.015 kW		K10	Mobile	12 May 2010
Package CBGA-360	CBGA-360	360	11 W 11,000 mW 0.0148 hp 0.011 kW		K6	Mobile	5 March 1998
Package FP2	BGA-827, FP2	827	25 W 25,000 mW 0.0335 hp 0.025 kW		Piledriver	Mobile, Embedded	15 May 2012
Package FP3	BGA-854, FP3	854	35 W 35,000 mW 0.0469 hp 0.035 kW		Steamroller	Mobile, Embedded	June 2014
Package FP4	BGA-968, FP4	968	45 W 45,000 mW 0.0603 hp 0.045 kW		Excavator	Mobile, Embedded	June 2015
Package FP5	BGA-1140	1,140	45 W 45,000 mW 0.0603 hp 0.045 kW		Zen, Zen+	Mobile, Embedded	8 January 2018
Package FP6	BGA-1140	1,140	55 W 55,000 mW 0.0738 hp 0.055 kW		Zen 2, Zen 3	Mobile, Embedded	16 March 2020
Package FT1	BGA-413, UOB-413	413	18 W 18,000 mW 0.0241 hp 0.018 kW		Bobcat	Mobile, Embedded	4 January 2011
Package FT3	BGA-769	769	25 W 25,000 mW 0.0335 hp 0.025 kW		Jaguar	Mobile, Embedded	May 2013
Package FT3b	BGA-769	769	25 W 25,000 mW 0.0335 hp 0.025 kW		Puma	Mobile, Embedded	4 June 2014
Package FT4	BGA-769	769	15 W 15,000 mW 0.0201 hp 0.015 kW		Excavator	Mobile	June 2016
Package OBGA-349	OBGA-349	349	18 W 18,000 mW 0.0241 hp 0.018 kW		K6	Embedded	25 September 2000
Package SP1	BGA-1021	1,021	32 W 32,000 mW 0.0429 hp 0.032 kW		Cortex-A57	Embedded, Server	January 2016
Package SP4	BGA-2028	2,028	100 W 100,000 mW 0.134 hp 0.1 kW		Zen	Embedded	21 February 2018
Package SP4r2	BGA-2028	2,028	55 W 55,000 mW 0.0738 hp 0.055 kW		Zen	Embedded	21 February 2018

Intel BGA Packages[edit]

BGA-1288 (Intel)

FCBGA-1377 (26.5 x 18.5 mm) • Ice Lake Y
FCBGA-1392 • Cannon Lake Y
FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
FCBGA-1510 • Cannon Lake U
FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
FCBGA-1526 (50 x 25 mm) • Ice Lake U
FCBGA-1528 • Whiskey Lake U
FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
FCBGA-2579 • Ice Lake D
FCBGA-3325 (60 x 60 mm) • Intel Nervana
FCBGA-5903 • Cascade Lake AP

Intel LGA Packages[edit]

FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E

• LGA-1151 • Socket H4

FCLGA-8 • Intel Xeon E7 (Westmere, Ivy Bridge, Haswell, Broadwell)

• LGA-1567 • Socket LS

FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S

• LGA-1700 • Socket V

FCLGA-2066 (52.5 x 45 mm) • Skylake X, Skylake X Refresh

• LGA-2066 • Socket R4

FCLGA-3647 (76.2 x 56.6 mm) • Skylake SP, Cascade Lake SP

• LGA-3647 • Socket P

FCLGA-4189 • Ice Lake SP

• LGA-4189 • Socket P+ (W)

FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza

• PLGA-2601

Intel CPU Packages[edit]

FCBGA-437 • BGA-437 • Bonnell
FCBGA-441 • BGA-441 • Bonnell
FCBGA-518 • BGA-518 • Bonnell
rPGA-988A • Socket G1 • Westmere
rPGA-988B (FCBGA-1023/FCBGA-1224) • Socket G2 • Sandy Bridge
FCBGA-1023 • Sandy Bridge
FCBGA-1090 • Goldmont Plus
FCLGA-1151 • LGA-1151 • Skylake • Kaby Lake
FCLGA-1151 (FCLGA14C) • Socket H4 • Coffee Lake
FCBGA-1288 • BGA-1288 • Westmere
FCBGA-1310 • Goldmont
FCBGA-1356 • BGA-1356 • Skylake • Kaby Lake
FCBGA-1440 • Coffee Lake
FCBGA-1510 • Cannon Lake
FCBGA-1528 • Coffee Lake • Whiskey Lake
LGA-1567 • FCLGA-8 • Intel Xeon E7 (Westmere, Ivy Bridge, Haswell, Broadwell)
FCLGA-2011-v3 • LGA-2011-v3 • Westmere, Ivy Bridge, Haswell, Broadwell
FCLGA-2066 • Socket R • Skylake • Kaby Lake
FCLGA-2066 • Socket R4 • Skylake (server) • Cascade Lake
FCBGA-2518 • Skylake (server)
FCBGA-2579 • Ice Lake (server)
FCBGA-3325 • Spring Crest
FCLGA-3647 • Socket P • Cascade Lake • Skylake (server)
FCLGA-4189 • LGA-4189 • Socket P+ (W) • Ice Lake (server)
FCBGA-5903 • Cascade Lake

Intel CPU Packages
General				Details
Package	Name	Contacts	TDP	Socket	µarch	Market	Release
FCLGA-8	Intel Xeon E7			LGA-1567	Westmere, Ivy Bridge, Haswell, Broadwell		5 April 2011
FCLGA-8	Xeon E7-2803		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-2820		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-2830		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-2850		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-2860		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-2870		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4807		95 W 95,000 mW 0.127 hp 0.095 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4820		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4830		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4850		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4860		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-4870		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8830		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8837		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8850		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8860		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8867L		105 W 105,000 mW 0.141 hp 0.105 kW		Westmere	Server	5 April 2011
FCLGA-8	Xeon E7-8870		130 W 130,000 mW 0.174 hp 0.13 kW		Westmere	Server	5 April 2011

Package	FCBGA-437 (FCBGA)
Dimension	22 mm x 22 mm x 1.6 mm
Pin Count	437
Socket	BGA-437 (BGA)

Package	FCBGA-441 (FCBGA)
Dimension	13 mm x 14 mm
Pin Count	441
Socket	BGA-441 (BGA)

Package	FCBGA-518 (FCBGA)
Dimension	13.8 mm x 13.8 mm x 1.1 mm
Pin Count	518
Socket	BGA-518 (BGA)

Package	FCBGA-1023 (BGA)
Dimension	31 mm x 24 mm
Pitch	0.65 mm
Contacts	1023

Package	FCBGA-1090 (BGA)
Dimension	25 mm x 24 mm
Contacts	1090

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung

Latest revision as of 14:28, 6 October 2025

Contents

μFCBGA[edit]

BGA/FCBGA[edit]

LGA/FCLGA[edit]

PGA/FCPGA[edit]

BGA CPU Packages[edit]

AMD BGA Packages[edit]

Intel BGA Packages[edit]

Intel LGA Packages[edit]

Intel CPU Packages[edit]

See also[edit]

@@ Line 1: / Line 1: @@
-'''Flip Chip Ball Grid Array''' ('''fcBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. fcBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. fcBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices.
+[[File:TI 288GTS - FCBGA package footprint.png|thumb|right|TI's 288GTS package footprint - a 288-ball FCBGA package]]
+'''Flip Chip Ball Grid Array''' ('''FCBGA''' or simply ''Flip-chip BGA'') is a mid-cost, high-performance, [[Semiconductor package|semiconductor packaging]] solution that utilizes the [[controlled collapse chip connection]] technology, also known as [[flip chip]], for its [[die]] to [[substrate]] interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replaced using existing standard repair practices.
 [[File:Typical Flip Chip BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]]
-Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications.
-fcBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors.
+Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively [[Application-specific integrated circuit|ASIC]], [[Digital signal processor|DSP]], and various other high performance applications.
+FCBGA packages is used in all main semiconductor manufacturers such as in the latest [[Intel]]'s [[Core i7]], [[Texas Instruments]] custom [[ASIC]]s, and [[Freescale]] processors.
-[[File:TI 288GTS - FCBGA package footprint.png|thumb|right|TI's 288GTS package footprint - a 288-ball FCBGA package]]
-== μFCBGA ==
+=== μ[[FCBGA]] ===
-'''μFCBGA''' or '''micro-FCBGA''' is a line of fcBGA packages that ships with Intel's line of processors.
+'''μFCBGA''' or '''micro-FCBGA''' is a line of fcBGA packages that ships with [[Intel]]'s line of processors.
+* {{intel|FCBGA 437}} • {{intel|FCBGA 559}} • {{intel|FCBGA 676}} • {{intel|FCBGA 1023}}
+* {{intel|FCBGA 1088}} • {{intel|FCBGA 1168}} • {{intel|FCBGA 1170}}
+* {{intel|FCBGA 1224}} • {{intel|FCBGA 1283}} • {{intel|FCBGA 1284}}
+* {{intel|FCBGA 1357}} • {{intel|FCBGA 1364}} • {{intel|FCBGA 1466}}
+=== BGA/[[FCBGA]] ===
+*{{intel|FCBGA-437}} • μFCBGA
+{{Template:packages/intel/fcbga-437}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-437| ]]{{intel|FCBGA-437}} (FCBGA)</td><td rowspan="5">[[File:FCBGA-437.svg|125px]]</td></tr>-->
+*{{intel|FCBGA-441}} •
+{{Template:packages/intel/fcbga-441}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-441| ]]{{intel|FCBGA-441}} (FCBGA)</td><td rowspan="5">[[File:FCBGA-441.svg|125px]]</td></tr>-->
+*{{intel|FCBGA-518}} •
+{{Template:packages/intel/fcbga-518}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-518| ]]{{intel|FCBGA-518}} (FCBGA)</td><td rowspan="5">[[File:FCBGA-518.svg|125px]]</td></tr>-->
+*{{intel|FCBGA-1023}} •
+{{Template:packages/intel/fcbga-1023}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1023| ]]{{intel|FCBGA-1023}} (BGA)</td></tr>-->
+*{{intel|FCBGA-1090}} •
+{{Template:packages/intel/fcbga-1090}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1090| ]]{{intel|FCBGA-1090}} (BGA)</td></tr>-->
+*{{intel|FCBGA-1224}} • μFCBGA
+{{Template:packages/intel/fcbga-1224}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1224| ]]{{intel|FCBGA-1224}} (BGA)</td></tr>-->
+*{{packages|BGA-1288}} •
+{{Template:packages/intel/bga-1288}} <!--
+<tr><th>'''Package'''</th><td>[[package::BGA-1288| ]]{{packages|BGA-1288}} (BGA)</td><td rowspan="5">[[File:BGA-1288.svg|125px]]</td></tr>-->
+*{{packages|FCBGA-1310}} •
+{{Template:packages/intel/fcbga-1310}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1310| ]]{{packages|FCBGA-1310}} (BGA)</td></tr>-->
+*{{packages|FCBGA-1356}} •
+{{Template:packages/intel/fcbga-1356}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1356| ]]{{packages|FCBGA-1356}} (BGA)</td></tr>-->
+*{{packages|FCBGA-1364}} • μFCBGA
+{{Template:packages/intel/fcbga-1364}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1364| ]]{{packages|FCBGA-1364}} (BGA)</td></tr>-->
+*{{packages|FCBGA-1440}} •
+{{Template:packages/intel/fcbga-1440}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1440| ]]{{packages|FCBGA-1440}} (BGA)</td></tr>-->
+*{{packages|FCBGA-1528}} •
+{{Template:packages/intel/fcbga-1528}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-1528| ]]{{packages|FCBGA-1528}} (BGA)</td></tr>-->
+*{{intel|FCBGA-2518}} •
+{{Template:packages/intel/fcbga-2518}} <!--
+<tr><th>'''Package'''</th><td>[[package::FCBGA-2518| ]]{{intel|FCBGA-2518}} (BGA)</td></tr>-->
+=== LGA/FCLGA ===
+*{{intel|LGA-1151}} • FCLGA-1151, FC-LGA14C
+{{Template:packages/intel/fclga-1151}} <!--
+<tr><th>'''Socket'''</th><td>[[socket::LGA-1151| ]]{{intel|LGA-1151}}</td></tr>-->
+<!-- Template:packages/intel/lga-1151
+#REDIRECT [[Template:packages/intel/fclga-1151]] -->
+*{{intel|LGA-1155}} • FCLGA-1155 (LGA)
+{{Template:packages/intel/fclga-1155}} <!--
+<tr><th>'''Socket'''</th><td>[[socket::LGA-1155| ]]{{intel|LGA-1155}}</td></tr>-->
+*{{packages|LGA-1567}} • FCLGA-8 (LGA)
+{{Template:packages/intel/lga-1567}} <!--
+<tr><th>'''Socket'''</th><td>{{packages|LGA-1567}}</td></tr>-->
-* [[FCBGA 1466]]
+=== PGA/FCPGA ===
-* [[FCBGA 1364]]
+• Socket G1 (rPGA 988A) • Mobile Core i (Gen 1), Pentium, Celeron
-* [[FCBGA 1357]]
+• Socket G2 (rPGA 988B) • Mobile Core i (Gen 2/3), Pentium, Celeron
-* [[FCBGA 1284]]
+• Socket G3 (rPGA 946) • Mobile Core i (Gen 4), Pentium, Celeron
-* [[FCBGA 1283]]
+*{{packages|Socket-G1}} (PGA) • rPGA-988A (rPGA)
-* [[FCBGA 1224]]
+{{Template:packages/intel/rpga-988a}} <!--
-* [[FCBGA 1170]]
+<tr><th>'''Socket'''</th><td>{{packages|Socket-G1}}&nbsp;(PGA)</td></tr>-->
-* [[FCBGA 1168]]
+*{{intel|Socket G2}} (PGA) • PGA-988B (PGA)
-* [[FCBGA 1088]]
+{{Template:packages/intel/pga-988b}} <!--
-* [[FCBGA 1023]]
+<tr><th>'''Socket'''</th><td>[[socket::Socket G2| ]]{{intel|Socket G2}}</td></tr>-->
-* [[FCBGA 676]]
+*{{packages|FCPGA-946}} (PGA) • rPGA-946B/947 (FCPGA-1364)
-* [[FCBGA 559]]
+{{Template:packages/intel/fcpga-946}} <!--
-* [[FCBGA 437]]
+<tr><th>'''Package'''</th><td>[[package::FCPGA-1364| ]]{{packages|FCPGA-946}} (PGA)</td></tr>-->
 == BGA CPU Packages ==
-* [[packages/bga-1288|BGA-1288]] ([[Intel]])
+===[[AMD]] BGA Packages===
+:; [[amd/List of AMD CPU sockets|List of AMD CPU sockets]]
 <table class="wikitable sortable">
@@ Line 35: / Line 96: @@
 <!-- [[Category:~*]] -->
   [[instance of::package]]
-  [[designer::~*]]
+  [[designer::~*AMD*]]
   [[package::~*BGA*]]
   |?name
@@ Line 51: / Line 112: @@
   |template=proc table 2
   |userparam=9
+ |limit=100
   |valuesep=,
   |mainlabel=-
 }}
 </table>
+===[[Intel]] BGA Packages===
+* [[packages/bga-1288|BGA-1288]] ([[Intel]])
+* FCBGA-1377 (26.5 x 18.5 mm) • Ice Lake Y
+* FCBGA-1392 • Cannon Lake Y
+* FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
+* FCBGA-1510 • Cannon Lake U
+* FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
+* FCBGA-1526 (50 x 25 mm) • Ice Lake U
+* FCBGA-1528 • Whiskey Lake U
+* FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
+* FCBGA-2579 • Ice Lake D
+* FCBGA-3325 (60 x 60 mm) • Intel Nervana
+* FCBGA-5903 • Cascade Lake AP
+====[[Intel]] LGA Packages====
+* FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
+:• [[intel/packages/lga-1151|LGA-1151]] • Socket H4
+* FCLGA-8 • [[Intel Xeon E7]] (Westmere, Ivy Bridge, Haswell, Broadwell)
+:• [[intel/packages/lga-1567|LGA-1567]] • Socket LS
+* FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
+:• LGA-1700 • Socket V
+* FCLGA-2066 (52.5 x 45 mm) • Skylake X, Skylake X Refresh
+:• LGA-2066 • Socket R4
+* FCLGA-3647 (76.2 x 56.6 mm) • Skylake SP, Cascade Lake SP
+:• LGA-3647 • Socket P
+* FCLGA-4189 • Ice Lake SP
+:• LGA-4189 • Socket P+ (W)
+* FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
+:• PLGA-2601
+=== [[Intel]] CPU Packages ===
+* FCBGA-437 • BGA-437 • [[Bonnell]]
+* FCBGA-441 • BGA-441 • [[Bonnell]]
+* FCBGA-518 • BGA-518 • [[Bonnell]]
+* rPGA-988A • [[packages/socket-g1|Socket G1]] • [[Westmere]]
+* rPGA-988B (FCBGA-1023/FCBGA-1224) • [[Socket G2]] • [[Sandy Bridge]]
+* FCBGA-1023 • [[Sandy Bridge]]
+* FCBGA-1090 • [[Goldmont Plus]]
+* FCLGA-1151 • [[intel/packages/lga-1151|LGA-1151]] • [[Skylake]] • [[Kaby Lake]]
+* FCLGA-1151 (FCLGA14C) • [[Socket H4]] • [[Coffee Lake]]
+* FCBGA-1288 • [[packages/bga-1288|BGA-1288]] • [[Westmere]]
+* FCBGA-1310 • [[Goldmont]]
+* FCBGA-1356 • BGA-1356 • [[Skylake]] • [[Kaby Lake]]
+* FCBGA-1440 • [[Coffee Lake]]
+* FCBGA-1510 • [[Cannon Lake]]
+* FCBGA-1528 • [[Coffee Lake]] • [[Whiskey Lake]]
+* [[intel/packages/lga-1567|LGA-1567]] • FCLGA-8 • [[Intel Xeon E7]] (Westmere, Ivy Bridge, Haswell, Broadwell)
+* FCLGA-2011-v3 • LGA-2011-v3 • [[Westmere]], [[Ivy Bridge]], [[Haswell]], [[Broadwell]]
+* FCLGA-2066 • [[Socket R]] • [[Skylake]] • [[Kaby Lake]]
+* FCLGA-2066 • [[Socket R4]] • [[Skylake (server)]] • [[Cascade Lake]]
+* FCBGA-2518 • [[Skylake (server)]]
+* FCBGA-2579 • [[Ice Lake|Ice Lake (server)]]
+* FCBGA-3325 • Spring Crest
+* FCLGA-3647 • [[Socket P]] • [[Cascade Lake]] • [[Skylake (server)]]
+* FCLGA-4189 • LGA-4189 • [[Socket P+]] (W) • [[Ice Lake|Ice Lake (server)]]
+* FCBGA-5903 • [[Cascade Lake]]
+<table class="wikitable sortable">
+<tr><th colspan="8" style="background:#D6D6FF;">Intel CPU Packages</th></tr>
+<tr><th colspan="4">General</th><th colspan="4">Details</th></tr>
+<tr><th>Package</th><th>Name</th><th>Contacts</th><th>[[TDP]]</th><th>Socket</th><th>[[µarch]]</th><th>Market</th><th>Release</th></tr>
+{{#ask:
+<!-- [[Category:~*]]
+ [[instance of::package]] -->
+ [[package::~*LGA-8*]]
+ [[designer::Intel]]
+ |?package
+ |?package
+ |?name
+ |?package contacts
+ |?tdp
+ |?socket
+ |?microarchitecture
+ |?market segment
+ |?first_launched
+ |sort=name
+ |order=ascending
+ |format=template
+ |template=proc table 2
+ |userparam=9
+ |limit=100
+ |valuesep=,
+ |mainlabel=-
+}}
+</table>
+===See also===
+*[[AMD]]
+*[[Intel]]
+*[[FCBGA]] ([[BGA]])
+*[[FCLGA]] ([[LGA]])
+<!--
+<pre>
+local data =
+	packages =
+		amd = {},
+		ibm =
+			-- Power9 Sforza
+			fclga_2601 =
+				p_name		= { 'FCLGA-2601' },
+				p_type		= 'PLGA',
+				p_size		= { '50 mm', '50 mm' },
+				p_pitch		= { '1.016 mm'},
+				p_contacts 	= 2601
+		intel =
+			-- Alder Lake S
+			fclga_1700 =
+				p_name		= { 'FCLGA-1700' },
+				p_type		= 'LGA',
+				p_size		= { '45.0 mm', '37.5 mm' },
+				p_contacts 	= 1700,
+				p_socket 	= { 'Socket V' }
+			-- Ice Lake D
+			fcbga_2579 =
+				p_name		= { 'FCBGA-2579' },
+				p_type		= 'BGA',
+				p_contacts 	= 2579
+			-- Ice Lake SP
+			fclga_4189 =
+				p_name		= { 'FCLGA-4189' },
+				p_type		= 'LGA',
+				p_contacts 	= 4189,
+				p_socket 	= { 'Socket W', 'LGA-4189' }
+			-- Ice Lake Y
+			fcbga_1377 =
+				p_name		= { 'FCBGA-1377' },
+				p_type		= 'BGA',
+				p_size		= { '26.5 mm', '18.5 mm', '1.0 mm' },
+				p_pitch		= { '0.43 mm'},
+				p_contacts 	= 1377,
+				p_socket 	= { 'Type 3' }
+			-- Ice Lake U
+			fcbga_1526 =
+				p_name		= { 'FCBGA-1526' },
+				p_type		= 'BGA',
+				p_size		= { '50 mm', '25 mm', '1.3 mm' },
+				p_pitch		= { '0.65 mm'},
+				p_contacts 	= 1526,
+				p_socket 	= { 'Type 4' }
+			-- Cannon Lake Y
+			fcbga_1392 =
+				p_name		= { 'FCBGA-1392' },
+				p_type		= 'BGA',
+				p_contacts 	= 1392
+			-- Cannon Lake U
+			fcbga_1510 =
+				p_name		= { 'FCBGA-1510' },
+				p_type		= 'BGA',
+				p_contacts 	= 1510
+			-- Cascade Lake AP
+			fcbga_5903 =
+				p_name		= { 'FCBGA-5903' },
+				p_type		= 'BGA',
+				p_pitch		= { '0.99 mm'},
+				p_contacts 	= 5903
+			-- Skylake SP, Cascade Lake SP
+			fclga_3647 =
+				p_name 		= { 'FCLGA-3647' },
+				p_type    	= 'FCLGA',
+				p_size		= { '76.16 mm', '56.6 mm' },
+				p_pitch		= { '0.8585 mm', '0.9906 mm'},
+				p_contacts 	= 3647,
+				p_socket 	= { 'Socket P', 'LGA-3647' }
+			-- Skylake X, Skylake X Refresh
+			fclga_2066 =
+				p_name		= { 'FCLGA-2066' },
+				p_type		= 'LGA',
+				p_size		= { '52.5 mm', '45 mm' },
+				p_pitch		= { '1.016 mm'},
+				p_contacts 	= 2066,
+				p_socket 	= { 'Socket R4' }
+			-- Whiskey Lake U
+			fcbga_1528 =
+				p_name		= { 'FCBGA-1528' },
+				p_type		= 'BGA',
+				p_contacts 	= 1528
+			-- Coffee Lake S, E
+			fclga_1151 =
+				p_name		= { 'FCLGA-1151', 'FCLGA14C' },
+				p_type		= 'LGA',
+				p_size		= { '37.5 mm', '37.5 mm', '4.4 mm' },
+				p_pitch		= { '0.914 mm'},
+				p_contacts 	= 1151,
+				p_socket 	= { 'Socket H4', 'LGA-1151' }
+			-- Coffee Lake H, HR
+			fcbga_1440 =
+				p_name		= { 'FCBGA-1440' },
+				p_type		= 'BGA',
+				p_size		= { '42 mm', '28 mm', '1.46 mm' },
+				p_contacts 	= 1440
+			-- Amber Lake Y
+			fcbga_1515 =
+				p_name		= { 'FCBGA-1515' },
+				p_type		= 'BGA',
+				p_size		= { '20 mm', '16.5 mm', '0.5 mm' },
+				p_pitch		= { '0.4 mm' },
+				p_contacts 	= 1515,
+			-- Broadwell DE, Hewitt Lake
+			fcbga_1667 =
+				p_name 		= { 'FCBGA-1667' },
+				p_type    	= 'FCBGA',
+				p_size		= { '37.5 mm', '37.5 mm', '3.557 mm' },
+				p_pitch		= { '0.7 mm'},
+				p_contacts 	= 1667
+			-- Intel Nervana
+			fcbga_3325 =
+				p_name 		= { 'FCBGA-3325' },
+				p_type    	= 'FCBGA',
+				p_size		= { '60 mm', '60 mm' },
+				p_contacts 	= 3325
+		cavium =
+			-- Vulcan
+			fclga_4077 =
+				p_name		= { 'FCLGA-4077' },
+				p_type		= 'LGA',
+				p_contacts 	= 4077
+		phytium =
+			-- Earth
+			fcbga_1150 =
+				p_name		= { 'FCBGA-1150' },
+				p_type		= 'BGA',
+				p_size		= { '37.5 mm', '37.5 mm' },
+				p_pitch		= { '0.914 mm'},
+				p_contacts 	= 1150
+			fcbga_1944 =
+				p_name		= { 'FCBGA-1944' },
+				p_type		= 'BGA',
+				p_size		= { '42.5 mm', '60 mm' },
+				p_pitch		= { '1.0 mm'},
+				p_contacts 	= 1944
+			-- Mars II
+			fcbga_3576 =
+				p_name		= { 'FCBGA-3576' },
+				p_type		= 'BGA',
+				p_size		= { '61 mm', '61 mm' },
+				p_contacts 	= 3576
+		tesla_car =
+			-- FSD chip
+			fcbga_2116 =
+				p_name		= { 'FCBGA-2116' },
+				p_type		= 'BGA',
+				p_size		= { '37.5 mm', '37.5 mm' },
+				p_contacts 	= 2116
+		mobileye =
+			-- EyeQ1
+			hsbga_292 =
+				p_name		= { 'HSBGA-292' },
+				p_type		= 'BGA',
+				p_size		= { '27 mm', '27 mm' },
+				p_pitch		= { '1.27 mm'},
+				p_contacts 	= 292
+		eta_compute =
+			-- ECM3532
+			bga81 =
+				p_name		= { 'BGA-81' },
+				p_type		= 'BGA',
+				p_size		= { '5 mm', '5 mm' },
+				p_contacts 	= 81
+</pre>
+-->
 [[Category:Semiconductor packages]]
+[[Category:Intel]]
+[[Category:AMD]]

Package	FCBGA-1224 (BGa)
Dimension	31 mm x 24 mm
Pitch	0.65 mm
Contacts	1224

Package	BGA-1288 (BGA)
Dimension	34 mm x 28 mm x 2.1 mm
Pitch	0.7 mm
Pin Count	1288

Package	FCBGA-1310 (BGA)
Dimension	34 mm x 28 mm
Ball Count	1310
Ball Comp	SAC405
Interconnect	BGA-1310

Package	FCBGA-1356 (BGA)
Dimension	42 mm x 24 mm x 1.3 mm
Pitch	0.65 mm
Ball Count	1356
Ball Comp	SAC405
Interconnect	BGA-1356

Package	FCBGA-1364 (BGA)
Dimension	37.4 mm x 32 mm
Pitch	0.7 mm
Ball Count	1364
Ball Comp	SAC405
Interconnect	BGA-1364

Package	FCBGA-1440 (BGA)
Dimension	42 mm x 28 mm x 1.49 mm
Pitch	0.65 mm
Ball Count	1440
Ball Comp	SAC405
Interconnect	BGA-1440

Package	FCBGA-1528 (BGA)
Dimension	46 mm x 24 mm x 1.3 mm
Ball Count	1528
Ball Comp	SAC405
Interconnect	BGA-1528

Package	FCBGA-2518 (BGA)
Dimension	45 mm x 52.5 mm
Contacts	2518

Package	FCLGA-1151 (LGA) FC-LGA14C
Dimension	37.5 mm x 37.5 mm x 4.4 mm
Pitch	0.914 mm
Contacts	1151
Socket	LGA-1151

Package	FCLGA-1155 (LGA)	125px
Dimension	37.5 mm x 37.5 mm
Contacts	1155
Socket	LGA-1155

Package	FCLGA-8 (LGA)
Dimension	49.1 mm x 56.4 mm x 4.2 mm
Pitch	1 mm
Pin Count	1567
Socket	LGA-1567

Package	rPGA-988A (rPGA)
Dimension	36 mm x 35 mm x 2.12 mm
Pitch	1 mm
Pin Count	988
Socket	Socket-G1 (PGA)

Package	rPGA988B (PGA)
Dimension	37.5 mm x 37.5 mm
Pitch	1 mm
Contacts	988
Socket	Socket G2

Package	FCPGA-946 (PGA)
Dimension	37.5 mm x 37.5 mm
Pitch	1.0 mm
Pins	946
Interconnect	rPGA-946B/947

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Flip Chip Ball Grid Array#package +
package	FCBGA-437 +, FCBGA-441 +, FCBGA-518 +, FCBGA-1023 +, FCBGA-1090 +, FCBGA-1224 +, BGA-1288 +, FCBGA-1310 +, FCBGA-1356 +, FCBGA-1364 +, FCBGA-1440 +, FCBGA-1528 +, FCBGA-2518 +, FCLGA-1151 +, FCLGA-1155 +, FCLGA-8 +, rPGA-988A +, rPGA988B + and FCPGA-1364 +
socket	BGA-437 +, BGA-441 +, BGA-518 +, LGA-1151 +, LGA-1155 + and Socket G2 +