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Difference between revisions of "qualcomm/microarchitectures/cloud ai 100"
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'''Cloud AI 100''' is an [[NPU]] microarchitecture designed by [[Qualcomm]] for the server and edge market. Those NPUs are sold under the {{qualcomm|Cloud AI}} brand.
 
'''Cloud AI 100''' is an [[NPU]] microarchitecture designed by [[Qualcomm]] for the server and edge market. Those NPUs are sold under the {{qualcomm|Cloud AI}} brand.
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== Process Technology ==
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The Cloud AI 100 SoC is fabricated on TSMC's [[7-nanometer process]].
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== Architecture ==
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=== Key Features ===
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== Block Diagram ==
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=== SoC ===
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:[[File:cloud ai 100 soc.svg|700px]]
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=== AI Core ===
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:[[File:cloud ai 100 ai core.svg|350px]]
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== Memory Hierarchy ==
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* L1D$ / L1I$
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** Private per AI Core
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* L2
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** 1 MiB / AI Core
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* Vector Tightly-Coupled Memory (VTCM)
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** 8 MiB / AI Core
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* DRAM
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** 8-32 GiB
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*** LPDDR4x-4266
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**** 68.25 - 136.5 GB/s
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== Overview ==
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== AI Core ==
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== Performance claims ==
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Performance-per-watt was published by Quall based on an Int8 3×3 convolution operation with uniformly distributed weights and input action comprising 50% zeros which Qualcomm says is typical for Deep CNN with Relu operators. To that end, Qualcomm says the AI 100 can achieve up to ~150 TOPs at ~12 W at over 12 TOPS/W in edge cases and ~363 TOPs at under 70 W at 5.24 TOPs/W in data center uses. Numbers are at the SoC level.
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{| class="wikitable"
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! SoC Power
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| 12.05 W || 19.74 W || 69.26 W
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|-
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! TOPS
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| 149.01 || 196.94 || 363.02
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|-
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! TOPS/W
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| 12.37 || 9.98 || 5.24
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|}
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== Bibliography ==
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* Linley Fall Processor Conference 2021
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* {{bib|hc|33|Qualcomm}}

Latest revision as of 05:27, 15 September 2021

Edit Values
Cloud AI 100 µarch
General Info
Arch TypeNPU
DesignerQualcomm
ManufacturerTSMC
IntroductionMarch, 2021
Process7 nm
PE Configs16
Pipeline
TypeVLIW
Decode4-way
Cache
L2 Cache1 MiB/core
Side Cache8 MiB/core

Cloud AI 100 is an NPU microarchitecture designed by Qualcomm for the server and edge market. Those NPUs are sold under the Cloud AI brand.

Process Technology[edit]

The Cloud AI 100 SoC is fabricated on TSMC's 7-nanometer process.

Architecture[edit]

Key Features[edit]

Block Diagram[edit]

SoC[edit]

cloud ai 100 soc.svg

AI Core[edit]

cloud ai 100 ai core.svg

Memory Hierarchy[edit]

  • L1D$ / L1I$
    • Private per AI Core
  • L2
    • 1 MiB / AI Core
  • Vector Tightly-Coupled Memory (VTCM)
    • 8 MiB / AI Core
  • DRAM
    • 8-32 GiB
      • LPDDR4x-4266
        • 68.25 - 136.5 GB/s

Overview[edit]

AI Core[edit]

Performance claims[edit]

Performance-per-watt was published by Quall based on an Int8 3×3 convolution operation with uniformly distributed weights and input action comprising 50% zeros which Qualcomm says is typical for Deep CNN with Relu operators. To that end, Qualcomm says the AI 100 can achieve up to ~150 TOPs at ~12 W at over 12 TOPS/W in edge cases and ~363 TOPs at under 70 W at 5.24 TOPs/W in data center uses. Numbers are at the SoC level.

SoC Power 12.05 W 19.74 W 69.26 W
TOPS 149.01 196.94 363.02
TOPS/W 12.37 9.98 5.24

Bibliography[edit]

  • Linley Fall Processor Conference 2021
  • Qualcomm, IEEE Hot Chips 33 Symposium (HCS) 2021.
Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/microarchitectures/cloud_ai_100&oldid=99318"
Facts about "Cloud AI 100 - Microarchitectures - Qualcomm"
RDF feed
codenameCloud AI 100 +
designerQualcomm +
first launchedMarch 2021 +
full page namequalcomm/microarchitectures/cloud ai 100 +
instance ofmicroarchitecture +
manufacturerTSMC +
nameCloud AI 100 +
process7 nm (0.007 μm, 7.0e-6 mm) +
processing element count16 +