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Difference between revisions of "qualcomm/cloud ai"
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'''Cloud AI''' is a family of [[neural processors]] for the edge and data center market designed by [[Qualcomm]] and introduced in early 2021.
 
'''Cloud AI''' is a family of [[neural processors]] for the edge and data center market designed by [[Qualcomm]] and introduced in early 2021.
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== Cloud AI 100 ==
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{{main|qualcomm/microarchitectures/cloud ai|l1=Cloud AI}}
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[[File:qualcomm-cloud-ai-100-2.png|right]]
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Launched in early 2021, the Cloud AI 100 series are the first series of AI inference processors. Those processors range from 70 [[TOPS]] / 35 [[FLOPS]] to 400 [[TOPS]] / 200 [[FLOPS]] and are offered in both PCIe cards and M.2 modules (with and without heatsinks).
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{| class="wikitable" style="text-align: center;"
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|-
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! FF
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| PCIe (HHHL) || Dual M.2 || Dual M.2e (No Heatsink)
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|-
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! Size
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| 68.9 mm x 169.5 mm || 46 mm x 110 mm || 46 mm x 110 mm
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|-
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! TDP
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| 75 W || 15-25 W || 15-25 W
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|-
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! colspan="4" | Peak Compute
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|-
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! Int8
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| 400 TOPS || 200 TOPS || 70 TOPS
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|-
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! FP16
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| 200 teraFLOPS || 100 teraFLOPS || 35 teraFLOPS
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|-
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! colspan="4" | Configuration
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|-
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! SRAM
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| 144 MiB || 144 MiB || 72 MiB
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|-
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! DRAM (w/ECC)
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| 16 GiB LPDDR4x-4266
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| 32 GiB LPDDR4x-4266
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| 8 GiB LPDDR4x-4266
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|-
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! DRAM B/W
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| 136.5 GB/s
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| 136.5 GB/s
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| 68.25 GB/s
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|-
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! Host Interface
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| PCIe Gen 4 (x8)
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| PCIe Gen 4 (x8)
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| PCIe Gen 3 (x4)
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|}

Revision as of 04:48, 15 September 2021

Qualcomm Cloud AI
Developer Qualcomm
Type System on chips
Introduction Apr 9, 2019 (announced)
March, 2021 (launch)
Architecture Multi-core Neural Processor
ISA Custom
µarch Cloud AI
Process 7 nm
0.007 μm
7.0e-6 mm
Technology CMOS

Cloud AI is a family of neural processors for the edge and data center market designed by Qualcomm and introduced in early 2021.

Cloud AI 100

Main article: Cloud AI
qualcomm-cloud-ai-100-2.png

Launched in early 2021, the Cloud AI 100 series are the first series of AI inference processors. Those processors range from 70 TOPS / 35 FLOPS to 400 TOPS / 200 FLOPS and are offered in both PCIe cards and M.2 modules (with and without heatsinks).

FF PCIe (HHHL) Dual M.2 Dual M.2e (No Heatsink)
Size 68.9 mm x 169.5 mm 46 mm x 110 mm 46 mm x 110 mm
TDP 75 W 15-25 W 15-25 W
Peak Compute
Int8 400 TOPS 200 TOPS 70 TOPS
FP16 200 teraFLOPS 100 teraFLOPS 35 teraFLOPS
Configuration
SRAM 144 MiB 144 MiB 72 MiB
DRAM (w/ECC) 16 GiB LPDDR4x-4266 32 GiB LPDDR4x-4266 8 GiB LPDDR4x-4266
DRAM B/W 136.5 GB/s 136.5 GB/s 68.25 GB/s
Host Interface PCIe Gen 4 (x8) PCIe Gen 4 (x8) PCIe Gen 3 (x4)
Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/cloud_ai&oldid=99304"
Facts about "Cloud AI - Qualcomm"
RDF feed
designerQualcomm +
first announcedApril 9, 2019 +
first launchedMarch 2021 +
full page namequalcomm/cloud ai +
instance ofsystem on a chip family +
instruction set architectureCustom +
main designerQualcomm +
microarchitectureCloud AI +
nameQualcomm Cloud AI +
process7 nm (0.007 μm, 7.0e-6 mm) +
technologyCMOS +