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|technology=CMOS | |technology=CMOS | ||
+ | |die area=100 mm² | ||
|word size=64 bit | |word size=64 bit | ||
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− | |max mem= | + | |max mem=6 GiB |
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* [[used by::LeEco Le 2 Pro X620]] | * [[used by::LeEco Le 2 Pro X620]] | ||
* [[used by::LeEco Le 2 X620]] | * [[used by::LeEco Le 2 X620]] | ||
+ | * [[used by::LeEco Le S3 X626]] | ||
* [[used by::Meizu MX6]] | * [[used by::Meizu MX6]] | ||
* [[used by::Sharp Z2]] | * [[used by::Sharp Z2]] | ||
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* [[used by::Xiaomi Redmi Pro]] | * [[used by::Xiaomi Redmi Pro]] | ||
* [[used by::Leagoo T10]] | * [[used by::Leagoo T10]] | ||
+ | * [[used by::Lenovo k8 Note]] | ||
+ | * [[used by::Chuwi Hi9 Air]] | ||
+ | * [[used by::CHAOHENG 10]] | ||
+ | * [[used by::Infinix Zero 4 Plus]] | ||
+ | {{expand list}} | ||
+ | |||
+ | == Die == | ||
+ | * TSMC [[20 nm process]] | ||
+ | * 100 mm² die size | ||
+ | * Quad-core ULP {{armh|Cortex-A53|l=arch}} | ||
+ | ** ~21.81 mm² per cluster | ||
+ | *** ~4.23 mm² per core | ||
+ | * Quad-core efficient {{armh|Cortex-A53|l=arch}} | ||
+ | ** ~29.73 mm² per cluster | ||
+ | *** ~5.41 mm² per core | ||
+ | * Dual-core High-performance {{armh|Cortex-A72|l=arch}} + 1 MiB L2 | ||
+ | ** ~27.36 mm² per cluster | ||
+ | *** ~ 9.60 mm² per core | ||
+ | *** ~ 7.50 mm² for 1 MiB L2 | ||
+ | |||
+ | |||
+ | :[[File:mt6797 die.png|600px]] | ||
+ | |||
+ | == Bibliography == | ||
+ | * Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016. |
Latest revision as of 21:16, 2 May 2021
Edit Values | |
MediaTek Helio X20 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X20 |
Part Number | MT6797, MTK6797 |
Market | Mobile, Embedded |
Introduction | May 12, 2015 (announced) March 16, 2016 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,100 MHz, 1,850 MHz, 1,400 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A72 |
Core Name | Cortex-A53, Cortex-A72 |
Process | 20 nm |
Technology | CMOS |
Die | 100 mm² |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Helio X20 (MT6797) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.1 GHz) and supports up to 6 GiB of dual-channel LPDDR3-1866 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.
The Helio X20 is identical to Helio X25 except for the lower clocked A72 cores and the lower clocked GPU.
Contents
Architecture[edit]
The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
- Extreme Performance - 2x Cortex-A72 @ 2.3 GHz
- Performance/Power Balance - 4x Cortex-A53 @ 1.85 GHz
- Power Efficiency - 4x Cortex-A53 @ 1.4 GHz
The three clusters are designed as a modified big.LITTLE configuration.
Cache[edit]
- Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
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This section is empty; you can help add the missing info by editing this page. |
Memory controller[edit]
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Integrated Memory Controller
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Expansions[edit]
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Expansion Options
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Graphics[edit]
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Integrated Graphics Information
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Wireless[edit]
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Wi-Fi | ||||||||||||||||
WiFi |
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Cellular | ||||||||||||||||
2G |
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3G |
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4G |
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Image[edit]
- Integrated image signal processor supports 32 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video[edit]
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
Audio[edit]
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Alcatel Flash (2017)
- Doogee F7
- Doogee F7 Pro
- Elephone R9
- Elephone S7
- HomTom HT10
- Kodak Ektra
- LeEco Le 2 Pro X620
- LeEco Le 2 X620
- LeEco Le S3 X626
- Meizu MX6
- Sharp Z2
- Vernee Apollo Lite
- Xiaomi Redmi Note 4
- Xiaomi Redmi Pro
- Leagoo T10
- Lenovo k8 Note
- Chuwi Hi9 Air
- CHAOHENG 10
- Infinix Zero 4 Plus
This list is incomplete; you can help by expanding it.
Die[edit]
- TSMC 20 nm process
- 100 mm² die size
- Quad-core ULP Cortex-A53
- ~21.81 mm² per cluster
- ~4.23 mm² per core
- ~21.81 mm² per cluster
- Quad-core efficient Cortex-A53
- ~29.73 mm² per cluster
- ~5.41 mm² per core
- ~29.73 mm² per cluster
- Dual-core High-performance Cortex-A72 + 1 MiB L2
- ~27.36 mm² per cluster
- ~ 9.60 mm² per core
- ~ 7.50 mm² for 1 MiB L2
- ~27.36 mm² per cluster
Bibliography[edit]
- Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
- all microprocessor models
- microprocessor models by mediatek
- microprocessor models by mediatek based on cortex-a53
- microprocessor models by mediatek based on cortex-a72
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a72
- microprocessor models by tsmc
base frequency | 2,100 MHz (2.1 GHz, 2,100,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 10 + |
core name | Cortex-A53 + and Cortex-A72 + |
designer | MediaTek + and ARM Holdings + |
die area | 100 mm² (0.155 in², 1 cm², 100,000,000 µm²) + |
family | Helio + |
first announced | May 12, 2015 + |
first launched | March 16, 2016 + |
full page name | mediatek/helio/mt6797 + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has cdma2000 1x support | true + |
has cdma2000 1xev-do support | true + |
has cdma2000 support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | Mali-T880 + |
integrated gpu base frequency | 780 MHz (0.78 GHz, 780,000 KHz) + |
integrated gpu designer | ARM Holdings + |
integrated gpu execution units | 4 + |
isa | ARMv8 + |
isa family | ARM + |
ldate | March 16, 2016 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max memory channels | 2 + |
microarchitecture | Cortex-A53 + and Cortex-A72 + |
model number | Helio X20 + |
name | MediaTek Helio X20 + |
part number | MT6797 + and MTK6797 + |
process | 20 nm (0.02 μm, 2.0e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1600 + |
technology | CMOS + |
thread count | 10 + |
used by | Alcatel Flash (2017) +, Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, Kodak Ektra +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, LeEco Le S3 X626 +, Meizu MX6 +, Sharp Z2 +, Vernee Apollo Lite +, Xiaomi Redmi Note 4 +, Xiaomi Redmi Pro +, Leagoo T10 +, Lenovo k8 Note +, Chuwi Hi9 Air +, CHAOHENG 10 + and Infinix Zero 4 Plus + |
user equipment category | 6 + |
word size | 64 bit (8 octets, 16 nibbles) + |