Semiconductor & Computer Engineering
(→Members: Added 800 series and Kirin 810) |
(Add of the new kirin 990 5G chipset) |
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[https://www.google.com/search?q=Kirin+960 Kirin 960]<br /> | [https://www.google.com/search?q=Kirin+960 Kirin 960]<br /> | ||
[[Kirin 970]]<br /> | [[Kirin 970]]<br /> | ||
| − | [[Kirin 980]] | + | [[Kirin 980]]<br /> |
| + | [https://www.google.com/search?q=Kirin+990+5G Kirin 990 5G] | ||
Revision as of 07:13, 23 April 2020
| Kirin | |
| |
| Kirin Logo | |
| Developer | HiSilicon, ARM Holdings |
| Manufacturer | TSMC |
| Type | System on chips |
| Introduction | 2013 (announced) 2014 (launch) |
| Architecture | Performance mobile ARM SoCs |
| ISA | ARM |
| µarch | Cortex-A7, Cortex-A9, Cortex-A53, Cortex-A72, Cortex-A73 |
| Word size | 32 bit 4 octets , 64 bit8 nibbles 8 octets
16 nibbles |
| Process | 28 nm 0.028 μm , 16 nm2.8e-5 mm 0.016 μm , 10 nm1.6e-5 mm 0.01 μm , 7 nm1.0e-5 mm 0.007 μm
7.0e-6 mm |
| Technology | CMOS |
| Clock | 1,200 MHz-2,300 MHz |
| Succession | |
| ← | |
| K3 | |
Kirin is a family of 32-bit and 64-bit mobile ARM performance SoCs introduced by HiSilicon in 2014 as a successor to the K3 series.
Overview
HiSilicon has always been the integrated circuit arm of Huawei, developing various ICs and embedded microprocessors for their consumer electronics. It wasn't until 2008 with the introduction of the K3 family that HiSilicon started focusing on developing in-house high-performance microprocessors for the mobile market. In late 2013 HiSilicon introduced the Kirin family which featured their flagship high-performance mobile microprocessors found in their high-end phones and tablets.
Over the last couple of years, the Kirin family grew to include various mid-range performance models in addition to their high-end performance flagship processors. Latest models often utilize ARM's latest cores fabricated on TSMC's latest technology node.
Members
600 Series
700 Series
800 Series
900 Series
Kirin 910
Kirin 920
Kirin 930
Kirin 950
Kirin 960
Kirin 970
Kirin 980
Kirin 990 5G
| designer | HiSilicon + and ARM Holdings + |
| first announced | 2013 + |
| first launched | 2014 + |
| full page name | hisilicon/kirin + |
| instance of | system on a chip family + |
| instruction set architecture | ARM + |
| main designer | HiSilicon + |
| manufacturer | TSMC + |
| microarchitecture | Cortex-A7 +, Cortex-A9 +, Cortex-A53 +, Cortex-A72 + and Cortex-A73 + |
| name | Kirin + |
| process | 28 nm (0.028 μm, 2.8e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) +, 10 nm (0.01 μm, 1.0e-5 mm) + and 7 nm (0.007 μm, 7.0e-6 mm) + |
| technology | CMOS + |
| word size | 32 bit (4 octets, 8 nibbles) + and 64 bit (8 octets, 16 nibbles) + |