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{{intel title|i3-1000G1}}
 
{{intel title|i3-1000G1}}
 
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'''Core i3-1000G1''' is a {{arch|64}} [[dual-core]] high-end performance ultra-low power [[x86]] mobile microprocessor introduced by [[Intel]] in mid-[[2019]]. This chip, which is based on the {{intel|Ice Lake|l=arch}} microarchitecture, is fabricated on Intel's [[10 nm process]]. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a {{intel|Turbo Boost}} frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz.

Revision as of 12:50, 5 August 2019

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General Info
Microarchitecture

Core i3-1000G1 is a 64-bit dual-core high-end performance ultra-low power x86 mobile microprocessor introduced by Intel in mid-2019. This chip, which is based on the Ice Lake microarchitecture, is fabricated on Intel's 10 nm process. The i3-1000G1 operates at 1.1 GHz with a TDP of 9 W supporting a Turbo Boost frequency of up to 3.2 GHz. The processor supports up to 32 GiB of quad-channel LPDDR4X-3733 memory and incorporates Intel's UHG Graphics IGP operating at 300 MHz with a burst frequency of 900 MHz.

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Facts about "Core i3-1000G1 - Intel"
RDF feed
back imageFile:ice lake y (back).png +
base frequency1,100 MHz (1.1 GHz, 1,100,000 kHz) +
bus links4 +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier11 +
core count2 +
core family6 +
core nameIce Lake Y +
designerIntel +
device id0x8A58 +
familyCore i3 +
first announcedAugust 1, 2019 +
first launchedAugust 1, 2019 +
full page nameintel/core i3/i3-1000g1 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has advanced vector extensions 512true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Vector Extensions 512 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard + and Flex Memory Access +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel secure key technologytrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuUHD Graphics +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units32 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isax86-64 +
isa familyx86 +
l1$ size160 KiB (163,840 B, 0.156 MiB) +
l1d$ description12-way set associative +
l1d$ size96 KiB (98,304 B, 0.0938 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateAugust 1, 2019 +
main imageFile:ice lake y (front).png +
main image captionPackage, front +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth55.63 GiB/s (56,965.12 MiB/s, 59.732 GB/s, 59,732.258 MB/s, 0.0543 TiB/s, 0.0597 TB/s) +
max memory channels4 +
max usb ports4 +
microarchitectureIce Lake (Client) +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model numberi3-1000G1 +
nameCore i3-1000G1 +
packageFCBGA-1377 +
platformIce Lake +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesi3-10000 +
smp max ways1 +
socketType 3 +
supported memory typeLPDDR4X-3733 + and DDR4-3200 +
tdp9 W (9,000 mW, 0.0121 hp, 0.009 kW) +
tdp down8 W (8,000 mW, 0.0107 hp, 0.008 kW) +
tdp down frequency800 MHz (0.8 GHz, 800,000 kHz) +
tdp up12 W (12,000 mW, 0.0161 hp, 0.012 kW) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)3,200 MHz (3.2 GHz, 3,200,000 kHz) +
turbo frequency (2 cores)3,200 MHz (3.2 GHz, 3,200,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +