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{{mediatek title|Helio X23 (MT6797D)}} | {{mediatek title|Helio X23 (MT6797D)}} | ||
− | {{ | + | {{chip |
− | |name= | + | |name=Helio X23 |
|no image=Yes | |no image=Yes | ||
|designer=MediaTek | |designer=MediaTek | ||
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'''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6. | '''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6. | ||
− | The Helio X23 is identical to {{\\|Helio X20}} | + | The Helio X23 is almost identical to {{\\|Helio X20}} but clocks a bit higher, provides additional support for a dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology. |
== Architecture == | == Architecture == | ||
The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications. | The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications. | ||
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* [[used by::Meizu MX6]] | * [[used by::Meizu MX6]] | ||
* [[used by::Lenovo K8 note]] | * [[used by::Lenovo K8 note]] | ||
+ | * [[used by::LeEco Le Pro 3 Ai]] | ||
+ | Chuwi hi9 air |
Latest revision as of 03:36, 23 June 2019
Edit Values | |
Helio X23 | |
General Info | |
Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X23 |
Part Number | MT6797D, MTK6797D |
Market | Mobile, Embedded |
Introduction | December 2, 2016 (announced) December 2, 2016 (launched) |
General Specs | |
Family | Helio |
Series | Helio X |
Frequency | 2,300 MHz, 1,850 MHz, 1,400 MHz |
Bus type | AMBA 4 AXI |
Microarchitecture | |
ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A72 |
Core Name | Cortex-A53, Cortex-A72 |
Process | 20 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
Max Memory | 4 GiB |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Helio X23 (MT6797D) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in late 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.
The Helio X23 is almost identical to Helio X20 but clocks a bit higher, provides additional support for a dual-camera setup and MiraVision's EnergySmart Screen technology.
Contents
Architecture[edit]
The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
- Extreme Performance - 2x Cortex-A72 @ 2.3 GHz
- Performance/Power Balance - 4x Cortex-A53 @ 1.85 GHz
- Power Efficiency - 4x Cortex-A53 @ 1.4 GHz
The three clusters are designed as a modified big.LITTLE configuration.
Cache[edit]
- Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
This section is empty; you can help add the missing info by editing this page. |
Memory controller[edit]
Integrated Memory Controller
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Expansions[edit]
Expansion Options
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Graphics[edit]
Integrated Graphics Information
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Wireless[edit]
Wireless Communications | ||||||||||||||||
Wi-Fi | ||||||||||||||||
WiFi |
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Cellular | ||||||||||||||||
2G |
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3G |
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4G |
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Image[edit]
- Integrated image signal processor supports 32 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video[edit]
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
Audio[edit]
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Doogee F7
- Doogee F7 Pro
- Elephone R9
- Elephone S7
- HomTom HT10
- LeEco Le 2 Pro X620
- LeEco Le 2 X620
- Meizu MX6
- Lenovo K8 note
- LeEco Le Pro 3 Ai
Chuwi hi9 air
- all microprocessor models
- microprocessor models by mediatek
- microprocessor models by mediatek based on cortex-a53
- microprocessor models by mediatek based on cortex-a72
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a72
- microprocessor models by tsmc
base frequency | 2,300 MHz (2.3 GHz, 2,300,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 10 + |
core name | Cortex-A53 + and Cortex-A72 + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | December 2, 2016 + |
first launched | December 2, 2016 + |
full page name | mediatek/helio/mt6797d + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has cdma2000 1x support | true + |
has cdma2000 1xev-do support | true + |
has cdma2000 support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has feature | Dual-Camera Setup + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | Mali-T880 + |
integrated gpu base frequency | 780 MHz (0.78 GHz, 780,000 KHz) + |
integrated gpu designer | ARM Holdings + |
integrated gpu execution units | 4 + |
isa | ARMv8 + |
isa family | ARM + |
ldate | December 2, 2016 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory bandwidth | 11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) + |
max memory channels | 2 + |
microarchitecture | Cortex-A53 + and Cortex-A72 + |
model number | Helio X23 + |
name | Helio X23 + |
part number | MT6797D + and MTK6797D + |
process | 20 nm (0.02 μm, 2.0e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1600 + |
technology | CMOS + |
thread count | 10 + |
used by | Doogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, Meizu MX6 +, Lenovo K8 note + and LeEco Le Pro 3 Ai + |
user equipment category | 6 + |
word size | 64 bit (8 octets, 16 nibbles) + |