Semiconductor & Computer Engineering
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Difference between revisions of "Talk:intel/microarchitectures/ice lake (client)"
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Regards, AM (myname4rwt@jee-male.com) 30.05.2019 | Regards, AM (myname4rwt@jee-male.com) 30.05.2019 | ||
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| + | :Die estimates are for the physical diced die as can be seen from the package. | ||
| + | :There is a measurement for one of the PCH on the page along with a die shot. | ||
| + | :I did not bother with the smaller PCH or the ICL-Y parts. If you are trying to get an idea of 10nm scaling, it's very good. --[[User:David|David]] ([[User talk:David|talk]]) 12:53, 30 May 2019 (EDT) | ||
Revision as of 11:53, 30 May 2019
| This is the discussion page for the intel/microarchitectures/ice lake (client) page. |
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Die size
Regarding the ~11.44 mm x ~10.71 mm die dimensions.
David, do these numbers refer to printed image including streets, printed image without streets, or to physical die dimensions (after dicing)?
What are your estimates for the remaining two of three total?
I calculated meticulously all three on my own before finding out you did it too, so I think it would be interesting to compare our findings.
Regards, AM (myname4rwt@jee-male.com) 30.05.2019
- Die estimates are for the physical diced die as can be seen from the package.
- There is a measurement for one of the PCH on the page along with a die shot.
- I did not bother with the smaller PCH or the ICL-Y parts. If you are trying to get an idea of 10nm scaling, it's very good. --David (talk) 12:53, 30 May 2019 (EDT)