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Difference between revisions of "renesas/r-car/h3"
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{{renesas title|R-Car H3}}
 
{{renesas title|R-Car H3}}
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{{mpu
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{{chip
 
|name=R-Car H3
 
|name=R-Car H3
 
|image=r-car h3.png
 
|image=r-car h3.png
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|process=16 nm
 
|process=16 nm
 
|technology=CMOS
 
|technology=CMOS
 +
|die area=111.36 mm²
 +
|die length=12.94 mm
 +
|die width=8.61 mm
 
|word size=64 bit
 
|word size=64 bit
 
|core count=9
 
|core count=9
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|package module 1={{packages/renesas/fcbga-1384}}
 
|package module 1={{packages/renesas/fcbga-1384}}
 
}}
 
}}
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'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a single {{armh|Cortex-R7}} core for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
+
'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a dual-core lock-step {{armh|Cortex-R7}} for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
  
 
Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.
 
Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.
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== Cache ==
 
== Cache ==
 
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
 
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
 +
 +
Cortex-A57 Cluster:
 +
 +
{{cache size
 +
|l1 cache=256 KiB
 +
|l1i cache=128 KiB
 +
|l1i break=4x48 KiB
 +
|l1d cache=128 KiB
 +
|l1d break=4x32 KiB
 +
|l2 cache=2 MiB
 +
|l2 break=1x2 MiB
 +
}}
 +
 +
Cortex-A53 Cluster:
 +
 
{{cache size
 
{{cache size
−
|l1 cache=640 KiB
+
|l1 cache=256 KiB
−
|l1i cache=352 KiB
+
|l1i cache=128 KiB
−
|l1i break=4x48+5x32 KiB
+
|l1i break=4x32 KiB
−
|l1d cache=288 KiB
+
|l1d cache=128 KiB
−
|l1d break=9x32 KiB
+
|l1d break=4x32 KiB
−
|l2 cache=2.5 MiB
+
|l2 cache=512 KiB
 +
|l2 break=1x512 KiB
 
}}
 
}}
  
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|wmmx2=No
 
|wmmx2=No
 
}}
 
}}
 +
 +
== Block Diagram ==
 +
:: [[File:r-car h3 block.png|750px]]
 +
 +
== Die ==
 +
* [[16 nm process]], CMOS FinFET
 +
* 12.94 mm × 8.61 mm
 +
* 111.36 mm² die size
 +
* Quad-core {{armh|Cortex-A53|l=arch}}
 +
** ~3.27 mm² cluster
 +
** ~0.60 mm² core
 +
** ~0.7`mm² L2 cache
 +
* Quad-core {{armh|Cortex-A57|l=arch}}
 +
** ~10.21 mm² cluster
 +
** ~1.66 mm² core
 +
** ~3.28 mm² L2 cache
 +
* {{armh|Cortex-R7|l=arch}} (dual-core [[lock-step]])
 +
** ~1.04 mm² cluster
 +
* GX6650 GPU
 +
** ~28.12 mm²
 +
 +
 +
:: [[File:r-car h3 die shot.png|650px]]
 +
 +
== Bibliography ==
 +
* Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
 +
* Shibahara, Shinichi, et al. "A 16 nm FinFET Heterogeneous Nona-Core SoC Supporting ISO26262 ASIL B Standard." IEEE Journal of Solid-State Circuits 52.1 (2017): 77-88.

Latest revision as of 14:43, 29 December 2018

Edit Values
R-Car H3
r-car h3.png
General Info
DesignerRenesas,
ARM Holdings
ManufacturerTSMC
Model NumberH3
Part NumberR8A77950
MarketEmbedded
IntroductionDecember 2, 2015 (announced)
March, 2018 (launched)
General Specs
FamilyR-Car
Series3rd Gen
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53, Cortex-A57, Cortex-R7
Core NameCortex-A53, Cortex-A57, Cortex-R7
Process16 nm
TechnologyCMOS
Die111.36 mm²
12.94 mm × 8.61 mm
Word Size64 bit
Cores9
Threads9
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.8 V
VI/O3.3 V
Packaging
PackageFCBGA-1384 (BGA)
Dimension21 mm x 21 mm
Pitch0.50 mm
Ball Count1384
InterconnectBGA-1384

R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a dual-core lock-step Cortex-R7 for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6650 GPU.

Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache


Cortex-A57 Cluster:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x48 KiB  
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB  
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  1x2 MiB  

Cortex-A53 Cluster:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB  
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB  
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4-3200
Supports ECCNo
Controllers1
Channels4
Width32 bit
Max Bandwidth47.68 GiB/s
48,824.32 MiB/s
51.196 GB/s
51,196.01 MB/s
0.0466 TiB/s
0.0512 TB/s
Bandwidth
Single 11.92 GiB/s
Double 23.84 GiB/s
Quad 47.68 GiB/s

Expansions[edit]

  • PCI Express2.0 (1 lane) x 2 ch
  • USB 3.0 Host interface (DRD) × 1 ports (wPHY)
  • USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
  • SD Host interface × 4 ch (SDR104)
  • Multimedia card interface × 2 ch
  • Serial ATA interface × 1 ch
  • Media local bus (MLB) Interface × 1 ch (3 pin interface)
  • Controller Area Network (CAN-FD support) Interface × 2ch
  • Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
  • SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
  • Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
  • 32bit timer x 26 ch
  • PWM timer × 7 ch
  • I2C bus interface × 7 ch
  • Serial communication interface (SCIF) × 11 ch
  • Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
  • Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
  • Ethernet controller (IEEE802.3u, RMII, without PHY)
  • Digital radio interface (DRIF) × 4 ch

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GX6650
DesignerImagination Technologies

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported ARM Extensions & Processor Features
VFPv4Vector Floating Point (VFP) v4 Extension
NEONAdvanced SIMD extension
TrustZoneTrustZone Security Extensions

Block Diagram[edit]

r-car h3 block.png

Die[edit]

  • 16 nm process, CMOS FinFET
  • 12.94 mm × 8.61 mm
  • 111.36 mm² die size
  • Quad-core Cortex-A53
    • ~3.27 mm² cluster
    • ~0.60 mm² core
    • ~0.7`mm² L2 cache
  • Quad-core Cortex-A57
    • ~10.21 mm² cluster
    • ~1.66 mm² core
    • ~3.28 mm² L2 cache
  • Cortex-R7 (dual-core lock-step)
    • ~1.04 mm² cluster
  • GX6650 GPU
    • ~28.12 mm²


r-car h3 die shot.png

Bibliography[edit]

  • Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
  • Shibahara, Shinichi, et al. "A 16 nm FinFET Heterogeneous Nona-Core SoC Supporting ISO26262 ASIL B Standard." IEEE Journal of Solid-State Circuits 52.1 (2017): 77-88.
Retrieved from "https://en.wikichip.org/w/index.php?title=renesas/r-car/h3&oldid=85347"
Facts about "R-Car H3 - Renesas"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
R-Car H3 - Renesas#package +
core count9 +
core nameCortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage0.8 V (8 dV, 80 cV, 800 mV) +
designerRenesas + and ARM Holdings +
die area111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) +
die length12.94 mm (1.294 cm, 0.509 in, 12,940 µm) +
die width8.61 mm (0.861 cm, 0.339 in, 8,610 µm) +
familyR-Car +
first announcedDecember 2, 2015 +
first launchedMarch 2018 +
full page namerenesas/r-car/h3 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuPowerVR GX6650 +
integrated gpu designerImagination Technologies +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateMarch 2018 +
main imageFile:r-car h3.png +
manufacturerTSMC +
market segmentEmbedded +
max cpu count1 +
max memory bandwidth47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A57 + and Cortex-R7 +
model numberH3 +
nameR-Car H3 +
packageFCBGA-1384 +
part numberR8A77950 +
process16 nm (0.016 μm, 1.6e-5 mm) +
series3rd Gen +
smp max ways1 +
supported memory typeLPDDR4-3200 +
technologyCMOS +
thread count9 +
word size64 bit (8 octets, 16 nibbles) +