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Difference between revisions of "intel/xeon e3/e3-1535m v6"
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{{intel title|Xeon E3-1535M v6}}
 
{{intel title|Xeon E3-1535M v6}}
−
{{mpu
+
{{chip
−
| name               = Xeon E3-1535M v6
+
|name=Xeon E3-1535M v6
−
| no image           = Yes
+
|image=kaby lake h (front).png
−
| image              =
+
|caption=package, front
−
| image size          =  
+
|designer=Intel
−
| caption             =  
+
|manufacturer=Intel
−
| designer           = Intel
+
|model number=E3-1535M v6
−
| manufacturer       = Intel
+
|s-spec=SR32H
−
| model number       = E3-1535M v6
+
|market=Workstation
−
| part number        =
+
|market 2=Mobile
−
| part number 1      =
+
|first announced=January 3, 2017
−
| part number 2      =
+
|first launched=January 3, 2017
−
| part number 3      =
+
|release price=$623.00
−
| s-spec             =
+
|family=Xeon E3
−
| s-spec 2            =  
+
|series=E3-1500
−
| market             = Workstation
+
|locked=Yes
−
| market 2           = Server
+
|frequency=3,100 MHz
−
| first announced     = January 3, 2017
+
|turbo frequency1=4,200 MHz
−
| first launched     = January 3, 2017
+
|bus type=DMI 3.0
−
| last order          =
+
|bus rate=8 GT/s
−
| last shipment      =
+
|clock multiplier=31
−
| release price       =  
+
|isa=x86-64
−
 
+
|isa family=x86
−
| family             = Xeon E3
+
|microarch=Kaby Lake
−
| series             = E3-1500
+
|platform=Kaby Lake
−
| locked             = Yes
+
|chipset=Sunrise Point
−
| frequency           = 3,100 MHz
+
|core name=Kaby Lake H
−
| turbo frequency    = Yes
+
|core family=6
−
| turbo frequency1   = 4,200 MHz
+
|core model=158
−
| turbo frequency2    =
+
|core stepping=B0
−
| turbo frequency3    =
+
|process=14 nm
−
| turbo frequency4    =
+
|technology=CMOS
−
| bus type           = DMI 3.0
+
|word size=64 bit
−
| bus speed          =
+
|core count=4
−
| bus rate           = 8 GT/s
+
|thread count=8
−
| bus links          =
+
|max cpus=1
−
| clock multiplier   = 31
+
|max memory=64 GiB
−
| cpuid              =
+
|v core min=0.55 V
−
 
+
|v core max=1.52 V
−
| isa family          = x86
+
|tdp=45 W
−
| isa                 = x86-64
+
|ctdp down=35 W
−
| microarch           = Kaby Lake
+
|tjunc min=0 °C
−
| platform           = Kaby Lake
+
|tjunc max=100 °C
−
| chipset             = Sunrise Point
+
|tstorage min=-25 °C
−
| chipset 2          = Union Point
+
|tstorage max=125 °C
−
| core name           = Kaby Lake W
+
|package module 1={{packages/intel/fcbga-1440}}
−
| core family         =  
 
−
| core model         =  
 
−
| core stepping       =  
 
−
| process             = 14 nm
 
−
| transistors        =
 
−
| technology         = CMOS
 
−
| die area            =
 
−
| die width          =
 
−
| die length          =
 
−
| word size           = 64 bit
 
−
| core count         = 4
 
−
| thread count       = 8
 
−
| max cpus           = 1
 
−
| max memory         = 64 GiB
 
−
 
 
−
| electrical          = Yes
 
−
| v core min         = 0.55 V
 
−
| v core max         = 1.52 V
 
−
| v io                =
 
−
| v io tolerance      =
 
−
| v io 2              =
 
−
| sdp                =
 
−
| tdp                 = 45 W
 
−
| ctdp down           = 35 W
 
−
| ctdp down frequency =
 
−
| ctdp up            =
 
−
| ctdp up frequency  =
 
−
| tjunc min           = 0 °C
 
−
| tjunc max           = 100 °C
 
−
| tcase min          =
 
−
| tcase max          =
 
−
| tstorage min       = -25 °C
 
−
| tstorage max       = 125 °C
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
 
−
| packaging          = Yes
 
−
| package           = FCBGA-1440
 
−
| package type      = FCBGA
 
−
| package pitch      =
 
−
| package size      =
 
−
| socket            = BGA-1440
 
−
| socket type        = BGA
 
 
}}
 
}}
 
'''Xeon E3-1535M v6''' is a {{arch|64}} [[quad-core]] entry-level workstations and dense servers [[x86]] microprocessor introduced by [[Intel]] in [[2017]]. This processor, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is manufactured on Intel's improved [[14 nm process|14nm+ process]]. The E3-1535M v6 operates at 3.1 GHz with a TDP of 45 W and with a {{intel|Turbo Boost}} frequency of 4.2 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.1 GHz.
 
'''Xeon E3-1535M v6''' is a {{arch|64}} [[quad-core]] entry-level workstations and dense servers [[x86]] microprocessor introduced by [[Intel]] in [[2017]]. This processor, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is manufactured on Intel's improved [[14 nm process|14nm+ process]]. The E3-1535M v6 operates at 3.1 GHz with a TDP of 45 W and with a {{intel|Turbo Boost}} frequency of 4.2 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's {{intel|HD Graphics P630}} [[IGP]] operating at 350 MHz with a burst frequency of 1.1 GHz.
  
 +
This model supports a configurable TDP-down of 35 watts.
 
== Cache ==
 
== Cache ==
 
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
 
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
Line 99: Line 57:
 
|l1i break=4x32 KiB
 
|l1i break=4x32 KiB
 
|l1i desc=8-way set associative
 
|l1i desc=8-way set associative
−
|l1i policy=write-back
 
 
|l1d cache=128 KiB
 
|l1d cache=128 KiB
 
|l1d break=4x32 KiB
 
|l1d break=4x32 KiB
Line 135: Line 92:
 
| pcie config 2      = 2x8
 
| pcie config 2      = 2x8
 
| pcie config 3      = 1x8+2x4
 
| pcie config 3      = 1x8+2x4
 +
}}
 +
 +
== Graphics ==
 +
{{integrated graphics
 +
| gpu                = HD Graphics P630
 +
| device id          = 0x591D
 +
| designer            = Intel
 +
| execution units    = 24
 +
| max displays        = 3
 +
| max memory          = 64 GiB
 +
| frequency          = 350 MHz
 +
| max frequency      = 1,000 MHz
 +
 +
| output crt          =
 +
| output sdvo        =
 +
| output dsi          =
 +
| output edp          = Yes
 +
| output dp          = Yes
 +
| output hdmi        = Yes
 +
| output vga          =
 +
| output dvi          = Yes
 +
 +
| directx ver        = 12
 +
| opengl ver        = 4.4
 +
| opencl ver        = 2.0
 +
| hdmi ver          = 1.4a
 +
| dp ver            = 1.2
 +
| edp ver            = 1.4
 +
| max res hdmi      = 4096x2304
 +
| max res hdmi freq  = 30 Hz
 +
| max res dp        = 4096x2304
 +
| max res dp freq    = 60 Hz
 +
| max res edp        = 4096x2304
 +
| max res edp freq  = 60 Hz
 +
| max res vga        =
 +
| max res vga freq  =
 +
 +
| features            = Yes
 +
| intel quick sync    = Yes
 +
| intel intru 3d      = Yes
 +
| intel insider        =
 +
| intel widi          =
 +
| intel fdi            =
 +
| intel clear video    = Yes
 +
| intel clear video hd = Yes
 +
}}
 +
{{kaby lake hardware accelerated video table|col=1}}
 +
 +
== Features ==
 +
{{x86 features
 +
|real=Yes
 +
|protected=Yes
 +
|smm=Yes
 +
|fpu=Yes
 +
|x8616=Yes
 +
|x8632=Yes
 +
|x8664=Yes
 +
|nx=Yes
 +
|3dnow=No
 +
|e3dnow=No
 +
|mmx=Yes
 +
|emmx=Yes
 +
|sse=Yes
 +
|sse2=Yes
 +
|sse3=Yes
 +
|ssse3=Yes
 +
|sse41=Yes
 +
|sse42=Yes
 +
|sse4a=No
 +
|avx=Yes
 +
|avx2=Yes
 +
 +
|abm=Yes
 +
|tbm=No
 +
|bmi1=Yes
 +
|bmi2=Yes
 +
|fma3=Yes
 +
|fma4=No
 +
|aes=Yes
 +
|rdrand=Yes
 +
|sha=No
 +
|xop=No
 +
|adx=Yes
 +
|clmul=Yes
 +
|f16c=Yes
 +
|tbt1=No
 +
|tbt2=Yes
 +
|tbmt3=No
 +
|bpt=No
 +
|eist=Yes
 +
|sst=Yes
 +
|flex=Yes
 +
|fastmem=No
 +
|isrt=Yes
 +
|sba=No
 +
|mwt=Yes
 +
|sipp=Yes
 +
|att=No
 +
|ipt=No
 +
|tsx=Yes
 +
|txt=Yes
 +
|ht=Yes
 +
|vpro=Yes
 +
|vtx=Yes
 +
|vtd=Yes
 +
|ept=Yes
 +
|mpx=Yes
 +
|sgx=Yes
 +
|securekey=Yes
 +
|osguard=Yes
 +
|smartmp=No
 +
|powernow=No
 +
|amdv=No
 +
|rvi=No
 
}}
 
}}

Latest revision as of 12:42, 8 April 2018

Edit Values
Xeon E3-1535M v6
kaby lake h (front).png
package, front
General Info
DesignerIntel
ManufacturerIntel
Model NumberE3-1535M v6
S-SpecSR32H
MarketWorkstation, Mobile
IntroductionJanuary 3, 2017 (announced)
January 3, 2017 (launched)
Release Price$623.00
ShopAmazon
General Specs
FamilyXeon E3
SeriesE3-1500
LockedYes
Frequency3,100 MHz
Turbo Frequency4,200 MHz (1 core)
Bus typeDMI 3.0
Bus rate8 GT/s
Clock multiplier31
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
ChipsetSunrise Point
Core NameKaby Lake H
Core Family6
Core Model158
Core SteppingB0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores4
Threads8
Max Memory64 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP45 W
cTDP down35 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440

Xeon E3-1535M v6 is a 64-bit quad-core entry-level workstations and dense servers x86 microprocessor introduced by Intel in 2017. This processor, which is based on the Kaby Lake microarchitecture, is manufactured on Intel's improved 14nm+ process. The E3-1535M v6 operates at 3.1 GHz with a TDP of 45 W and with a Turbo Boost frequency of 4.2 GHz for a single active core. This MPU supports up to 64 GiB of dual-channel ECC DDR4-2400 memory and incorporates Intel's HD Graphics P630 IGP operating at 350 MHz with a burst frequency of 1.1 GHz.

This model supports a configurable TDP-down of 35 watts.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB4-way set associativewrite-back
L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-2133, DDR4-2400
Supports ECCYes
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes16
Configs1x16, 2x8, 1x8+2x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics P630
DesignerIntelDevice ID0x591D
Execution Units24Max Displays3
Max Memory64 GiB
65,536 MiB
67,108,864 KiB
68,719,476,736 B
Frequency350 MHz
0.35 GHz
350,000 KHz
Burst Frequency1,000 MHz
1 GHz
1,000,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
TXTTrusted Execution Technology (SMX)
vProIntel vPro
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
TSXTransactional Synchronization Extensions
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
SIPPStable Image Platform Program
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/xeon_e3/e3-1535m_v6&oldid=77103"
Facts about "Xeon E3-1535M v6 - Intel"
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Has subobject
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Xeon E3-1535M v6 - Intel#package + and Xeon E3-1535M v6 - Intel#io +
base frequency3,100 MHz (3.1 GHz, 3,100,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point +
clock multiplier31 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake H +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedJanuary 3, 2017 +
first launchedJanuary 3, 2017 +
full page nameintel/xeon e3/e3-1535m v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Stable Image Platform Program +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel stable image platform program supporttrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateJanuary 3, 2017 +
main imageFile:kaby lake h (front).png +
main image captionpackage, front +
manufacturerIntel +
market segmentWorkstation + and Mobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1535M v6 +
nameXeon E3-1535M v6 +
packageFCBGA-1440 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 623.00 (€ 560.70, £ 504.63, ¥ 64,374.59) +
s-specSR32H +
seriesE3-1500 +
smp max ways1 +
supported memory typeDDR3L-1600 +, LPDDR3-2133 + and DDR4-2400 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count8 +
turbo frequency (1 core)4,200 MHz (4.2 GHz, 4,200,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +