Difference between revisions of "renesas/r-car/h3 (sip)"

	Edit Values
	R-Car H3 (SiP)
	General Info
Designer	Renesas,; ARM Holdings
Manufacturer	TSMC
Model Number	H3 (SiP)
Part Number	R8J77950
Market	Embedded
Introduction	December 2, 2015 (announced); March, 2018 (launched)
	General Specs
Family	R-Car
Series	3rd Gen
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53, Cortex-A57, Cortex-R7
Core Name	Cortex-A53, Cortex-A57, Cortex-R7
Process	16 nm
Technology	CMOS
Die	111.36 mm²; 12.94 mm × 8.61 mm
Word Size	64 bit
Cores	9
Threads	9
	Multiprocessing
Max SMP	1-Way (Uniprocessor)
	Electrical
Vcore	0.8 V
VI/O	3.3 V
	Packaging
Package	FCBGA-1255 (BGA)
Dimension	42.5 mm x 42.5 mm
Pitch	0.80 mm
Ball Count	1255
Interconnect	BGA-1255

Latest revision as of 15:32, 13 December 2017

R-Car H3 is a 64-bit nona-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The H3 incorporates four Cortex-A57 cores, four Cortex-A53 cores, and a dual-core lock-step Cortex-R7 for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6650 GPU.

This model is an SiP variant of the H3 which include the DDR memory on-package.

Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.

Cache[edit]

Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache

[Edit/Modify Cache Info]

Cache Organization

Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.

L1$

640 KiB

655,360 B
0.625 MiB

L1I$	352 KiB 360,448 B 0.344 MiB	4x48+5x32 KiB
L1D$	288 KiB 294,912 B 0.281 MiB	9x32 KiB

L2$

2.5 MiB

2,560 KiB
2,621,440 B
0.00244 GiB

Memory controller[edit]

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR4-3200
Supports ECC	No
Controllers	1
Channels	4
Width	32 bit
Max Bandwidth	47.68 GiB/s 48,824.32 MiB/s 51.196 GB/s 51,196.01 MB/s 0.0466 TiB/s 0.0512 TB/s
Bandwidth	Single 11.92 GiB/s Double 23.84 GiB/s Quad 47.68 GiB/s

Expansions[edit]

PCI Express2.0 (1 lane) x 2 ch
USB 3.0 Host interface (DRD) × 1 ports (wPHY)
USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
SD Host interface × 4 ch (SDR104)
Multimedia card interface × 2 ch
Serial ATA interface × 1 ch
Media local bus (MLB) Interface × 1 ch (3 pin interface)
Controller Area Network (CAN-FD support) Interface × 2ch
Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
32bit timer x 26 ch
PWM timer × 7 ch
I2C bus interface × 7 ch
Serial communication interface (SCIF) × 11 ch
Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
Ethernet controller (IEEE802.3u, RMII, without PHY)
Digital radio interface (DRIF) × 4 ch

Graphics[edit]

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU	PowerVR GX6650
Designer	Imagination Technologies

Features[edit]

[Edit/Modify Supported Features]

Supported ARM Extensions & Processor Features

VFPv4	Vector Floating Point (VFP) v4 Extension
NEON	Advanced SIMD extension
TrustZone	TrustZone Security Extensions

Block Diagram[edit]

Die Shot[edit]

16 nm process, CMOS FinFET
12.94 mm × 8.61 mm
111.36 mm² die size

References[edit]

Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.

@@ Line 1: / Line 1: @@
 {{renesas title|R-Car H3 (SiP)}}
-{{mpu
+{{chip
 |name=R-Car H3 (SiP)
 |image=r-car h3 (sip).png
-|image size=125px
 |designer=Renesas
 |designer 2=ARM Holdings
@@ Line 24: / Line 23: @@
 |process=16 nm
 |technology=CMOS
+|die area=111.36 mm²
+|die length=12.94 mm
+|die width=8.61 mm
 |word size=64 bit
 |core count=9
@@ Line 32: / Line 34: @@
 |package module 1={{packages/renesas/fcbga-1255}}
 }}
-'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a single {{armh|Cortex-R7}} core for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
+'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a dual-core lock-step {{armh|Cortex-R7}} for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].
 This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package.
+Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.
 == Cache ==
@@ Line 106: / Line 110: @@
 |wmmx2=No
 }}
+== Block Diagram ==
+:: [[File:r-car h3 block.png|750px]]
+== Die Shot ==
+* [[16 nm process]], CMOS FinFET
+* 12.94 mm × 8.61 mm
+* 111.36 mm² die size
+:: [[File:r-car h3 die shot.png|650px]]
+== References ==
+* Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	R-Car H3 (SiP) - Renesas#package +
core count	9 +
core name	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage	0.8 V (8 dV, 80 cV, 800 mV) +
designer	Renesas + and ARM Holdings +
die area	111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) +
die length	12.94 mm (1.294 cm, 0.509 in, 12,940 µm) +
die width	8.61 mm (0.861 cm, 0.339 in, 8,610 µm) +
family	R-Car +
first announced	December 2, 2015 +
first launched	March 2018 +
full page name	renesas/r-car/h3 (sip) +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	PowerVR GX6650 +
integrated gpu designer	Imagination Technologies +
io voltage	3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	640 KiB (655,360 B, 0.625 MiB) +
l1d$ size	288 KiB (294,912 B, 0.281 MiB) +
l1i$ size	352 KiB (360,448 B, 0.344 MiB) +
l2$ size	2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) +
ldate	March 2018 +
main image	+
manufacturer	TSMC +
market segment	Embedded +
max cpu count	1 +
max memory bandwidth	47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
model number	H3 (SiP) +
name	R-Car H3 (SiP) +
package	FCBGA-1255 +
part number	R8J77950 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	3rd Gen +
smp max ways	1 +
supported memory type	LPDDR4-3200 +
technology	CMOS +
thread count	9 +
word size	64 bit (8 octets, 16 nibbles) +

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