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Difference between revisions of "loongson/godson 2/2g"
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{{loongson title|Godson-2G}} | {{loongson title|Godson-2G}} | ||
− | {{ | + | {{chip |
| name = Godson-2G | | name = Godson-2G | ||
| image = godson-2g.jpg | | image = godson-2g.jpg | ||
Line 9: | Line 9: | ||
| model number = 2G | | model number = 2G | ||
| part number = | | part number = | ||
− | | part number | + | | part number 2 = |
| market = Desktop | | market = Desktop | ||
| first announced = April, 2009 | | first announced = April, 2009 | ||
Line 23: | Line 23: | ||
| frequency 2 = | | frequency 2 = | ||
| frequency N = | | frequency N = | ||
− | | bus type = | + | | bus type = HyperTransport 1.0 |
− | | bus speed = | + | | bus speed = 400 MHz |
− | | bus rate = | + | | bus rate = |
− | | bus links = | + | | bus links = |
− | | clock multiplier = | + | | clock multiplier = 2.5 |
| isa family = MIPS | | isa family = MIPS | ||
Line 39: | Line 39: | ||
| core stepping = | | core stepping = | ||
| process = 65 nm | | process = 65 nm | ||
− | | transistors = | + | | transistors = 100,000,000 |
| technology = CMOS | | technology = CMOS | ||
| die area = 53.54 mm² | | die area = 53.54 mm² | ||
Line 50: | Line 50: | ||
| max memory = | | max memory = | ||
− | + | ||
− | | power = | + | | power = 3 W |
| v core = | | v core = | ||
| v core tolerance = <!-- OR ... --> | | v core tolerance = <!-- OR ... --> | ||
Line 79: | Line 79: | ||
| packaging = Yes | | packaging = Yes | ||
− | | package 0 = FCBGA- | + | | package 0 = FCBGA-741 |
| package 0 type = FCBGA | | package 0 type = FCBGA | ||
− | | package 0 pins = | + | | package 0 pins = 741 |
| package 0 pitch = | | package 0 pitch = | ||
− | | package 0 width = | + | | package 0 width = 31 mm |
− | | package 0 length = | + | | package 0 length = 31 mm |
| package 0 height = | | package 0 height = | ||
− | | socket 0 = BGA- | + | | socket 0 = BGA-741 |
| socket 0 type = BGA | | socket 0 type = BGA | ||
}} | }} | ||
− | '''Godson-2G''' is a {{arch|64}} [[MIPS]] performance processor developed by [[Institute of Computing Technology of the Chinese Academy of Sciences|ICT]] and later [[Loongson]] for desktop computers. Introduced in late-[[2010]], the Godson-2G operates at up to 1 GHz consuming up to | + | '''Godson-2G''' ('''龙芯2G''') is a {{arch|64}} [[MIPS]] performance processor developed by [[Institute of Computing Technology of the Chinese Academy of Sciences|ICT]] and later [[Loongson]] for desktop computers. Introduced in late-[[2010]], the Godson-2G operates at up to 1 GHz consuming up to 3 W. This chip was manufactured on [[STMicroelectronics]]' [[65 nm process]]. |
+ | |||
+ | This specific models incorporates a considerably larger [[2nd level cache]] compared to the rest of the {{\\\|Godson 2}} family along with an extended number of additional interfaces in a relatively large package. The Godson-2G integrates the majority of the [[southbridge]] on-die. | ||
+ | |||
+ | == Cache == | ||
+ | {{main|loongson/microarchitectures/GS464#Memory_Hierarchy|l1=GS464 § Cache}} | ||
+ | {{cache size | ||
+ | |l1 cache=128 KiB | ||
+ | |l1i cache=64 KiB | ||
+ | |l1i break=1x64 KiB | ||
+ | |l1i desc=4-way set associative | ||
+ | |l1d cache=64 KiB | ||
+ | |l1d break=1x64 KiB | ||
+ | |l1d desc=4-way set associative | ||
+ | |l1d policy= | ||
+ | |l2 cache=1 MiB | ||
+ | |l2 break=1x1 MiB | ||
+ | |l2 desc=4-way set associative | ||
+ | |l2 policy= | ||
+ | }} | ||
+ | |||
+ | == Memory controller == | ||
+ | {{memory controller | ||
+ | |type=DDR3-800 | ||
+ | |ecc=Yes | ||
+ | |max mem=4 GiB | ||
+ | |controllers=1 | ||
+ | |channels=1 | ||
+ | |max bandwidth=11.92 GiB/s | ||
+ | |bandwidth schan=11.92 GiB/s | ||
+ | }} | ||
+ | |||
+ | == Expansions == | ||
+ | This chip has integrated [[HyperTransport]] 1.0 operating at 400 MHz. | ||
+ | {{expansions | ||
+ | |pci width = 32 bit | ||
+ | |pci clock = 66 MHz | ||
+ | |pcix width = 32 bit | ||
+ | |pcix clock = 133 MHz | ||
+ | |lpc revision=1.1 | ||
+ | }} | ||
+ | |||
+ | == Die Shot == | ||
+ | * [[65 nm process]] | ||
+ | * 100,000,000 transistors | ||
+ | * 53.54 mm² die size | ||
+ | [[File:godson-2g die shot.png|700px]] | ||
== References == | == References == | ||
* Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231. | * Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231. | ||
+ | * Weiwu Hu, Yunji Chen. "GS464V: A High-Performance Low-Power XPU with 512-Bit Vector Extension". HotChips 22 (2010). | ||
+ | * Loongson Technology, "龙芯芯片产品技术白皮书" ("Godson chip product technology white paper") |
Latest revision as of 16:31, 13 December 2017
Edit Values | |
Godson-2G | |
![]() | |
Godson-2G chip | |
General Info | |
Designer | Loongson |
Manufacturer | STMicroelectronics |
Model Number | 2G |
Market | Desktop |
Introduction | April, 2009 (announced) November, 2010 (launched) |
General Specs | |
Family | Godson 2 |
Series | Godson 2 |
Frequency | 1,000 MHz |
Bus type | HyperTransport 1.0 |
Bus speed | 400 MHz |
Clock multiplier | 2.5 |
Microarchitecture | |
ISA | MIPS64 (MIPS) |
Microarchitecture | GS464 |
Core Name | GS464 |
Process | 65 nm |
Transistors | 100,000,000 |
Technology | CMOS |
Die | 53.54 mm² |
Word Size | 64 bit |
Cores | 1 |
Threads | 1 |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
Power dissipation | 3 W |
Godson-2G (龙芯2G) is a 64-bit MIPS performance processor developed by ICT and later Loongson for desktop computers. Introduced in late-2010, the Godson-2G operates at up to 1 GHz consuming up to 3 W. This chip was manufactured on STMicroelectronics' 65 nm process.
This specific models incorporates a considerably larger 2nd level cache compared to the rest of the Godson 2 family along with an extended number of additional interfaces in a relatively large package. The Godson-2G integrates the majority of the southbridge on-die.
Cache[edit]
- Main article: GS464 § Cache
![]() |
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
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Integrated Memory Controller
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Expansions[edit]
This chip has integrated HyperTransport 1.0 operating at 400 MHz.
Die Shot[edit]
- 65 nm process
- 100,000,000 transistors
- 53.54 mm² die size
References[edit]
- Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231.
- Weiwu Hu, Yunji Chen. "GS464V: A High-Performance Low-Power XPU with 512-Bit Vector Extension". HotChips 22 (2010).
- Loongson Technology, "龙芯芯片产品技术白皮书" ("Godson chip product technology white paper")
Facts about "Godson-2G - Loongson"
base frequency | 1,000 MHz (1 GHz, 1,000,000 kHz) + |
bus speed | 400 MHz (0.4 GHz, 400,000 kHz) + |
bus type | HyperTransport 1.0 + |
clock multiplier | 2.5 + |
core count | 1 + |
core name | GS464 + |
designer | Loongson + |
die area | 53.54 mm² (0.083 in², 0.535 cm², 53,540,000 µm²) + |
family | Godson 2 + |
first announced | April 2009 + |
first launched | November 2010 + |
full page name | loongson/godson 2/2g + |
has ecc memory support | true + |
instance of | microprocessor + |
isa | MIPS64 + |
isa family | MIPS + |
l1$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l1i$ description | 4-way set associative + |
l1i$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l2$ description | 4-way set associative + |
l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + |
ldate | November 2010 + |
main image | ![]() |
main image caption | Godson-2G chip + |
manufacturer | STMicroelectronics + |
market segment | Desktop + |
max cpu count | 1 + |
max memory bandwidth | 11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) + |
max memory channels | 1 + |
microarchitecture | GS464 + |
model number | 2G + |
name | Godson-2G + |
power dissipation | 3 W (3,000 mW, 0.00402 hp, 0.003 kW) + |
process | 65 nm (0.065 μm, 6.5e-5 mm) + |
series | Godson 2 + |
smp max ways | 1 + |
supported memory type | DDR3-800 + |
technology | CMOS + |
thread count | 1 + |
transistor count | 100,000,000 + |
word size | 64 bit (8 octets, 16 nibbles) + |