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Difference between revisions of "intel/core i3/i3-7167u"
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{{intel title|Core i3-7167U}}
 
{{intel title|Core i3-7167U}}
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{{mpu
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{{chip
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| name               = Core i3-7167U
+
|name=Core i3-7167U
−
| no image           = Yes
+
|no image=Yes
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| image              =
+
|designer=Intel
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| image size          =
+
|manufacturer=Intel
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| caption            =
+
|model number=i3-7167U
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| designer           = Intel
+
|s-spec=SR361
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| manufacturer       = Intel
+
|market=Mobile
−
| model number       = i3-7167U
+
|first announced=January 3, 2017
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| part number        =
+
|first launched=January 3, 2017
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| part number 1      =
+
|release price=$304.00
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| part number 2      =
+
|family=Core i3
−
| s-spec              =
+
|series=i3-7100
−
| s-spec 2            =  
+
|locked=Yes
−
| market             = Mobile
+
|frequency=2,800 MHz
−
| first announced     = January 3, 2017
+
|bus type=OPI
−
| first launched     = January 3, 2017
+
|bus rate=4 GT/s
−
| last order          =
+
|clock multiplier=28
−
| last shipment      =
+
|isa=x86-64
−
| release price       =  
+
|isa family=x86
−
 
+
|microarch=Kaby Lake
−
| family             = Core i3
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|platform=Kaby Lake
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| series             = i3-7100
+
|core name=Kaby Lake U
−
| locked             = Yes
+
|core family=6
−
| frequency           = 2,800 MHz
+
|core model=142
−
| bus type           = DMI 3.0
+
|core stepping=J1
−
| bus speed          =  
+
|process=14 nm
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| bus rate           = 8 GT/s
+
|technology=CMOS
−
| clock multiplier   = 28
+
|word size=64 bit
−
| cpuid              =
+
|core count=2
−
 
+
|thread count=4
−
| isa family          = x86
+
|max cpus=1
−
| isa                 = x86-64
+
|max memory=32 GiB
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| microarch           = Kaby Lake
+
|v core min=0.55 V
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| platform           = Kaby Lake
+
|v core max=1.52 V
−
| chipset            =
+
|tdp=28 W
−
| core name           = Kaby Lake U
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|ctdp down=23 W
−
| core family         = 6
+
|tjunc min=0 °C
−
| core model         = 142
+
|tjunc max=100 °C
−
| core stepping       =
+
|tstorage min=-25 °C
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| core stepping 2    =  
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|tstorage max=125 °C
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| process             = 14 nm
+
|package module 1={{packages/intel/fcbga-1356}}
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| transistors        =
 
−
| technology         = CMOS
 
−
| die area            =
 
−
| die width          =
 
−
| die length          =
 
−
| word size           = 64 bit
 
−
| core count         = 2
 
−
| thread count       = 4
 
−
| max cpus           = 1
 
−
| max memory         = 32 GiB
 
−
 
 
−
| electrical          = Yes
 
−
| v core min         = 0.55 V
 
−
| v core max         = 1.52 V
 
−
| sdp                =
 
−
| tdp                 = 28 W
 
−
| tdp typical        =
 
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| ctdp down           = 23 W
 
−
| ctdp down frequency =
 
−
| tjunc min           = 0 °C
 
−
| tjunc max           = 100 °C
 
−
| tcase min          =
 
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| tcase max          =
 
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| tstorage min       = -25 °C
 
−
| tstorage max       = 125 °C
 
−
| tambient min        =
 
−
| tambient max        =
 
−
 
 
−
| packaging          = Yes
 
−
| package           = FCBGA-1356
 
−
| package type      = FCBGA
 
−
| package pitch      = 0.65 mm
 
−
| package size      = 42 mm x 24 mm
 
−
| socket            = BGA-1356
 
−
| socket type        = BGA
 
 
}}
 
}}
 
'''Core i3-7167U''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's {{intel|Iris Plus Graphics 650}} [[IGP]] operating at 300 MHz with burst frequency of 1 GHz. This GPU also includes 64 MiB of [[eDRAM|embedded DRAM]].
 
'''Core i3-7167U''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's {{intel|Iris Plus Graphics 650}} [[IGP]] operating at 300 MHz with burst frequency of 1 GHz. This GPU also includes 64 MiB of [[eDRAM|embedded DRAM]].
  
−
This specific model has a configurable TDP-down of 23 W.
+
This model has a configurable TDP-down of 23 W.
−
 
 
 
== Cache ==
 
== Cache ==
 
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
 
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
Line 89: Line 53:
 
|l1i break=2x32 KiB
 
|l1i break=2x32 KiB
 
|l1i desc=8-way set associative
 
|l1i desc=8-way set associative
−
|l1i policy=write-back
 
 
|l1d cache=64 KiB
 
|l1d cache=64 KiB
 
|l1d break=2x32 KiB
 
|l1d break=2x32 KiB
Line 155: Line 118:
 
| hdmi ver          = 1.4a
 
| hdmi ver          = 1.4a
 
| dp ver            = 1.2
 
| dp ver            = 1.2
−
| edp ver            = 1.3
+
| edp ver            = 1.4
 
| max res hdmi      = 4096x2304
 
| max res hdmi      = 4096x2304
 
| max res hdmi freq  = 30 Hz
 
| max res hdmi freq  = 30 Hz
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| intel clear video hd = Yes
 
| intel clear video hd = Yes
 
}}
 
}}
 +
{{kaby lake hardware accelerated video table|col=1}}
  
 
== Features ==
 
== Features ==
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|x8664=Yes
 
|x8664=Yes
 
|nx=Yes
 
|nx=Yes
−
|3dnow=No
 
−
|e3dnow=No
 
 
|mmx=Yes
 
|mmx=Yes
 
|emmx=Yes
 
|emmx=Yes
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|avx=Yes
 
|avx=Yes
 
|avx2=Yes
 
|avx2=Yes
−
|avx512=No
+
 
 
|abm=Yes
 
|abm=Yes
 
|tbm=No
 
|tbm=No
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|eist=Yes
 
|eist=Yes
 
|sst=Yes
 
|sst=Yes
−
|flex=No
+
|flex=Yes
 
|fastmem=No
 
|fastmem=No
 
|isrt=Yes
 
|isrt=Yes
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|securekey=Yes
 
|securekey=Yes
 
|osguard=Yes
 
|osguard=Yes
 +
|3dnow=No
 +
|e3dnow=No
 
|smartmp=No
 
|smartmp=No
 
|powernow=No
 
|powernow=No
 +
|amdvi=No
 
|amdv=No
 
|amdv=No
 
|rvi=No
 
|rvi=No
 +
|smt=No
 +
|sensemi=No
 +
|xfr=No
 
}}
 
}}

Latest revision as of 15:18, 13 December 2017

Edit Values
Core i3-7167U
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-7167U
S-SpecSR361
MarketMobile
IntroductionJanuary 3, 2017 (announced)
January 3, 2017 (launched)
Release Price$304.00
ShopAmazon
General Specs
FamilyCore i3
Seriesi3-7100
LockedYes
Frequency2,800 MHz
Bus typeOPI
Bus rate4 GT/s
Clock multiplier28
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
Core NameKaby Lake U
Core Family6
Core Model142
Core SteppingJ1
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max Memory32 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP28 W
cTDP down23 W
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1356 (BGA)
Dimension42 mm x 24 mm x 1.3 mm
Pitch0.65 mm
Ball Count1356
Ball CompSAC405
InterconnectBGA-1356

Core i3-7167U is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14 nm+ process. This processor, which has a base frequency of 2.8 GHz with a TDP of 28 Watts, supports up to 32 GiB of dual-channel DDR4-2133. The i3-7167U incorporates Intel's Iris Plus Graphics 650 IGP operating at 300 MHz with burst frequency of 1 GHz. This GPU also includes 64 MiB of embedded DRAM.

This model has a configurable TDP-down of 23 W.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB16-way set associativewrite-back
L4$64 MiB
65,536 KiB
67,108,864 B
0.0625 GiB
     

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR3-1866, DDR3L-1600, DDR4-2133
Supports ECCNo
Max Mem64 GiB
Controllers1
Channels2
Max Bandwidth31.79 GiB/s
32,552.96 MiB/s
34.134 GB/s
34,134.253 MB/s
0.031 TiB/s
0.0341 TB/s
Bandwidth
Single 15.89 GiB/s
Double 31.79 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes12
Configs1x4, 2x2, 1x2+2x1, 4x1


Graphics[edit]

The Iris Plus Graphics 650 includes 64 MiB of L4 eDRAM cache in addition to everything else.

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUIris Plus Graphics 650
DesignerIntelDevice ID0x5927
Execution Units48Max Displays3
Max Memory32 GiB
32,768 MiB
33,554,432 KiB
34,359,738,368 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency1,000 MHz
1 GHz
1,000,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @30 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
SBASmall Business Advantage
MWTMy WiFi Technology
IPTIdentity Protection Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_i3/i3-7167u&oldid=70563"
Facts about "Core i3-7167U - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-7167U - Intel#package + and Core i3-7167U - Intel#io +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier28 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake U +
core steppingJ1 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x5927 +
familyCore i3 +
first announcedJanuary 3, 2017 +
first launchedJanuary 3, 2017 +
full page nameintel/core i3/i3-7167u +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, Small Business Advantage +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel small business advantage supporttrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuIris Plus Graphics 650 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units48 +
integrated gpu max frequency1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description16-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
l4$ size64 MiB (65,536 KiB, 67,108,864 B, 0.0625 GiB) +
ldateJanuary 3, 2017 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels2 +
max pcie lanes12 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-7167U +
nameCore i3-7167U +
packageFCBGA-1356 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 304.00 (€ 273.60, £ 246.24, ¥ 31,412.32) +
s-specSR361 +
seriesi3-7100 +
smp max ways1 +
supported memory typeLPDDR3-1866 +, DDR3L-1600 + and DDR4-2133 +
tdp28 W (28,000 mW, 0.0375 hp, 0.028 kW) +
tdp down23 W (23,000 mW, 0.0308 hp, 0.023 kW) +
technologyCMOS +
thread count4 +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +