Semiconductor & Computer Engineering
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Difference between revisions of "land-side capacitor"
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{{title|Land-Side Capacitor (LSC)}} | {{title|Land-Side Capacitor (LSC)}} | ||
| − | A '''land-side capacitor''' ('''LSC''') refers to a [[capacitor]] that is attached to the [[integrated circuit]] [[substrate]] on the [[land]] side under the die shadow. | + | A '''land-side capacitor''' ('''LSC''') refers to a [[capacitor]] that is attached to the [[integrated circuit]] [[substrate]] on the [[land]] side under the die shadow. LSCs are typically [[bypass capacitors]] that sit as close as practically possible to the die in order to increase their effectiveness. Those capacitors are used to reduce [[noise]] and [[impedance]] and to maintain a constant voltage under various operating frequencies. |
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| + | LSCs [[form factor]] are often dictated by things such as the substrate size and the collapsed height of the [[solder ball]]. | ||
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| + | == See also == | ||
| + | * [[die-side capacitor]] | ||
Latest revision as of 16:11, 28 August 2017
A land-side capacitor (LSC) refers to a capacitor that is attached to the integrated circuit substrate on the land side under the die shadow. LSCs are typically bypass capacitors that sit as close as practically possible to the die in order to increase their effectiveness. Those capacitors are used to reduce noise and impedance and to maintain a constant voltage under various operating frequencies.
LSCs form factor are often dictated by things such as the substrate size and the collapsed height of the solder ball.