From WikiChip
Difference between revisions of "2017"
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* July 11: Intel introduces {{intel|Skylake SP|l=core}} along with the {{intel|Ultra Path Interconnect}} (UPI) with supersedes {{intel|QPI}} | * July 11: Intel introduces {{intel|Skylake SP|l=core}} along with the {{intel|Ultra Path Interconnect}} (UPI) with supersedes {{intel|QPI}} | ||
* July 17: [[IBM]] introduces the {{ibm|z14}} microprocessor | * July 17: [[IBM]] introduces the {{ibm|z14}} microprocessor | ||
− | * August 21: Intel | + | * August 10: AMD introduces {{amd|Threadripper}}, a family of enthusiasts-class [[x86]] microprocessors |
+ | * August 21: Intel introduces {{intel|Kaby Lake R|Kaby Lake Refresh|l=core}}, doubling the core count of many mainstream mobile processors. | ||
== Microprocessors released in 2017 == | == Microprocessors released in 2017 == |
Revision as of 07:25, 21 August 2017
In 2017:
- January 3: Intel introduces their mainstream processors based on Kaby Lake, including i3, i5, and i7 models.
- January 4-8: CES 2017
- January 4: NXP launched the i.MX 8M family of processors capable of full 4K UltraHD for Audio, Voice and Video Interactions
- February 2: Amkor Technology acquires NANIUM for undisclosed sum.
- February 5-9: IEEE international Solid-State Circuits Conference (ISSCC) 2017
- February 8: Intel announced a $7B investment in Fab 42 which will be used to manufacture chips on a 7 nm process
- February 22: AMD announces the Ryzen 7 processor family for high-end performance x86 based on Zen
- February 28: Xiaomi launches the Surge family of in-house developed ARM processors
- March 2: AMD launches the Ryzen 7 family
- March 1-3: GDC 2017 Expro
- March 13: Intel acquires Mobileye for $15.3 billion.
- March 13: TSMC Technology Symposium
- March 28: Intel Technology and Manufacturing Day
- March 28: Intel introduces their 10 nm process featuring the highest density transistor at the time
- March 28: Intel announces a new 22 nm process "22FFL" for IOT and Mobile
- April 4: Fujitsu introduces the SPARC64 XII and announces commitment to future SPARC development
- April 6: Beijing Shanhai Capital completed the acquisition of Analogix Semiconductor for $500M
- April 19-21: COOLChips XX
- May 4: Intel introduces the Xeon Bronze Xeon Silver, Xeon Gold, Xeon Platinum server families
- May 15-18: Advanced Semiconductor Manufacturing Conference (ASMC) 2017
- May 16: AMD introduces the EPYC server family
- May 29: ARM introduces the Cortex-A55 and Cortex-A75 cores, first ARMv8.2 implementations
- May 30-3: Computex Taipei 2017
- June 5-9: VLSI Symposium
- June 6: IBM announces a breakthrough in the mass manufacturing of GAA FET-based 5 nm process
- June 20: SPEC released the SPEC CPU2017 benchmark suite.
- August 22-26: Gamescom 2017
- July 11: Intel introduces Skylake SP along with the Ultra Path Interconnect (UPI) with supersedes QPI
- July 17: IBM introduces the z14 microprocessor
- August 10: AMD introduces Threadripper, a family of enthusiasts-class x86 microprocessors
- August 21: Intel introduces Kaby Lake Refresh, doubling the core count of many mainstream mobile processors.
Microprocessors released in 2017
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