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|designer=DEC
 
|designer=DEC
 
|manufacturer=DEC
 
|manufacturer=DEC
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|manufacturer 2=Intel
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|manufacturer 3=Samsung
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|introduction=February, 1998
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|process=0.35 µm
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|cores=1
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|type=Superscalar
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|oooe=Yes
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|speculative=Yes
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|renaming=Yes
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|stages=6
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|decode=4-way
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|isa=Alpha
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|l1i=64 KiB
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|l1i per=core
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|l1i desc=2-way set associative
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|l1d=64 KiB
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|l1d per=core
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|l1d desc=2-way set associative
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|predecessor=Alpha 21164
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|predecessor link=dec/microarchitectures/alpha_21164
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|successor=Alpha 21364
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|successor link=compaq/microarchitectures/alpha_21364
 
}}
 
}}
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'''Alpha 21264''' was an [[Alpha]] microarchitecture designed by [[DEC]] and introduced in 1998 by [[Compaq]] as a successor to the {{\\|Alpha 21164}} architecture.
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== History ==
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{{empty section}}
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== Process Technology ==
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{{see also|0.35 µm process}}
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Alpha 21264 was manufactured on a [[0.35 µm process]] at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers. The chip allowed for a supply voltage of up to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V.
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== Architecture ==
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{{empty section}}
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* Integrated PLL (designed by [[Swiss Center for Electronics and Microtechnology|CSEM]])
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== Die ==
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* 15,200,000 transistors
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** 9,200,000 cache
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** 6,000,000 logic
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* [[0.35 µm]] 4 metal layers
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* 16.7 mm x 18.8 mm
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* 313.96 mm² die size
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* PGA-587 package
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** 389 signal pins
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: [[File:alpha 21264 die shot.png|650px]]
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: [[File:alpha 21264 die shot (annotated).png|650px]]
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== All Alpha 21264 chips ==
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{{empty section}}
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== References ==
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* Dobberpuhl, Daniel W. "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]." Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on. IEEE, 1997.

Latest revision as of 05:59, 13 June 2017

Edit Values
Alpha 21264 µarch
General Info
Arch TypeCPU
DesignerDEC
ManufacturerDEC, Intel, Samsung
IntroductionFebruary, 1998
Process0.35 µm
Core Configs1
Pipeline
TypeSuperscalar
OoOEYes
SpeculativeYes
Reg RenamingYes
Stages6
Decode4-way
Instructions
ISAAlpha
Cache
L1I Cache64 KiB/core
2-way set associative
L1D Cache64 KiB/core
2-way set associative
Succession

Alpha 21264 was an Alpha microarchitecture designed by DEC and introduced in 1998 by Compaq as a successor to the Alpha 21164 architecture.

History[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

Process Technology[edit]

See also: 0.35 µm process

Alpha 21264 was manufactured on a 0.35 µm process at DEC's own Hudson foundry. The process had a 0.35 µm drawn gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers. The chip allowed for a supply voltage of up to 2 V in order to limit the chips to a power limit of 72 W, although it was actually designed to reliably operate at up to 2.5 V.

Architecture[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.
  • Integrated PLL (designed by CSEM)

Die[edit]

  • 15,200,000 transistors
    • 9,200,000 cache
    • 6,000,000 logic
  • 0.35 µm 4 metal layers
  • 16.7 mm x 18.8 mm
  • 313.96 mm² die size
  • PGA-587 package
    • 389 signal pins


alpha 21264 die shot.png


alpha 21264 die shot (annotated).png

All Alpha 21264 chips[edit]

New text document.svg This section is empty; you can help add the missing info by editing this page.

References[edit]

  • Dobberpuhl, Daniel W. "Circuits and technology for Digital's StrongARM and ALPHA microprocessors [CMOS technology]." Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on. IEEE, 1997.
Retrieved from "https://en.wikichip.org/w/index.php?title=dec/microarchitectures/alpha_21264&oldid=44606"
Facts about "Alpha 21264 - Microarchitectures - DEC"
RDF feed
codenameAlpha 21264 +
core count1 +
designerDEC +
first launchedFebruary 1998 +
full page namedec/microarchitectures/alpha 21264 +
instance ofmicroarchitecture +
instruction set architectureAlpha +
manufacturerDEC +, Intel + and Samsung +
microarchitecture typeCPU +
nameAlpha 21264 +
pipeline stages6 +
process350 nm (0.35 μm, 3.5e-4 mm) +