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Difference between revisions of "loongson/godson 2/2g"
< loongson‎ | godson 2

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| core stepping      =  
 
| core stepping      =  
 
| process            = 65 nm
 
| process            = 65 nm
| transistors        =  
+
| transistors        = 100,000,000
 
| technology          = CMOS
 
| technology          = CMOS
 
| die area            = 53.54 mm²
 
| die area            = 53.54 mm²
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}}
 
}}
 
'''Godson-2G''' is a {{arch|64}} [[MIPS]] performance processor developed by [[Institute of Computing Technology of the Chinese Academy of Sciences|ICT]] and later [[Loongson]] for desktop computers. Introduced in late-[[2010]], the Godson-2G operates at up to 1 GHz consuming up to 4 W. This chip was manufactured on [[STMicroelectronics]]' [[65 nm process]].
 
'''Godson-2G''' is a {{arch|64}} [[MIPS]] performance processor developed by [[Institute of Computing Technology of the Chinese Academy of Sciences|ICT]] and later [[Loongson]] for desktop computers. Introduced in late-[[2010]], the Godson-2G operates at up to 1 GHz consuming up to 4 W. This chip was manufactured on [[STMicroelectronics]]' [[65 nm process]].
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== Die Shot ==
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* [[65 nm process]]
 +
* 100,000,000 transistors
 +
* 53.54 mm² die size
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[[File:godson-2g die shot.png|700px]]
  
 
== References ==
 
== References ==
 
* Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231.
 
* Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231.

Revision as of 17:52, 18 March 2017

Template:mpu Godson-2G is a 64-bit MIPS performance processor developed by ICT and later Loongson for desktop computers. Introduced in late-2010, the Godson-2G operates at up to 1 GHz consuming up to 4 W. This chip was manufactured on STMicroelectronics' 65 nm process.

Die Shot

godson-2g die shot.png

References

  • Zhao, Ji-Ye, et al. "Physical Design Methodology for Godson-2G Microprocessor." Journal of Computer Science and Technology 25.2 (2010): 225-231.