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Difference between revisions of "mediatek/helio/mt6799"
< mediatek‎ | helio

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{{mediatek title|Helio X30}}
 
{{mediatek title|Helio X30}}
 
{{mpu
 
{{mpu
−
| future              = Yes
 
 
| name                = MediaTek Helio X30
 
| name                = MediaTek Helio X30
 
| no image            = yes
 
| no image            = yes
Line 16: Line 15:
 
| market 2            = Embedded
 
| market 2            = Embedded
 
| first announced    = September 26, 2016
 
| first announced    = September 26, 2016
−
| first launched      = 2017
+
| first launched      = February 27, 2017
 
| last order          =  
 
| last order          =  
 
| last shipment      =  
 
| last shipment      =  
Line 24: Line 23:
 
| series              = Helio X
 
| series              = Helio X
 
| locked              =  
 
| locked              =  
−
| frequency          = 2,800 MHz
+
| frequency          = 2,500 MHz
 
| frequency 2        = 2,200 MHz
 
| frequency 2        = 2,200 MHz
−
| frequency 3        = 2,000 MHz
+
| frequency 3        = 1,900 MHz
 
| bus type            = AMBA 4 AXI
 
| bus type            = AMBA 4 AXI
 
| bus speed          =  
 
| bus speed          =  
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| microarch          = Cortex-A53
 
| microarch          = Cortex-A53
 
| microarch 2        = Cortex-A73
 
| microarch 2        = Cortex-A73
 +
| microarch 3        = Cortex-A35
 
| platform            =  
 
| platform            =  
 
| chipset            =  
 
| chipset            =  
−
| core name          = Cortex-A53
+
| core name          = Cortex-A35
−
| core name 2         = Cortex-A73
+
| core name 2        = Cortex-A53
 +
| core name 3         = Cortex-A73
 
| core family        =  
 
| core family        =  
 
| core model          =  
 
| core model          =  
Line 90: Line 91:
 
| package 0 height    =  
 
| package 0 height    =  
 
}}
 
}}
−
'''Helio X30''' is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and set to be launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 2 GHz, 2.2 GHz, and 2.8 GHz) and supports dual-channel LPDDR3-1866. This SoC also incorporates a {{imgtec|PowerVR GT7400}} [[IGP]] operating at 870 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
+
'''Helio X30''' is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports dual-channel LPDDR4-1866. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
  
−
 
−
{{unknown features}}
 
 
== Architecture ==
 
== Architecture ==
 
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
 
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
  
−
* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.8 GHz
+
* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.5 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
−
* Power Efficiency - 4x {{armh|Cortex-A53|l=arch}} @ 2 GHz
+
* Power Efficiency - 4x {{armh|Cortex-A35|l=arch}} @ 1. GHz
  
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
Line 109: Line 108:
 
== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
−
|type=LPDDR3-1866
+
|type=LPDDR4-1866
 
|ecc=No
 
|ecc=No
 
|max mem=8 GiB
 
|max mem=8 GiB
Line 136: Line 135:
 
| max displays        =  
 
| max displays        =  
 
| max memory          =  
 
| max memory          =  
−
| frequency          = 870 MHz
+
| frequency          = 800 MHz
  
 
| output dsi          = Yes
 
| output dsi          = Yes
  
−
| max res dsi        = 2560x1600
+
| max res dsi        = 3840x2160
  
 
| direct3d ver        = 11.2
 
| direct3d ver        = 11.2

Revision as of 23:24, 27 February 2017

Template:mpu Helio X30 is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports dual-channel LPDDR4-1866. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.

Architecture

The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4-1866
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels2
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 13.9 GiB/s
Double 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART
GP I/OYes


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GT7400 Plus
DesignerImagination Technologies
Frequency800 MHz
0.8 GHz
800,000 KHz
OutputDSI
Max Resolution
DSI3840x2160
Standards
Direct3D11.2
OpenGL3.3
OpenCL2.0
OpenGL ES3.2
Vulkan1.0

Wireless

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat10

Image

  • Integrated image signal processor supports 28 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices

This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6799&oldid=39155"
Facts about "Helio X30 (MT6799) - MediaTek"
RDF feed
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
integrated gpuPowerVR GT7400 Plus +
integrated gpu base frequency800 MHz (0.8 GHz, 800,000 KHz) +
integrated gpu designerImagination Technologies +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels2 +
supported memory typeLPDDR4-1866 +
user equipment category10 +