Semiconductor & Computer Engineering
From WikiChip
Difference between revisions of "2004"
| Line 3: | Line 3: | ||
* May 7: [[Intel]] acknowledges they've reached a "thermal wall" on their microprocessors; new emphasis on multi-core. | * May 7: [[Intel]] acknowledges they've reached a "thermal wall" on their microprocessors; new emphasis on multi-core. | ||
* May 7: Intel cancels {{intel|Tejas}} and {{intel|Jayhawk}}. | * May 7: Intel cancels {{intel|Tejas}} and {{intel|Jayhawk}}. | ||
| − | + | * May 24: AMD announces the {{amd|Geode NX}} family of performance embedded processors based on the {{amd|Thoroughbred|l=core}} core | |
* July 15: [[Embedded C]] first technical report ([[ISO/IEC TR 18037:2004]]) is published. | * July 15: [[Embedded C]] first technical report ([[ISO/IEC TR 18037:2004]]) is published. | ||
* July 28: AMD introduces the {{amd|Sempron}} family. | * July 28: AMD introduces the {{amd|Sempron}} family. | ||
Revision as of 00:02, 10 November 2016
In 2004:
- May 7: Intel acknowledges they've reached a "thermal wall" on their microprocessors; new emphasis on multi-core.
- May 7: Intel cancels Tejas and Jayhawk.
- May 24: AMD announces the Geode NX family of performance embedded processors based on the Thoroughbred core
- July 15: Embedded C first technical report (ISO/IEC TR 18037:2004) is published.
- July 28: AMD introduces the Sempron family.