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Difference between revisions of "amd/k6/amd-k6/300bdz"
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{{amd title|AMD-K6/300BDZ}}
 
{{amd title|AMD-K6/300BDZ}}
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{{mpu
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{{chip
 
| name                = AMD-K6/300BDZ
 
| name                = AMD-K6/300BDZ
 
| no image            = Yes
 
| no image            = Yes
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| tstorage max        = 150 °C
 
| tstorage max        = 150 °C
  
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| packaging          = Yes
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| package name 1      = amd,cbga-360
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| package 0          = CPGA-321
 
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| package 0 type      = CPGA
 
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| package 0 pins      = 321
 
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| package 0 pitch    = 1.27 mm
 
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| package 0 width    = 49.53 mm
 
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| package 0 length    = 49.53 mm
 
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| package 0 height    = 3.27 mm
 
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| socket 0            = Socket 7
 
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| socket 0 type      =
 
 
}}
 
}}
 
'''AMD-K6/300BDZ''' was a {{arch|32}} [[x86]] mobile microprocessor designed by [[AMD]] and introduced in early [[1998]]. This chip, which was based on AMD's new {{amd|microarchitectures/k6|K6 microarchitecture}}, operated at 300 MHz and dissipated a maximum of 11 W.
 
'''AMD-K6/300BDZ''' was a {{arch|32}} [[x86]] mobile microprocessor designed by [[AMD]] and introduced in early [[1998]]. This chip, which was based on AMD's new {{amd|microarchitectures/k6|K6 microarchitecture}}, operated at 300 MHz and dissipated a maximum of 11 W.
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== Features ==
 
== Features ==
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{{mpu features
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{{x86 features
 
| mmx = true
 
| mmx = true
 
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Latest revision as of 12:34, 18 March 2023

Edit Values
AMD-K6/300BDZ
General Info
DesignerAMD
ManufacturerAMD
Model NumberAMD-K6/300BDZ
Part NumberAMD-K6/300BDZ
MarketMobile
IntroductionJanuary, 1998 (announced)
March 5, 1998 (launched)
ShopAmazon
General Specs
FamilyK6
SeriesMobile K6
LockedNo
Frequency299.99 MHz
Bus typeFSB
Bus speed66.66 MHz
Bus rate66.66 MT/s
Clock multiplier4.5
CPUID570
Microarchitecture
MicroarchitectureK6
Core NameLittle Foot
Core Family5
Core Model7
Process250 nm
Transistors8,800,000
TechnologyCMOS
Die68 mm²
Word Size32 bit
Cores1
Threads1
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Power dissipation11 W
Vcore2.1 V ± 5%
VI/O3.3 V ± 5%
Tcase0 °C – 85 °C
Tstorage-65 °C – 150 °C
Packaging
PackageCBGA-360
Package TypeCeramic Ball Grid Array
Dimension25 mm × 25 mm
Pitch1.27 mm
Contacts360

AMD-K6/300BDZ was a 32-bit x86 mobile microprocessor designed by AMD and introduced in early 1998. This chip, which was based on AMD's new K6 microarchitecture, operated at 300 MHz and dissipated a maximum of 11 W.

Cache[edit]

Main article: K6 § Cache

L2$ can be 256 KiB to 1 MiB, depending on manufacturer and motherboard model. L2$ is off-chip.

Cache Info [Edit Values]
L1I$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative
L1D$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative

Graphics[edit]

This SoC has no integrated graphics processing unit.

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
  • Auto-power down state
  • Stop clock state

Documents[edit]

DataSheet[edit]

Retrieved from "https://en.wikichip.org/w/index.php?title=amd/k6/amd-k6/300bdz&oldid=101342"
Facts about "AMD-K6/300BDZ - AMD"
RDF feed
base frequency299.99 MHz (0.3 GHz, 299,990 kHz) +
bus rate66.66 MT/s (0.0667 GT/s, 66,660 kT/s) +
bus speed66.66 MHz (0.0667 GHz, 66,660 kHz) +
bus typeFSB +
clock multiplier4.5 +
core count1 +
core family5 +
core model7 +
core nameLittle Foot +
core voltage2.1 V (21 dV, 210 cV, 2,100 mV) +
core voltage tolerance5% +
cpuid570 +
designerAMD +
die area68 mm² (0.105 in², 0.68 cm², 68,000,000 µm²) +
familyK6 +
first announcedJanuary 1998 +
first launchedMarch 5, 1998 +
full page nameamd/k6/amd-k6/300bdz +
has locked clock multiplierfalse +
instance ofmicroprocessor +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
io voltage tolerance5% +
l1d$ description2-way set associative +
l1d$ size32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description2-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
ldateMarch 5, 1998 +
manufacturerAMD +
market segmentMobile +
max case temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitectureK6 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature208.15 K (-65 °C, -85 °F, 374.67 °R) +
model numberAMD-K6/300BDZ +
nameAMD-K6/300BDZ +
packageCBGA-360 +
part numberAMD-K6/300BDZ +
power dissipation11 W (11,000 mW, 0.0148 hp, 0.011 kW) +
process250 nm (0.25 μm, 2.5e-4 mm) +
seriesMobile K6 +
smp max ways1 +
technologyCMOS +
thread count1 +
transistor count8,800,000 +
word size32 bit (4 octets, 8 nibbles) +