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walton
 
{{expand list}}
 
{{expand list}}

Latest revision as of 23:19, 13 March 2023

Edit Values
Helio A22
helio a22.png
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio A22
Part NumberMT6762M
MarketMobile, Embedded
IntroductionJuly 17, 2018 (announced)
July 17, 2018 (launched)
General Specs
FamilyHelio
SeriesHelio A
Frequency2,000 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53
Core NameCortex-A53
Process12 nm
TechnologyCMOS
Word Size64 bit
Cores4
Threads4
Max Memory6 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio A22 (MT6762M) is a 64-bit quad-core ARM LTE system on a chip designed by MediaTek and launched in mid-2018. Manufactured on TSMC's 12 nm process, this SoC integrates four Cortex-A53 cores operating at up to GHz and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a PowerVR GE8320 IGP. The chip has a modem supporting LTE cat 7 download and cat 13 upload.

Memory controller[edit]

The maximum memory is 4 GiB if LPDDR3 (1x32-bit) is used and 6 GiB if LPDDR4X (2x16-bit) is used.

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3200
Supports ECCNo
Max Mem6 GiB
Controllers1
Channels2
Width16 bit
Max Bandwidth13.9 GiB/s
14,233.6 MiB/s
14.925 GB/s
14,925.011 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.9 GiB/s

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GE8320
DesignerImagination Technologies
OutputDSI
Max Resolution
DSI1600x720
Standards
Direct3D9.3
OpenGL3.0
OpenCL1.2
OpenGL ES3.0
Vulkan1.0
  • Encoding
    • H.264 (1080P @ 30 fps)
  • Decoding
    • H.264, H.265 / HEVC
      • 1080P @ 30 fps

ISP[edit]

  • 21MP, 13+8MP
    • 21MP@30fps; 13MP+8MP@30fps

Connectivity[edit]

  • WiFi
    • Integrated 802.11a/b/g/n/ac
  • Bluetooth 5.0
  • RF Front End
  • LTE Modem
    • Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE, HSPA+
    • Downlink
      • Cat-7, 300 Mbps
    • Uplink
      • Cat-13, 150 Mbps

Location[edit]

  • GPS
    • Beidou, Galileo, Glonass

Utilizing devices[edit]

  • Nokia 2.3
  • Nokia 2.2
  • Elephone A6 Mini
  • Huawei Y5 2019
  • Infinix hot 8
  • Leagoo M13
  • Ouktel C15 Pro
  • Vivo Y85
  • Xiaomi Redmi 6A
  • Tecno Spark Go
  • Teracube 2e
  • Umdigi A3X
  • Nokia 2 V Tella
  • Xiaomi Redmi A1
  • Xiaomi Redmi A1 Plus

walton This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6762m&oldid=101198"
Facts about "Helio A22 (MT6762M) - MediaTek"
RDF feed
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) +
core count4 +
core nameCortex-A53 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJuly 17, 2018 +
first launchedJuly 17, 2018 +
full page namemediatek/helio/mt6762m +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuPowerVR GE8320 +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateJuly 17, 2018 +
main imageFile:helio a22.png +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) +
max memory bandwidth13.9 GiB/s (14,233.6 MiB/s, 14.925 GB/s, 14,925.011 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 +
model numberHelio A22 +
nameHelio A22 +
part numberMT6762M +
process12 nm (0.012 μm, 1.2e-5 mm) +
seriesHelio A +
smp max ways1 +
supported memory typeLPDDR4X-3200 +
technologyCMOS +
thread count4 +
used byNokia 2.3 +, Nokia 2.2 +, Elephone A6 Mini +, Huawei Y5 2019 +, Infinix hot 8 +, Leagoo M13 +, Ouktel C15 Pro +, Vivo Y85 +, Xiaomi Redmi 6A +, Tecno Spark Go +, Teracube 2e +, Umdigi A3X +, Nokia 2 V Tella +, Xiaomi Redmi A1 + and Xiaomi Redmi A1 Plus +
word size64 bit (8 octets, 16 nibbles) +