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'''POWER9 02CY415''' is a [[20-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY415 has a base frequency of 2.40 GHz with a bost frequency of 3.80 GHz and a TDP of 160 W. | '''POWER9 02CY415''' is a [[20-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY415 has a base frequency of 2.40 GHz with a bost frequency of 3.80 GHz and a TDP of 160 W. | ||
+ | |||
+ | == Cache == | ||
+ | {{main|ibm/microarchitectures/power9#Memory_Hierarchy|l1=POWER9 § Cache}} | ||
+ | {{cache size | ||
+ | |l1 cache=1.25 MiB | ||
+ | |l1i cache=640 KiB | ||
+ | |l1i break=20x32 KiB | ||
+ | |l1i desc=8-way set associative | ||
+ | |l1d cache=640 KiB | ||
+ | |l1d break=20x32 KiB | ||
+ | |l1d desc=8-way set associative | ||
+ | |l2 cache=5 MiB | ||
+ | |l2 break=10x512 KiB | ||
+ | |l2 desc=8-way set associative | ||
+ | |l3 cache=100 MiB | ||
+ | |l3 break=10x10 MiB | ||
+ | |l3 desc=20-way set associative | ||
+ | }} | ||
+ | |||
+ | == Memory controller == | ||
+ | {{memory controller | ||
+ | |type=DDR4-2666 | ||
+ | |ecc=No | ||
+ | |max mem=2 TiB | ||
+ | |controllers=2 | ||
+ | |channels=8 | ||
+ | |max bandwidth=158.95 GiB/s | ||
+ | |bandwidth schan=19.87 GiB/s | ||
+ | |bandwidth dchan=39.74 GiB/s | ||
+ | |bandwidth qchan=79.47 GiB/s | ||
+ | |bandwidth ochan=158.95 GiB/s | ||
+ | }} | ||
+ | |||
+ | {{ibm power9 sforza memory configs}} | ||
+ | |||
+ | == Expansions == | ||
+ | {{expansions main | ||
+ | | | ||
+ | {{expansions entry | ||
+ | |type=PCIe | ||
+ | |pcie revision=4.0 | ||
+ | |pcie lanes=48 | ||
+ | |pcie config=x16 | ||
+ | |pcie config 2=x8 | ||
+ | |pcie config 3=x4 | ||
+ | }} | ||
+ | }} | ||
+ | |||
+ | == Die == | ||
+ | {{see also|ibm/microarchitectures/power9#Die|l1=POWER9 § Die}} | ||
+ | A die shot of IBM's [[22-core]] server microprocessor used in this part: | ||
+ | |||
+ | : [[File:power9 so die.png|500px]] | ||
+ | |||
+ | |||
+ | : [[File:power9 so die (annotated).png|500px]] |
Latest revision as of 16:25, 18 September 2022
Edit Values | |
02CY415 | |
General Info | |
Designer | IBM |
Manufacturer | GlobalFoundries |
Model Number | 02CY415 |
Part Number | 02CY415 |
Market | Server, Workstation |
Introduction | November, 2017 (announced) November, 2017 (launched) |
General Specs | |
Family | POWER |
Series | POWER9 |
Frequency | 2.40 GHz |
Turbo Frequency | 3.80 GHz |
Microarchitecture | |
ISA | Power ISA v3.0B (Power ISA) |
Microarchitecture | POWER9 |
Core Name | Sforza |
Process | 14 nm |
Transistors | 8,000,000,000 |
Technology | CMOS |
Die | 693.37 mm² 25.228 mm × 27.48416 mm |
Word Size | 64 bit |
Cores | 20 |
Threads | 80 |
Max Memory | 2 TiB |
Multiprocessing | |
Max SMP | 2-Way (Multiprocessor) |
Electrical | |
TDP | 160 W |
Tjunction | 0 °C – 85 °C |
Packaging | |
Package | FCLGA-2601 (PLGA) |
Dimension | 50 mm × 50 mm |
Pitch | 1.016 mm |
Contacts | 2601 |
POWER9 02CY415 is a 20-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY415 has a base frequency of 2.40 GHz with a bost frequency of 3.80 GHz and a TDP of 160 W.
Contents
Cache[edit]
- Main article: POWER9 § Cache
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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
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Integrated Memory Controller
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[Edit] Memory Configurations | |
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Configuration | Speed |
One DIMM per channel | 2666 MHz |
Two DIMMs per channel | 2400 MHz |
Expansions[edit]
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Expansion Options |
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Die[edit]
- See also: POWER9 § Die
A die shot of IBM's 22-core server microprocessor used in this part:
Facts about "POWER9 02CY415 - IBM"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | POWER9 02CY415 - IBM#pcie + |
base frequency | 2,400 MHz (2.4 GHz, 2,400,000 kHz) + |
core count | 20 + |
core name | Sforza + |
designer | IBM + |
die area | 693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) + |
die length | 25.228 mm (2.523 cm, 0.993 in, 25,228 µm) + |
die width | 27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) + |
family | POWER + |
first announced | November 2017 + |
first launched | November 2017 + |
full page name | ibm/power/02cy415 + |
has ecc memory support | false + |
instance of | microprocessor + |
isa | Power ISA v3.0B + |
isa family | Power ISA + |
l1$ size | 1,280 KiB (1,310,720 B, 1.25 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 640 KiB (655,360 B, 0.625 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 640 KiB (655,360 B, 0.625 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 5 MiB (5,120 KiB, 5,242,880 B, 0.00488 GiB) + |
l3$ description | 20-way set associative + |
l3$ size | 100 MiB (102,400 KiB, 104,857,600 B, 0.0977 GiB) + |
ldate | November 2017 + |
manufacturer | GlobalFoundries + |
market segment | Server + and Workstation + |
max cpu count | 2 + |
max junction temperature | 358.15 K (85 °C, 185 °F, 644.67 °R) + |
max memory | 2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) + |
max memory bandwidth | 158.95 GiB/s (162,764.8 MiB/s, 170.671 GB/s, 170,671.263 MB/s, 0.155 TiB/s, 0.171 TB/s) + |
max memory channels | 8 + |
microarchitecture | POWER9 + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | 02CY415 + |
name | 02CY415 + |
package | FCLGA-2601 + |
part number | 02CY415 + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
series | POWER9 + |
smp max ways | 2 + |
supported memory type | DDR4-2666 + |
tdp | 160 W (160,000 mW, 0.215 hp, 0.16 kW) + |
technology | CMOS + |
thread count | 80 + |
transistor count | 8,000,000,000 + |
turbo frequency | 3,800 MHz (3.8 GHz, 3,800,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |