Semiconductor & Computer Engineering
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Information for "qualcomm/msm6xxx"
Basic information
| Display title | MSM6xxx - Qualcomm |
| Default sort key | qualcomm/msm6xxx |
| Page length (in bytes) | 7,365 |
| Page ID | 11361 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 2 |
| Counted as a content page | Yes |
| Number of subpages of this page | 22 (0 redirects; 22 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | David (talk | contribs) |
| Date of page creation | 18:52, 19 November 2016 |
| Latest editor | 46.138.151.193 (talk) |
| Date of latest edit | 09:40, 4 October 2025 |
| Total number of edits | 25 |
| Total number of distinct authors | 3 |
| Recent number of edits (within past 90 days) | 1 |
| Recent number of distinct authors | 1 |
Page properties
| Transcluded templates (7) | Templates used on this page:
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Facts about "MSM6xxx - Qualcomm"
| designer | Qualcomm + and ARM Holdings + |
| first announced | March 20, 2001 + |
| first launched | 2002 + |
| full page name | qualcomm/msm6xxx + |
| instance of | system on a chip family + |
| instruction set architecture | ARMv4 + and ARMv5 + |
| main designer | Qualcomm + |
| manufacturer | TSMC + and IBM + |
| microarchitecture | ARM7TDMI + and ARM926EJ-S + |
| name | Qualcomm MSM6xxx + |
| package | FBGA-208 +, CSP-225 +, CSP-351 + and CSP-409 + |
| process | 250 nm (0.25 μm, 2.5e-4 mm) +, 180 nm (0.18 μm, 1.8e-4 mm) +, 130 nm (0.13 μm, 1.3e-4 mm) +, 90 nm (0.09 μm, 9.0e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) + |
| technology | CMOS + |
| word size | 32 bit (4 octets, 8 nibbles) + |