Semiconductor & Computer Engineering
From WikiChip
Information for "amd/packages/ft1"
Basic information
| Display title | Package FT1 - AMD |
| Default sort key | Package FT1, AMD |
| Page length (in bytes) | 14,477 |
| Page ID | 36174 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Number of subpages of this page | 0 (0 redirects; 0 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | QuietRub (talk | contribs) |
| Date of page creation | 06:12, 22 July 2020 |
| Latest editor | 95.24.58.111 (talk) |
| Date of latest edit | 12:51, 7 October 2025 |
| Total number of edits | 4 |
| Total number of distinct authors | 2 |
| Recent number of edits (within past 90 days) | 1 |
| Recent number of distinct authors | 1 |
Page properties
| Transcluded templates (18) | Templates used on this page:
|
Facts about "Package FT1 - AMD"
| designer | AMD + |
| first launched | January 4, 2011 + |
| instance of | package + |
| market segment | Mobile + and Embedded + |
| microarchitecture | Bobcat + |
| name | Package FT1 + |
| package | BGA-413 + and UOB-413 + |
| package contacts | 413 + |
| package height | 1.92 mm (0.0756 in) + |
| package length | 19 mm (1.9 cm, 0.748 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | FC-OBGA + |
| package width | 19 mm (1.9 cm, 0.748 in) + |
| tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |