Semiconductor & Computer Engineering
From WikiChip
Information for "amd/packages/asb1"
Basic information
| Display title | Package ASB1 - AMD |
| Default sort key | Package ASB1, AMD |
| Page length (in bytes) | 3,565 |
| Page ID | 36161 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Number of subpages of this page | 0 (0 redirects; 0 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | QuietRub (talk | contribs) |
| Date of page creation | 15:45, 20 July 2020 |
| Latest editor | QuietRub (talk | contribs) |
| Date of latest edit | 15:24, 16 March 2023 |
| Total number of edits | 2 |
| Total number of distinct authors | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Page properties
| Transcluded templates (10) | Templates used on this page:
|
Facts about "Package ASB1 - AMD"
| designer | AMD + |
| first launched | January 8, 2009 + |
| instance of | package + |
| market segment | Mobile + |
| microarchitecture | K8 + |
| name | ASB1 + |
| package | ASB1 + |
| package contacts | 812 + |
| package length | 27 mm (2.7 cm, 1.063 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | Organic Micro Ball Grid Array + |
| package width | 27 mm (2.7 cm, 1.063 in) + |
| tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |